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La ricerca find articoli where soggetti phrase all words 'SOLDERS' sort by level,fasc_key/DESCEND, pagina_ini_num/ASCEND ha restituito 103 riferimenti
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    1. Liu, PL; Shang, JK
      Interfacial segregation of bismuth in copper/tin-bismuth solder interconnect

      SCRIPTA MATERIALIA
    2. Ghosh, G
      Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizationsin solder joints

      ACTA MATERIALIA
    3. Suganuma, K
      Advances in lead-free electronics soldering

      CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE
    4. Huh, SH; Kim, KS; Suganuma, K
      Effect of Ag addition on the microstructural and mechanical properties of Sn-Cu eutectic solder

      MATERIALS TRANSACTIONS
    5. Choi, WK; Yoon, SW; Lee, HM
      Effect of in addition on Sn-3.5Ag solder and joint with Cu substrate

      MATERIALS TRANSACTIONS
    6. Hirose, A; Fujii, T; Imamura, T; Kobayashi, KF
      Influence of interfacial reaction on reliability of QFP joints with Sn-Ag based Pb free solders

      MATERIALS TRANSACTIONS
    7. McNally, KM; Sorg, BS; Hammer, DX; Heintzelman, DL; Hodges, DE; Welch, AJ
      Improved vascular tissue fusion using new light-activated surgical adhesive on a canine model

      JOURNAL OF BIOMEDICAL OPTICS
    8. Moser, Z; Gasior, W; Pstrus, J
      Surface tension of liquid Ag-Sn alloys: Experiment versus modeling

      JOURNAL OF PHASE EQUILIBRIA
    9. Choi, S; Lee, JG; Guo, F; Bieler, TR; Subramanian, KN; Lucas, JP
      Creep properties of Sn-Ag solder joints containing intermetallic particles

      JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY
    10. Frear, DR; Jang, JW; Lin, JK; Zhang, C
      Pb-free solders for flip-chip interconnects

      JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY
    11. Chen, JK; Beraun, JE; Tzou, DY
      A dual-phase-lag diffusion model for predicting intermetallic compound layer growth in solder joints

      JOURNAL OF ELECTRONIC PACKAGING
    12. Guo, F; Lucas, JP; Subramanian, KN
      Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints

      JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
    13. Choi, S; Bieler, TR; Subramanian, KN; Lucas, JP
      Effects of Pb contamination on the eutectic Sn-Ag solder joint

      SOLDERING & SURFACE MOUNT TECHNOLOGY
    14. Guo, F; Choi, S; Lucas, JP; Subramanian, KN
      Microstructural characterisation of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite solders

      SOLDERING & SURFACE MOUNT TECHNOLOGY
    15. Sabbar, A; El Hajjaji, S; Ben Bachir, A; Alaoui-El Belghiti, M; Zrineh, A
      Evaluation of corrosion behaviour of a new class of Pb-free solder materials (Sn-In-Zn)

      MATERIALS AND CORROSION-WERKSTOFFE UND KORROSION
    16. Suganuma, K; Huh, SH; Kim, K; Nakase, H; Nakamura, Y
      Effect of Ag content on properties of Sn-Ag binary alloy solder

      MATERIALS TRANSACTIONS JIM
    17. Ahat, S; Sheng, M; Luo, L
      Effects of static thermal aging and thermal cycling on the microstructure and shear strength of Sn95.5Ag3.8Cu0.7 solder joints

      JOURNAL OF MATERIALS RESEARCH
    18. Lin, KL; Hsu, HM
      Sn-Zn-AlPb-free solder - An inherent barrier solder for Cu contact

      JOURNAL OF ELECTRONIC MATERIALS
    19. Guo, F; Lee, J; Choi, S; Lucas, JP; Bieler, TR; Subramanian, KN
      Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles

      JOURNAL OF ELECTRONIC MATERIALS
    20. Liu, XJ; Liu, HS; Ohnuma, I; Kainuma, R; Ishida, K; Itabashi, S; Kameda, K; Yamaguchi, K
      Experimental determination and thermodynamic calculation of the phase equilibria in the Cu-In-Sn system

      JOURNAL OF ELECTRONIC MATERIALS
    21. Moser, Z; Gasior, W; Pstrus, J
      Surface tension measurements of the Bi-Sn and Sn-Bi-Ag liquid alloys

      JOURNAL OF ELECTRONIC MATERIALS
    22. Chen, SW; Yen, YW
      Interfacial reactions in the Sn-Ag/Au couples

      JOURNAL OF ELECTRONIC MATERIALS
    23. Ghosh, G; Pfeifer, MJ
      Interfacial reactions between a Pb-free solder and die backside metallizations

      JOURNAL OF ELECTRONIC MATERIALS
    24. Liu, CM; Ho, CE; Chen, WT; Kao, CR
      Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solderon Au/Ni surface finish

      JOURNAL OF ELECTRONIC MATERIALS
    25. Plumbridge, WJ; Gagg, CR; Peters, S
      The creep of lead-free solders at elevated temperatures

      JOURNAL OF ELECTRONIC MATERIALS
    26. Cook, BA; Anderson, LE; Harringa, JL; Terpstra, RL; Foley, JC; Unal, O; Laabs, FC
      Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests

      JOURNAL OF ELECTRONIC MATERIALS
    27. Guo, F; Lee, J; Lucas, JP; Subramanian, KN; Bieler, TR
      Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particles

      JOURNAL OF ELECTRONIC MATERIALS
    28. Young, CC; Duh, JG; Tsai, SY
      Microstructural evolution in the Sn-Cu-Ni and Pb-Sn solder joints with Cu and Pt-Ag metallized Al2O3 substrate

      JOURNAL OF ELECTRONIC MATERIALS
    29. Chuang, TH; Huang, YT; Tsao, LC
      AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint under thermal aging

      JOURNAL OF ELECTRONIC MATERIALS
    30. Zuruzi, AS; Lahiri, SK; Burman, P; Siow, KS
      Correlation between intermetallic thickness and roughness during solder reflow

      JOURNAL OF ELECTRONIC MATERIALS
    31. Ahat, S; Sheng, M; Luo, L
      Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging

      JOURNAL OF ELECTRONIC MATERIALS
    32. Moon, KW; Boettinger, WJ; Kattner, UR; Handwerker, CA; Lee, DJ
      The effect of Pb contamination on the solidification behavior of Sn-Bi solders

      JOURNAL OF ELECTRONIC MATERIALS
    33. Miao, HW; Duh, JG
      Microstructure evolution in Sn-Bi and Sn-Bi-Cu solder joints under thermalaging

      MATERIALS CHEMISTRY AND PHYSICS
    34. Trifonova, AV; Momchilov, AA; Puresheva, BL; Abrahams, I
      Electrochemical lithium intercalation in lead-tin-aluminium solder

      SOLID STATE IONICS
    35. Dobersek, M
      Influence of indium addition on the AgCu25Zn20Cd20 alloy microstructure

      KOVOVE MATERIALY-METALLIC MATERIALS
    36. Chen, CM; Chen, SW
      Electromigration effect upon the Sn-0.7 wt% Cu/Ni and Sn-3.5 wt% Ag/Ni interfacial reactions

      JOURNAL OF APPLIED PHYSICS
    37. Dreyer, W; Muller, WH
      Modeling diffusional coarsening in eutectic tin/lead solders: a quantitative approach

      INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES
    38. So, WW; Lee, CC
      Fluxless process of fabricating In-Au joints on copper substrates

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    39. Poon, NM; Wu, CML; Lai, JKL; Chan, YC
      Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    40. Plumbridge, WJ; Gagg, CR
      The mechanical properties of lead-containing and lead-free solders - meeting the environmental challenge

      PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS
    41. McCabe, RJ; Fine, ME
      The creep properties of precipitation-strengthened tin-based alloys

      JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY
    42. Zhu, QN; Sheng, M; Luo, L
      The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

      SOLDERING & SURFACE MOUNT TECHNOLOGY
    43. Abtew, M; Selvaduray, G
      Lead-free solders in microelectronics

      MATERIALS SCIENCE & ENGINEERING R-REPORTS
    44. Martins, R; Ferreira, J; Goncalves, C; Nunes, P; Fortunato, E; Marvao, AP; Martins, JI
      Role of soldering parameters on the electrical performances presented by Cu-Sn-Cu joints used in power diodes

      MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
    45. Reyburn, B; Corbin, S
      Monitoring transient liquid phase sintering of Cu-Sn alloys by thermal analysis

      INTERNATIONAL JOURNAL OF POWDER METALLURGY
    46. Suganuma, K; Murata, T; Noguchi, H; Toyoda, Y
      Heat resistance of Sn-9Zn solder/Cu interface with or without coating

      JOURNAL OF MATERIALS RESEARCH
    47. Ahat, S; Du, LG; Sheng, M; Luo, L; Kempe, W; Freytag, J
      Effect of aging on the microstructure and shear strength of SnPbAg/Ni-P/Cuand SnAg/Ni-P/Cu solder joints

      JOURNAL OF ELECTRONIC MATERIALS
    48. Ohnuma, I; Cui, Y; Liu, XJ; Inohana, Y; Ishihara, S; Ohtani, H; Kainuma, R; Ishida, K
      Phase equilibria of Sn-In based micro-soldering alloys

      JOURNAL OF ELECTRONIC MATERIALS
    49. Ohnuma, I; Miyashita, M; Anzai, K; Liu, XJ; Ohtani, H; Kainuma, R; Ishida, K
      Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys

      JOURNAL OF ELECTRONIC MATERIALS
    50. Choi, WK; Lee, HM
      Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate

      JOURNAL OF ELECTRONIC MATERIALS
    51. Guo, F; Choi, S; Lucas, JP; Subramanian, KN
      Effects of reflow on wettability, microstructure and mechanical propertiesin lead-free solders

      JOURNAL OF ELECTRONIC MATERIALS
    52. Foley, JC; Gickler, A; Leprevost, FH; Brown, D
      Analysis of ring and plug shear strengths for comparison of lead-free solders

      JOURNAL OF ELECTRONIC MATERIALS
    53. Kang, SK; Buchwalter, S; Tsang, C
      Characterization of electroplated bismuth-tin alloys for electrically conducting materials

      JOURNAL OF ELECTRONIC MATERIALS
    54. So, WW; Choe, S; Chuang, R; Lee, CC
      An effective diffusion barrier metallization process on copper

      THIN SOLID FILMS
    55. Chen, CJ; Lin, KL
      Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum

      THIN SOLID FILMS
    56. Sun, W; Ivey, DG
      Development of an electroplating solution for codepositing Au-Sn alloys

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    57. Yoon, SW; Moon, JT; Hong, SH; Park, CJ; Koh, YH; Kim, YH
      A study on reliability of UBM systems for LF-CSP package

      JOURNAL OF THE KOREAN PHYSICAL SOCIETY
    58. Korhonen, TM; Su, P; Hong, SJ; Korhonen, MA; Li, CY
      Development of under bump metallizations for flip chip bonding to organic substrates

      JOURNAL OF ELECTRONIC MATERIALS
    59. Ohnuma, I; Liu, XJ; Ohtani, H; Ishida, K
      Thermodynamic database for phase diagrams in micro-soldering alloys

      JOURNAL OF ELECTRONIC MATERIALS
    60. Chen, SW; Yen, YW
      Interfacial reactions in Ag-Sn/Cu couples

      JOURNAL OF ELECTRONIC MATERIALS
    61. Choi, WK; Lee, HM
      Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate

      JOURNAL OF ELECTRONIC MATERIALS
    62. Kariya, Y; Hirata, Y; Otsuka, M
      Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X = Bi and Cu) solder joints

      JOURNAL OF ELECTRONIC MATERIALS
    63. Kang, SK; Purushothaman, S
      Development of conducting adhesive materials for microelectronic applications

      JOURNAL OF ELECTRONIC MATERIALS
    64. Lee, MS; Liu, CM; Kao, CR
      Interfacial reactions between Ni substrate and the component Bi in solders

      JOURNAL OF ELECTRONIC MATERIALS
    65. Jacobson, DM; Sangha, SP; Hopkins, J
      Design rules for fluxless soldering

      GEC JOURNAL OF TECHNOLOGY
    66. SUGANUMA K; NIIHARA K; SHOUTOKU T; NAKAMURA Y
      WETTING AND INTERFACE MICROSTRUCTURE BETWEEN SN-ZN BINARY-ALLOYS AND CU

      Journal of materials research
    67. YOON SW; LEE HM
      A THERMODYNAMIC STUDY OF PHASE-EQUILIBRIA IN THE SN-BI-PB SOLDER SYSTEM

      Calphad
    68. LIN KL; WEN LH; LIU TP
      THE MICROSTRUCTURES OF THE SN-ZN-AL SOLDER ALLOYS

      Journal of electronic materials
    69. SCHAEFER M; FOURNELLE RA; LIANG J
      THEORY FOR INTERMETALLIC PHASE GROWTH BETWEEN CU AND LIQUID SN-PB SOLDER BASED ON GRAIN-BOUNDARY DIFFUSION CONTROL

      Journal of electronic materials
    70. ERICKSON KL; HOPKINS PL; VIANCO PT
      MODELING THE SOLID-STATE REACTION BETWEEN SN-PB SOLDER AND A POROUS SUBSTRATE COATING

      Journal of electronic materials
    71. KANG SK; PURUSHOTHAMAN S
      STUDY OF INTERFACIAL REACTIONS BETWEEN TIN AND COPPER BY DIFFERENTIALSCANNING CALORIMETRY

      Journal of electronic materials
    72. LIN KL; WANG YC
      WETTING INTERACTION OF PB-FREE SN-ZN-AL SOLDERS ON METAL PLATED SUBSTRATE

      Journal of electronic materials
    73. KARIYA Y; OTSUKA M
      MECHANICAL FATIGUE CHARACTERISTICS OF SN-3.5AG-X (X = BI, CU, ZN AND IN) SOLDER ALLOYS

      Journal of electronic materials
    74. Ghosh, G; Liu, ZK
      Modeling the atomic transport kinetics in high-lead solders

      JOURNAL OF ELECTRONIC MATERIALS
    75. LIN KL; LIU TP
      THE ELECTROCHEMICAL CORROSION BEHAVIOR OF PB-FREE AL-ZN-SN SOLDERS INNACL SOLUTION

      Materials chemistry and physics
    76. LIN KL; CHUNG FC; LIU TP
      THE POTENTIODYNAMIC POLARIZATION BEHAVIOR OF PB-FREE XIN-9(5AL-ZN)-YSN SOLDERS

      Materials chemistry and physics
    77. JACOBSON DM; HARRISON MR
      LEAD-FREE SOLDERING - A PROGRESS REPORT

      GEC JOURNAL OF TECHNOLOGY
    78. LEE BJ; HWANG NM; LEE HM
      PREDICTION OF INTERFACE REACTION-PRODUCTS BETWEEN CU AND VARIOUS SOLDER ALLOYS BY THERMODYNAMIC CALCULATION

      Acta materialia
    79. YOON SW; SOH JR; LEE HM; LEE BJ
      THERMODYNAMICS-AIDED ALLOY DESIGN AND EVALUATION OF PB-FREE SOLDER, SN-BI-IN-ZN SYSTEM

      Acta materialia
    80. MAVOORI H; CHIN J; VAYNMAN S; MORAN B; KEER L; FINE M
      CREEP, STRESS-RELAXATION, AND PLASTIC-DEFORMATION IN SN-AG AND SN-ZN EUTECTIC SOLDERS

      Journal of electronic materials
    81. FLANDERS DR; JACOBS EG; PINIZZOTTO RF
      ACTIVATION-ENERGIES OF INTERMETALLIC GROWTH OF SN-AG EUTECTIC SOLDER ON COPPER SUBSTRATES

      Journal of electronic materials
    82. DEMORTIER G
      ACCELERATOR-BASED ANALYSIS OF GOLD JEWELRY ITEMS AND EXPERIMENTAL ARCHAEOLOGY

      Annali di chimica
    83. LIANG J; GOLLHARDT N; LEE PS; SCHROEDER SA; MORRIS WL
      A STUDY OF FATIGUE AND CREEP-BEHAVIOR OF 4 HIGH-TEMPERATURE SOLDERS

      Fatigue & fracture of engineering materials & structures
    84. LIN KL; CHEN CJ
      THE INTERACTIONS BETWEEN IN-SN SOLDERS AND AN ELECTROLESS NI-P DEPOSIT UPON HEAT-TREATMENT

      Journal of materials science. Materials in electronics
    85. LEE BJ
      THERMODYNAMIC ASSESSMENTS OF THE SN-ZN AND IN-ZN BINARY-SYSTEMS

      Calphad
    86. KANG SK; RAI RS; PURUSHOTHAMAN S
      INTERFACIAL REACTIONS DURING SOLDERING WITH LEAD-TIN EUTECTIC AND LEAD (PB)-FREE, TIN-RICH SOLDERS

      Journal of electronic materials
    87. TU KN
      CU SN INTERFACIAL REACTIONS - THIN-FILM CASE VERSUS BULK CASE/

      Materials chemistry and physics
    88. DEMORTIER G
      ION-BEAM STUDIES OF ARCHAEOLOGICAL GOLD JEWELRY ITEMS

      Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms
    89. KOH T; SUGIMOTO T
      EXTRACTIVE SPECTROPHOTOMETRIC DETERMINATION OF SILVER(I) AT THE 10(-7) M LEVEL USING 1,10-PHENANTHROLINE AND TETRABROMOPHENOLPHTHALEIN ETHYL-ESTER

      Analytica chimica acta
    90. GLAZER J
      METALLURGY OF LOW-TEMPERATURE PB-FREE SOLDERS FOR ELECTRONIC ASSEMBLY

      International materials reviews
    91. JIN SH
      RESEARCH TOWARD LEAD-FREE AND FAILURE-FREE CIRCUIT INTERCONNECTIONS

      Journal of the Korean Physical Society
    92. YANG WG; FELTON LE; MESSLER RW
      THE EFFECT OF SOLDERING PROCESS VARIABLES ON THE MICROSTRUCTURE AND MECHANICAL-PROPERTIES OF EUTECTIC SN-AG CU SOLDER JOINTS/

      Journal of electronic materials
    93. MENOVSKY T; BEEK JF; THOMSEN SL
      LASER(-ASSISTED) NERVE REPAIR - A REVIEW

      Neurosurgical review
    94. JACOBSON DM; HUMPSTON G
      DEPRESSING THE MELTING-POINT OF SOLDERS AND BRAZES BY EUTECTIC ALLOYING

      GEC journal of research
    95. YANG W; MESSLER RW; FELTON LE
      LASER-BEAM SOLDERING BEHAVIOR OF EUTECTIC SN-AG SOLDER

      Welding journal
    96. MCCORMACK M; JIN S
      IMPROVED MECHANICAL-PROPERTIES IN NEW, PB-FREE SOLDER ALLOYS

      Journal of electronic materials
    97. LOOMANS ME; VAYNMAN S; GHOSH G; FINE ME
      INVESTIGATION OF MULTICOMPONENT LEAD-FREE SOLDERS

      Journal of electronic materials
    98. YANG W; MESSLER RW; FELTON LE
      MICROSTRUCTURE EVOLUTION OF EUTECTIC SN-AG SOLDER JOINTS

      Journal of electronic materials
    99. POWERS TA; SINGLER TJ; CLUM JA
      ROLE OF TIN CONTENT IN THE WETTING OF CU AND AU BY TIN-BISMUTH SOLDERS

      Journal of electronic materials
    100. GHOSH G; LOOMANS M; FINE ME
      AN INVESTIGATION OF PHASE-EQUILIBRIA OF THE BI-SB-SN SYSTEM

      Journal of electronic materials


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Documento generato il 06/08/20 alle ore 04:09:04