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La ricerca find articoli where soggetti phrase all words 'electronic packaging' sort by level,fasc_key/DESCEND, pagina_ini_num/ASCEND ha restituito 75 riferimenti
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    1. Watson, SP; Murray, BT; Sammakia, BG
      Computational parameter study of chip scale package array cooling

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    2. Sundararaman, V; Sitaraman, SK
      Interfacial fracture toughness for delamination growth prediction in a novel peripheral away package

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    3. Wakil, JA; Ho, PS
      Simulating package behavior under power dissipation using uniform thermal loading

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    4. Ohguchi, K; Sasaki, K
      Description of temperature dependence and creep deformation of 60 Sn-40Pb solder alloys

      JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING
    5. Gopinath, D; Joshi, YK; Azarm, S
      Multi-objective placement optimization of power electronic devices on liquid cooled heat sinks

      SEVENTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2001
    6. Xie, MR; Wang, ZG; Zhao, YF
      Synthesis and properties of a novel, liquid, trifunctional, cycloaliphaticepoxide

      JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY
    7. Kim, BG; Dong, SL; Park, SD
      Effects of thermal processing on thermal expansion coefficient of a 50 vol.% SiCP/Al composite

      MATERIALS CHEMISTRY AND PHYSICS
    8. Choi, JW; Oh, TS
      Peel strength and peel angle measured by the T-peel test on Cr/BPDA-PDA interfaces

      JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
    9. Miller, MR; Mohammed, I; Ho, PS
      Quantitative strain analysis of flip-chip electronic packages using phase-shifting moire interferometry

      OPTICS AND LASERS IN ENGINEERING
    10. Salbut, L; Kujawinska, M
      The optical measurement station for complex testing of microelements

      OPTICS AND LASERS IN ENGINEERING
    11. Feng, YY; Wu, LZ
      Analysis of interfacial thermal stresses of chip-substrate structure

      INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES
    12. Ikeda, T; Arase, I; Ueno, Y; Miyazaki, N
      Strength evaluation of electronic plastic packages using stress intensity factors of v-notch

      CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES
    13. Hasselman, DPH; Donaldson, KY; Barlow, FD; Elshabini, AA; Schiroky, GH; Yaskoff, JP; Dietz, RL
      Interfacial thermal resistance and temperature dependence of three adhesives for electronic packaging

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    14. Wakil, J; Ho, PS
      Nonuniform temperature and strain fields in a powered package

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    15. Dai, X; Brillhart, MV; Ho, PS
      Adhesion measurement for electronic packaging applications using double cantilever beam method

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    16. Dai, XS; Brillhart, MV; Roesch, M; Ho, PS
      Adhesion and toughening mechanisms at underfill interfaces for flip-chip-on-organic-substrate packaging

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    17. Ktata, FM; Arz, U; Grabinski, H
      Broadband modeling and measurement of the signal behavior in S/390 MCM packages

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    18. Mercado, LL; Sarihan, V; Guo, YF; Mawer, A
      Impact of solder pad size on solder joint reliability in flip chip PBGA packages

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    19. Chen, KY; Brown, WD; Schaper, LW; Ang, SS; Naseem, HA
      A study of the high frequency performance of thin film capacitors for electronic packaging

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    20. Lee, SB; Park, TS; Ham, SJ
      Experimental techniques for fatigue reliability of BGA solder bumps in electronic packaging

      JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING
    21. Sealing, CS; Dasgupta, A
      Accelerated stress testing and health monitoring of laminated circuit cardassemblies using piezoelectric actuators and sensors

      JOURNAL OF REINFORCED PLASTICS AND COMPOSITES
    22. Zhao, Y; Basaran, C; Cartwright, A; Dishongh, T
      Thermomechanical behavior of micron scale solder joints under dynamic loads

      MECHANICS OF MATERIALS
    23. Kishimoto, S; Xie, HM; Shinya, N
      Electron moire method and its application to micro-deformation measurement

      OPTICS AND LASERS IN ENGINEERING
    24. Tsujino, J; Yoshihara, H; Sano, T; Ihara, S
      High-frequency ultrasonic wire bonding systems

      ULTRASONICS
    25. Rimdusit, S; Ishida, H
      Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins

      POLYMER
    26. Yu, SZ; Hing, P
      Dynamic mechanical properties of polystyrene-aluminum nitride composite

      JOURNAL OF APPLIED POLYMER SCIENCE
    27. Xie, HM; Chai, GB; Asundi, A; Jin, Y; Lu, YG; Ngoi, BKA; Zhong, ZW
      Thermal deformation measurement of electronic package using advanced moiremethods

      PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE
    28. Gladkov, A; Bar-Cohen, A
      Parametric dependence of fatigue of electronic adhesives

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    29. Lin, W; Lee, YC
      Study of fluxless soldering using formic acid vapor

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    30. Suhir, E
      Adhesively bonded assemblies with identical nondeformable adherends: modeling of the induced thermal stresses in the adhesive layer

      COMPOSITE INTERFACES
    31. Huang, MT; Ishida, H
      Investigation of the boron nitride/polybenzoxazine interphase

      JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS
    32. Nicoletto, G; Pirondi, A; Cova, P
      Accelerated life testing and thermomechanical simulation in power electronic device development

      JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN
    33. Wagner, GD
      History of electronic packaging at APL: From the VT fuze to the NEAR spacecraft

      JOHNS HOPKINS APL TECHNICAL DIGEST
    34. Bevan, MG; Romenesko, BM
      Modern electronic packaging technology

      JOHNS HOPKINS APL TECHNICAL DIGEST
    35. Clatterbaugh, GV; Vichot, P; Charles, HK
      Some key issues in microelectronic packaging

      JOHNS HOPKINS APL TECHNICAL DIGEST
    36. Blum, NA; Charles, HK; Francomacaro, AS
      Multichip module substrates

      JOHNS HOPKINS APL TECHNICAL DIGEST
    37. Mehoke, DS; Feldmesser, HS; Grimm, PD
      System-level packaging: Putting it all together

      JOHNS HOPKINS APL TECHNICAL DIGEST
    38. Charles, HK
      APL's packaging future: The next few years

      JOHNS HOPKINS APL TECHNICAL DIGEST
    39. Tyler, SG; Young, TP
      Packaging, interconnect and the systems integrator

      GEC REVIEW
    40. Wang, YX; Chen, X
      Effect of rapid thermal annealing on Ti-AlN interfaces

      APPLIED SURFACE SCIENCE
    41. Basaran, C; Zhao, Y
      Closed form vs. finite element analysis of laminated stacks

      FINITE ELEMENTS IN ANALYSIS AND DESIGN
    42. Wong, CP; Bollampally, RS
      Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging

      JOURNAL OF APPLIED POLYMER SCIENCE
    43. Liang, T; Pla, JA; Aaen, PH; Mahalingam, M
      Equivalent-circuit modeling and verification of metal-ceramic packages forRF and microwave power transistors

      IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
    44. You, YG; Palusinski, OA; Szidarovszky, F
      New matrix algorithm for calculating diagonally matched impedance of packaging interconnecting lines

      IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
    45. KIM KS; KIM WT; LEE KB
      COOLING CHARACTERISTICS ON THE FORCED-CONVECTION OF AN ARRAY OF FLAT-FORM ELECTRONIC COMPONENTS IN CHANNEL FLOW

      KSME INTERNATIONAL JOURNAL
    46. NIELSEN MC; KIM JY; RYMASZEWSKI EJ; LU TM; BAKHRU H
      COMPOSITE AND MULTILAYERED TAOX-TIOY HIGH DIELECTRIC-CONSTANT THIN-FILMS

      IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
    47. KATOPIS GA; BECKER WD
      S 390 COST PERFORMANCE CONSIDERATIONS FOR MCM PACKAGING CHOICES/

      IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
    48. BACKER WD; ECKHARDT J; FRECH RW; KATOPIS GA; KLINK E; MCALLISTER MF; MCNAMARA TG; MUENCH P; RICHTER SR; SMITH HH
      MODELING, SIMULATION, AND MEASUREMENT OF MID-FREQUENCY SIMULTANEOUS SWITCHING NOISE IN COMPUTER-SYSTEMS

      IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
    49. TAN Q; ZHANG WG; SCHAIBLE B; BOND LJ; JU TH; LEE YC
      THERMOSONIC FLIP-CHIP BONDING USING LONGITUDINAL ULTRASONIC VIBRATION

      IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
    50. DESAI CS; BASARAN C; DISHONGH T; PRINCE JL
      THERMOMECHANICAL ANALYSIS IN ELECTRONIC PACKAGING WITH UNIFIED CONSTITUTIVE MODEL FOR MATERIALS AND JOINTS

      IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
    51. MCCLUSKEY FP; HAKIM EB; FINK J; FOWLER A; PECHT MG
      RELIABILITY ASSESSMENT OF ELECTRONIC COMPONENTS EXPOSED TO LONG-TERM NON-OPERATING CONDITIONS

      IEEE transactions on components, packaging, and manufacturing technology. Part A
    52. HASSELMAN DPH; DONALDSON KY
      ON THE POSITIVE TEMPERATURE-DEPENDENCE OF THE THERMAL-CONDUCTIVITY OFA DIAMOND-BASED HEAT SINK PASTE

      IEEE transactions on components, packaging, and manufacturing technology. Part A
    53. HE XY; ZOU DQ; LIU S
      PHASE-SHIFTING ANALYSIS IN MOIRE INTERFEROMETRY AND ITS APPLICATIONS IN ELECTRONIC PACKAGING

      Optical engineering
    54. ISHIDA H; RIMDUSIT S
      VERY HIGH THERMAL-CONDUCTIVITY OBTAINED BY BORON NITRIDE-FILLED POLYBENZOXAZINE

      Thermochimica acta
    55. McCluskey, P; Lilie, F; Beysser, O; Gallo, A
      Low temperature delamination of plastic encapsulated microcircuits

      MICROELECTRONICS AND RELIABILITY
    56. HAN B
      RECENT ADVANCEMENTS OF MOIRE AND MICROSCOPIC MOIRE INTERFEROMETRY FORTHERMAL DEFORMATION ANALYSES OF MICROELECTRONICS DEVICES

      Experimental mechanics
    57. LIN L; PRINCE JL
      SSO NOISE ELECTRICAL PERFORMANCE LIMITATIONS FOR PQFP PACKAGES

      IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
    58. OMER A; FLINT A
      TESTABILITY AND SIGNAL INTEGRITY IN A LOW-COST MULTICHIP-MODULE

      IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
    59. CHEN K; NIELSEN M; SOSS S; RYMASZEWSKI EJ; LU TM; WAN CT
      STUDY OF TANTALUM OXIDE THIN-FILM CAPACITORS ON METALLIZED POLYMER SHEETS FOR ADVANCED PACKAGING APPLICATIONS

      IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
    60. BASARAN C; CHANDAROY R
      FINITE-ELEMENT SIMULATION OF THE TEMPERATURE CYCLING TESTS

      IEEE transactions on components, packaging, and manufacturing technology. Part A
    61. GRAY KJ; FABIS PM
      DESIGN-TO-IMPLEMENTATION CASE-STUDIES OF CVD DIAMOND IN RF MICROWAVE PACKAGE AND DETECTOR APPLICATIONS/

      DIAMOND AND RELATED MATERIALS
    62. QING XL; WANG GT; DAI FL
      STUDY OF THERMAL DEFORMATION OF MICROELECTRONICS PACKAGING PRODUCT BYINTERFEROMETRIC-TECHNIQUE

      Acta Mechanica Sinica
    63. KENNER VH; HARPER BD; ITKIN VY
      STRESS-RELAXATION IN MOLDING COMPOUNDS

      Journal of electronic materials
    64. LU X; XU G
      THERMALLY CONDUCTIVE POLYMER COMPOSITES FOR ELECTRONIC PACKAGING

      Journal of applied polymer science
    65. POLYCARPOU AC; TIRKAS PA; BALANIS CA
      THE FINITE-ELEMENT METHOD FOR MODELING CIRCUITS AND INTERCONNECTS FORELECTRONIC PACKAGING

      IEEE transactions on microwave theory and techniques
    66. CHEN YC; HARMS P; MITTRA R; BEYENE WT
      AN FDTD-TOUCHSTONE HYBRID TECHNIQUE FOR EQUIVALENT-CIRCUIT MODELING OF SOP ELECTRONIC PACKAGES

      IEEE transactions on microwave theory and techniques
    67. LOOS JS
      LEADLESS 432-PIN PACKAGE AND SOLDERLESS SOCKET USED IN A SYSTEM OPERATING WITH A 622 MHZ DIGITAL CLOCK

      IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
    68. STERN JM; LARCOMBE SP; IVEY PA; SEED L; SHELLEY AJ; GOODENOUGH NJ
      DESIGN AND EVALUATION OF AN EPOXY 3-DIMENSIONAL MULTICHIP-MODULE

      IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
    69. STITELER MR; UME IC; LEUTZ B
      IN-PROCESS BOARD WARPAGE MEASUREMENT IN A LAB SCALE WAVE SOLDERING OVEN

      IEEE transactions on components, packaging, and manufacturing technology. Part A
    70. HAN BT; GUO YF
      DETERMINATION OF AN EFFECTIVE COEFFICIENT OF THERMAL-EXPANSION OF ELECTRONIC PACKAGING COMPONENTS - A WHOLE-FIELD APPROACH

      IEEE transactions on components, packaging, and manufacturing technology. Part A
    71. YANG W; MESSLER RW; FELTON LE
      LASER-BEAM SOLDERING BEHAVIOR OF EUTECTIC SN-AG SOLDER

      Welding journal
    72. CHIN SW; RAJAN SD; NAGARAJ BK; MAHALINGAM M
      AUTOMATED DESIGN TOOL FOR EXAMINING MICROELECTRONIC PACKAGING DESIGN ALTERNATIVES

      IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
    73. FUERSCHBACH PW; CIESLAK MJ
      RESTRAINT EFFECTS IN LASER-WELDING OF AN ALUMINUM MMC

      IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
    74. HSU PC; ROZENBLIT JW
      A COMPUTER-AIDED-DESIGN FRAMEWORK FOR MODELING AND SIMULATION OF VLSIINTERCONNECTIONS AND PACKAGING

      Integration
    75. LIU YS; COLE HS; GUIDA R
      LASER ABLATION OF POLYMERS FOR HIGH-DENSITY INTERCONNECT

      Microelectronic engineering


ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 03/08/20 alle ore 17:28:00