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La ricerca find articoli where soggetti phrase all words 'REACTIVE ION ETCHING' sort by level,fasc_key/DESCEND, pagina_ini_num/ASCEND ha restituito 248 riferimenti
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    1. Dewan, MNA; McNally, PJ; Perova, T; Herbert, PAF
      Use of plasma impedance monitoring for the determination of SF6 reactive ion etch process end points in a SiO2/Si system

      MATERIALS RESEARCH INNOVATIONS
    2. Rusu, C; van't Oever, R; de Boer, MJ; Jansen, HV; Berenschot, JW; Bennink, ML; Kanger, JS; de Grooth, BG; Elwenspoek, M; Greve, J; Brugger, J; van den Berg, A
      Direct integration of micromachined pipettes in a flow channel for single DNA molecule study by optical tweezers

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    3. Griss, P; Enoksson, P; Tolvanen-Laakso, HK; Merilainen, P; Ollmar, S; Stemme, G
      Micromachined electrodes for biopotential measurements

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    4. Stokes, D; May, GS
      Indirect adaptive control of reactive ion etching using neural networks

      IEEE TRANSACTIONS ON ROBOTICS AND AUTOMATION
    5. Su, GDJ; Toshiyoshi, H; Wu, MC
      Surface-micromachined 2-D optical scanners with high-performance single-crystalline silicon micromirrors

      IEEE PHOTONICS TECHNOLOGY LETTERS
    6. Piotrowski, TT; Piotrowska, A; Kaminska, E; Szopniewski, Z; Kolesnik, S; Wrobel, J; Gierlowski, P; Lewandowski, S
      Electron beam lithography and reactive ion etching of nanometer size features in niobium films

      MATERIALS SCIENCE & ENGINEERING C-BIOMIMETIC AND SUPRAMOLECULAR SYSTEMS
    7. Lyebyedyev, D; Schulz, H; Scheer, HC; Pfeiffer, K
      Characterisation of new thermosetting polymer materials for nanoimprint lithography

      MATERIALS SCIENCE & ENGINEERING C-BIOMIMETIC AND SUPRAMOLECULAR SYSTEMS
    8. Otterbach, R; Hilleringmann, U; Horstmann, JT; Goser, K
      Structures with a minimum feature size of less than 100 nm in CVD-diamond for sensor applications

      DIAMOND AND RELATED MATERIALS
    9. Grigaliunas, V; Kopustinskas, V; Meskinis, S; Margelevicius, M; Mikulskas, I; Tomasiunas, R
      Replication technology for photonic band gap applications

      OPTICAL MATERIALS
    10. London, AP; Ayon, AA; Epstein, AH; Spearing, SM; Harrison, T; Peles, Y; Kerrebrock, JL
      Microfabrication of a high pressure bipropellant rocket engine

      SENSORS AND ACTUATORS A-PHYSICAL
    11. Bayt, RL; Breuer, KS
      Analysis and testing of a silicon intrinsic-point heater in a micropropulsion application

      SENSORS AND ACTUATORS A-PHYSICAL
    12. Ayon, AA; Zhang, X; Khanna, R
      Anisotropic silicon trenches 300-500 mu m deep employing time multiplexed deep etching (TMDE)

      SENSORS AND ACTUATORS A-PHYSICAL
    13. Matsuura, T; Chabloz, M; Jiao, J; Yoshida, Y; Tsutsumi, K
      A method to evade silicon backside damage in deep reactive ion etching foranodically bonded glass-silicon structures

      SENSORS AND ACTUATORS A-PHYSICAL
    14. Aperathitis, E; Cengher, D; Kayambaki, M; Androulidaki, M; Deligeorgis, G; Tsagaraki, K; Hatzopoulous, Z; Georgakilas, A
      Evaluation of reactive ion etching processes for fabrication of integratedGaAs/AlGaAs optoelectronic devices

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    15. Yang, SC; Chiu, HC; Chien, FT; Chan, YJ; Kuo, JM
      RIE gate-recessed (Al0.3Ga0.7)(0.5)In0.5P/InGaAs double doped-channel FETsusing CHF3+BCl3 mixing plasma

      IEEE ELECTRON DEVICE LETTERS
    16. Aoyama, T; Okawa, S; Hattori, K; Hatate, H; Wada, Y; Uchiyama, K; Kagotani, T; Nishio, H; Sato, I
      Fabrication and magnetic properties of CoPt perpendicular patterned media

      JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS
    17. Naoe, M; Hamaya, K; Fujiwara, N; Taniyama, T; Kitamoto, Y; Yamazaki, Y
      Selective dry etching of manganite thin films for high sensitive magnetoresistive sensors

      JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS
    18. Mao, DS; Li, W; Wang, X; Liu, XH
      Diamond-like carbon films prepared by filtered are deposition for electronfield emission application

      SURFACE & COATINGS TECHNOLOGY
    19. Alkaisi, MM; Blaikie, RJ; McNab, SJ
      Low temperature nanoimprint lithography using silicon nitride molds

      MICROELECTRONIC ENGINEERING
    20. Rong, B; Reeves, RJ; Brown, SA; Alkaisi, MM; van der Drift, E; Cheung, R; Sloof, WG
      A study of reactive ion etching damage effects in GaN

      MICROELECTRONIC ENGINEERING
    21. Avary, K; Rennon, S; Klopf, F; Reithmaier, JP; Forchel, A
      Reactive ion etching of deeply etched DBR-structures with reduced air-gapsfor-highly reflective monolithically integrated laser mirrors

      MICROELECTRONIC ENGINEERING
    22. Hodgekinson, I; Wu, QH; Arnold, M; Blaikie, R
      Direct nanoengineering and lithographic patterning of optically anisotropic thin films

      MICROELECTRONIC ENGINEERING
    23. Peyrade, D; Chen, Y; Manin-Ferlazzo, L; Lebib, A; Grandjean, N; Coquillat, D; Legros, R; Lascaray, JP
      Fabrication of GaN photonic crystals for 400 nm wavelength

      MICROELECTRONIC ENGINEERING
    24. Lalinsky, T; Skriniarova, J; Kostic, I; van der Hart, A; Hrkut, P; Hascik, S; Matay, L; Mozolova, Z; Kordos, P
      T-shaped gates for heterostructure field effect transistors

      VACUUM
    25. Yamaguchi, T; Kato, H; Fujimura, N; Ito, T
      Annealing behavior of electrical properties in plasma-exposed Ti/p-Si interfaces

      THIN SOLID FILMS
    26. Marso, M; Wolter, M; Arens-Fischer, R; Luth, H
      Fabrication of laterally displaced porous silicon filters

      THIN SOLID FILMS
    27. Guo, L; Li, KC; Liu, DG; Ou, YH; Zhang, J; Yi, Q; Xu, SL
      Reactive ion etching of Si1-xGex alloy with hydrogen bromide

      JOURNAL OF CRYSTAL GROWTH
    28. Belas, E; Grill, R; Franc, J; Moravec, P; Varghova, R; Hoschl, P; Sitter, H; Toth, AL
      Dynamics of native point defects in H-2 and Ar plasma-etched narrow gap (HgCd)Te

      JOURNAL OF CRYSTAL GROWTH
    29. Aoyama, T; Uchiyama, K; Kagotani, T; Hattori, K; Wada, Y; Okawa, S; Hatate, H; Nishio, H; Sato, I
      Fabrication and properties of CoPt patterned media with perpendicular magnetic anisotropy

      IEEE TRANSACTIONS ON MAGNETICS
    30. Lee, HY; Kim, JW; Shin, K; Kim, ES; Chung, HB
      Amorphous-Si transmission gratings prepared by Ga+-focused-ion-beam milling and their polarization characteristics

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    31. Kang, JW; Kim, JS; Kim, JJ
      Optimized oxygen plasma etching of polycarbonate for low-loss optical waveguide fabrication

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    32. Yokoi, H; Waniishi, T; Mizumoto, T; Shimizu, M; Sakurai, K; Futakuchi, N; Nakano, Y
      Integration of terraced laser diode and garnet crystals by wafer direct bonding

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    33. Raj, MM; Wiedmann, J; Toyoshima, S; Saka, Y; Ebihara, K; Arai, S
      High-reflectivity semiconductor/benzocyclobutene Bragg reflector mirrors for GaInAsP/InP lasers

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    34. Ichimura, I; Kishima, K; Saito, K; Yamamoto, K; Kuroda, Y; Iida, A; Masuhara, S; Osato, K
      Near-field optical recording on a pre-grooved phase-change disk in the blue-violet

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    35. Kanoh, M; Yamage, M; Takada, H
      End-point detection of reactive ion etching by plasma impedance monitoring

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    36. Toyota, H; Takahara, K; Okano, M; Yotsuya, T; Kikuta, H
      Fabrication of microcone array for antireflection structured surface usingmetal dotted pattern

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    37. Kim, HC; Wiedmann, J; Matsui, K; Tamura, S; Arai, S
      1.5-mu m-wavelength distributed feedback lasers with deeply etched first-order vertical grating

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    38. Arens-Fischer, R; Kruger, M; Thonissen, M; Ganse, V; Hunkel, D; Marso, M; Luth, H
      Formation of porous silicon filter structures with different properties onsmall areas

      JOURNAL OF POROUS MATERIALS
    39. Tanabe, K; Umezawa, H; Tachiki, M; Kawarada, H
      Oxygen plasma etching of polycrystalline diamond

      NEW DIAMOND AND FRONTIER CARBON TECHNOLOGY
    40. Ayazi, F; Najafi, K
      High aspect-ratio combined poly and single-crystal silicon (HARPSS) MEMS technology

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    41. Oosterbroek, RE; Berenschot, JW; Jansen, HV; Nijdam, AJ; Pandraud, G; van den Berg, A; Elwenspoek, MC
      Etching methodologies in < 111 >-oriented silicon wafers

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    42. Partridge, A; Reynolds, JK; Chui, BW; Chow, EM; Fitzgerald, AM; Zhang, L; Maluf, NI; Kenney, TW
      A high-performance planar piezoresistive accelerometer

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    43. Jo, BH; Van Lerberghe, LM; Motsegood, KM; Beebe, DJ
      Three-dimensional micro-channel fabrication in polydimethylsiloxane (PDMS)elastomer

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    44. Cheung, R; Reeves, RJ; Brown, SA
      Process-induced defects and optical memory in gallium nitride

      DEFECTS AND DIFFUSION IN CERAMICS
    45. Rahman, M
      Damage in III-V semiconductors from very low-energy process plasmas

      DEFECTS AND DIFFUSION IN SEMICONDUCTORS
    46. Regnier, FE
      Microfabricated monolith columns for liquid chromatography - Sculpting supports for liquid chromatography

      HRC-JOURNAL OF HIGH RESOLUTION CHROMATOGRAPHY
    47. de Heij, B; van der Schoot, B; Bo, H; Hess, J; de Rooij, NF
      Characterisation of a fL droplet generator for inhalation drug therapy

      SENSORS AND ACTUATORS A-PHYSICAL
    48. Malinin, A; Ovchinnikov, V; Novikov, S; Tuovinen, C; Hovinen, A
      Fabrication of a silicon based electroluminescent device

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    49. Paskaleva, A; Atanassova, E
      Structural nature of the N-2 RIE plasma induced slow states and bulk trapsin thin SiO2-Si structures

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    50. Stokes, D; May, GS
      Real-time control of reactive ion etching using neural networks

      IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
    51. Moussant, C; Lucas, B; Moliton, A
      Etching techniques using a collimated ion beam for the realization of waveguides

      SYNTHETIC METALS
    52. Antoszewski, J; Musca, CA; Dell, JM; Faraone, L
      Characterization of Hg0.7Cd0.3Te n- on p-type structures obtained by reactive ion etching induced p- to n conversion

      JOURNAL OF ELECTRONIC MATERIALS
    53. Dell, JM; Antoszewski, J; Rais, MH; Musca, C; White, JK; Nener, BD; Faraone, L
      HgCdTe mid-wavelength IR photovoltaic detectors fabricated using plasma induced junction technology

      JOURNAL OF ELECTRONIC MATERIALS
    54. Smith, EPG; Musca, CA; Redfern, DA; Dell, JM; Faraone, L
      H-2-based dry plasma etching for mesa structuring of HgCdTe

      JOURNAL OF ELECTRONIC MATERIALS
    55. Fujimura, N; Yamaguchi, T; Kato, H; Ito, T
      Influence of reactive ion etching damage on the Schottky barrier height ofTi/p-Si interface

      APPLIED SURFACE SCIENCE
    56. Dreeskornfeld, L; Segler, R; Haindl, G; Wehmeyer, O; Rahn, S; Majkova, E; Kleineberg, U; Heinzmann, U; Hudek, P; Kostic, I
      Reactive ion etching with end point detection of microstructured Mo/Si multilayers by optical emission spectroscopy

      MICROELECTRONIC ENGINEERING
    57. Hascik, S; Hrkut, P; Kostic, I; Konecnikova, A
      Dry etching of carbon layers in various etch gases

      VACUUM
    58. Piotrowska, A; Kaminska, E; Piotrowski, TT; Guziewicz, M; Golaszewska, K; Papis, E; Wrobel, J; Perchuc, L
      Application of CCl2F2- and CCl4-based plasmas for RIE of GaSb and related materials

      VACUUM
    59. Rais, MH; Musca, CA; Dell, JM; Antoszewski, J; Nener, BD; Faraone, L
      HgCdTe photovoltaic detectors fabricated using a new junction formation technology

      MICROELECTRONICS JOURNAL
    60. Rais, MH; Musca, CA; Antoszewski, J; Dell, JM; Nener, BD; Faraone, L
      Characterisation of dark current in novel Hg1-xCdxTe mid-wavelength infrared photovoltaic detectors based on n-on-p junctions formed by plasma-induced type conversion

      JOURNAL OF CRYSTAL GROWTH
    61. Guo, QX; Matsuse, M; Nishio, M; Ogawa, H
      Reactive ion etching of indium nitride using CH4 and H-2 gases

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    62. Han, S; Yang, SA; Hwang, T; Lee, J; Lee, JD; Shin, H
      Lateral silicon field-emission devices using electron beam lithography

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    63. Awazu, K; Ishii, S; Shima, K
      Formation of individual holes in amorphous SiO2 by swift heavy-ion bombardment followed by wet and dry etching

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    64. Kumazaki, H; Yamada, Y; Oshima, T; Inaba, S; Hane, K
      Micromachining of optical fiber using reactive ion etching and its application

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    65. Saitoh, T; Sogawa, T; Notomi, M; Tamamura, T; Kodama, S; Furuta, T; Ando, H
      GaAs photonic crystals on SiO2 fabricated by very-high-frequency anode-coupled reactive ion etching and wafer bonding

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    66. Kashimura, S; Takeuchi, M; Maru, K; Okano, H
      Loss reduction of GeO2-doped silica waveguide with high refractive index difference by high-temperature annealing

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    67. Raj, MM; Wiedmann, J; Saka, Y; Ebihara, K; Arai, S
      Highly uniform 1.5 mu m wavelength deeply etched semiconductor/benzocyclobutene distributed Bragg reflector lasers

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    68. Sugihara, O; Tomiki, M; Fujimura, H; Egami, C; Okamoto, N; Akizuki, T; Shirai, H
      Heat-resistant polyarylates for waveguide-type device application

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    69. Schilling, A; Nussbaum, P; Ossmann, C; Traut, S; Rossi, M; Schift, H; Herzig, HP
      Miniaturized, focusing fan-out elements: design, fabrication and characterization

      JOURNAL OF OPTICS A-PURE AND APPLIED OPTICS
    70. Ishihara, K; Yung, CF; Ayon, AA; Schmidt, MA
      An inertial sensor technology using DRIE and wafer bonding with interconnecting capability

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    71. Lee, S; Park, S; Cho, D
      The surface/bulk micromachining (SBM) process: A new method for fabricating released MEMS in single crystal silicon

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    72. Yeh, JLA; Jiang, HR; Tien, NC
      Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    73. Mehra, A; Ayon, AA; Waitz, IA; Schmidt, MA
      Microfabrication of high-temperature silicon devices using wafer bonding and deep reactive ion etching

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    74. Schwank, M; Muller, U; Hauert, R; Rossi, R; Volkert, M; Wintermantel, E
      Production of a microelectrode for intracellular potential measurements based on a Pt Ir needle insulated with amorphous hydrogenated carbon

      SENSORS AND ACTUATORS B-CHEMICAL
    75. Ratier, B; Jeong, YS; Moliton, A; Audebert, P
      Vapor deposition polymerization and reactive ion beam etching of poly(p-xylylene) films for waveguide applications

      OPTICAL MATERIALS
    76. Gray, BL; Jaeggi, D; Mourlas, NJ; van Drieenhuizen, BP; Williams, KR; Maluf, NI; Kovacs, GTA
      Novel interconnection technologies for integrated microfluidic systems

      SENSORS AND ACTUATORS A-PHYSICAL
    77. Ayela, F; Chaussy, J; Fournier, T; Menegaz, E
      A micromachined actuator for nanopositioning in two dimensions

      SENSORS AND ACTUATORS A-PHYSICAL
    78. Sherman, F; Tung, S; Kim, CJ; Ho, CM; Woo, J
      Flow control by using high-aspect-ratio, in-plane microactuators

      SENSORS AND ACTUATORS A-PHYSICAL
    79. Ribayrol, A; Coquillat, D; De la Rue, RM; Murad, SK; Wilkinson, CDW; Girard, P; Briot, O; Aulombard, RL
      Fabrication and photoluminescence of GaN sapphire submicron-scale structures with nanometre scale resolution

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    80. Limanond, S; Si, J; Tseng, YL
      Production data based optimal etch time control design for a reactive ion etching process

      IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
    81. Breitschadel, O; Kuhn, B; Scholz, F; Schweizer, H
      Minimization of leakage current of recessed gate AlGaN/GaN HEMTs by optimizing the dry-etching process

      JOURNAL OF ELECTRONIC MATERIALS
    82. Karouta, F; Weyher, JL; Jacobs, B; Nowak, G; Presz, A; Grzegory, I; Kaufmann, LMF
      Final polishing of Ga-polar GaN substrates using reactive ion etching

      JOURNAL OF ELECTRONIC MATERIALS
    83. Hsiao, R; Miller, D; Nguyen, S; Kellock, A
      Titanium carbide etching in high density plasma

      APPLIED SURFACE SCIENCE
    84. Leech, PW; Ridgway, MC
      Effect of MeV O2+ implantation on the reactive ion etch rate of LiTaO3

      NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS
    85. Park, SG; Kim, C; O, BH
      An array of inductively coupled plasma sources for large area plasma

      THIN SOLID FILMS
    86. Kim, SD; Lee, JJ; Kim, KH; Lim, SH; Kim, HJ
      Ferromagnetic resonance of dry etched permalloy thin films

      IEEE TRANSACTIONS ON MAGNETICS
    87. Kushida, M; Saito, T; Harada, K; Saito, K; Sugita, K
      Enhancement of dry-etching durabilities by energy or etchant quenching with aliphatic, aromatic and alicyclic homopolymers, polymer blends and copolymers

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    88. Lee, S; Park, S; Cho, DI
      A new micromachining technique with (111) silicon

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    89. Yamamoto, N; Mawatari, H; Kishi, K
      Electrical evaluation of dry etching damage on the side wall of mesa structure

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    90. Massimi, A; Di Fabrizio, E; Gentili, M; Piccinin, D; Martinelli, M
      Fabrication of optical wave-guides in silica-on-silicon by nickel electroplating and conventional reactive ion etching

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    91. Terashita, T; Yamamoto, I; Naka, S; Okada, H; Onnagawa, H
      Fully self-aligned organic electroluminescent devices with dual sidewall structures

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    92. Raj, MM; Saka, Y; Wiedmann, J; Yasumoto, H; Arai, S
      Continuous wave operation of 1.55 mu m GaInAsP/InP laser with semiconductor/benzocyclobutene distributed Bragg reflector

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    93. Hong, J; Lambers, ES; Abernathy, CR; Pearton, SJ; Shul, RJ; Hobson, WS
      Inductively coupled plasma and electron cyclotron resonance plasma etchingof an InGaAlP compound semiconductor system

      CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES
    94. LUCAS B; MOUSSANT C; MOLITON A; ZYSS J
      OPTIMIZATION OF ETCHING PARAMETERS OF A FLUORINATED POLYIMIDE USING THE RIBE TECHNIQUE

      Polymer international
    95. Kahl, M; Voges, E; Kostrewa, S; Viets, C; Hill, W
      Periodically structured metallic substrates for SERS

      SENSORS AND ACTUATORS B-CHEMICAL
    96. GUI C; DEBOER M; GARDENIERS JGE; JANSEN H; BERENSCHOT JW; ELWENSPOEK M
      FABRICATION OF MULTILAYER SUBSTRATES FOR HIGH-ASPECT-RATIO SINGLE-CRYSTALLINE MICROSTRUCTURES

      Sensors and actuators. A, Physical
    97. TODA R; MINAMI K; ESASHI M
      THIN-BEAM BULK MICROMACHINING BASED ON RIE AND XENON DIFLUORIDE SILICON ETCHING

      Sensors and actuators. A, Physical
    98. ZHAO XM; XIA YN; SCHUELLER OJA; QIN D; WHITESIDES GM
      FABRICATION OF MICROSTRUCTURES USING SHRINKABLE POLYSTYRENE FILMS

      Sensors and actuators. A, Physical
    99. MUSCA CA; SILIQUINI JF; SMITH EPG; DELL JM; FARAONE L
      LASER-BEAM INDUCED CURRENT IMAGING OF REACTIVE ION ETCHING INDUCED N-TYPE DOPING IN HGCDTE

      Journal of electronic materials
    100. LEE H; HARRIS JS
      IRON NITRIDE MASK AND REACTIVE ION ETCHING OF GAN FILMS

      Journal of electronic materials


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Documento generato il 11/08/20 alle ore 06:43:00