Catalogo Articoli (Spogli Riviste)

HELP
ATTENZIONE: attualmente gli articoli Current Contents (fonte ISI) a partire dall'anno 2002 sono consultabili sulla Risorsa On-Line

Le informazioni sugli articoli di fonte ISI sono coperte da copyright

La ricerca find articoli where soggetti phrase all words 'PACKAGES' sort by level,fasc_key/DESCEND, pagina_ini_num/ASCEND ha restituito 205 riferimenti
Si mostrano 100 riferimenti a partire da 1
Selezionare un intervallo

Per ulteriori informazioni selezionare i riferimenti di interesse.

    1. McNally, PJ; Rantamaki, R; Tuomi, T; Danilewsky, AN; Lowney, D; Curley, JW; Herbert, PAF
      Mapping of mechanical, thermomechanical and wire-bond strain fields in packaged Si integrated circuits using synchrotron white beam x-ray topography

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    2. Zheng, LR; Tenhunen, H
      Fast modeling of core switching noise on distributed LRC power grid in ULSI circuits

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    3. Yang, Z; Rahman, M; Mourad, S
      Signal Integrity and design consideration of an MCM for video graphic acceleration

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    4. Hirose, A; Fujii, T; Imamura, T; Kobayashi, KF
      Influence of interfacial reaction on reliability of QFP joints with Sn-Ag based Pb free solders

      MATERIALS TRANSACTIONS
    5. Shin, YE; Lee, KW; Chang, KH; Jung, SB; Jung, JP
      Prediction of thermal fatigue life of lead-free BGA solder joints by finite element analysis

      MATERIALS TRANSACTIONS
    6. Lee, KY; Li, M
      Formation of intermetallic compounds in SnPbAg, SnAg, and SnAgCu solders on Ni/Au metallization

      METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
    7. Rencz, M; Szekely, V
      A generic method for thermal multiport model generation of IC packages

      SEVENTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2001
    8. Han, JB
      Flip-chip BGA design to avert die cracking

      JOURNAL OF ELECTRONIC PACKAGING
    9. Biro, E; Zhou, Y; Weckman, DC; Ely, KJ
      The effects of Ni and Au/Ni platings on laser welding of thin sheets

      JOURNAL OF LASER APPLICATIONS
    10. Yan, C; Qin, QH; Mai, YW
      Nonlinear analysis of plastic ball grid array solder joints

      JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
    11. Davis, S; Wiedenbeck, S
      The mediating effects of intrinsic motivation, ease of use and usefulness perceptions on performance in first-time and subsequent computer users

      INTERACTING WITH COMPUTERS
    12. Gunes, G; Watkins, CB; Hotchkiss, JH
      Physiological responses of fresh-cut apple slices under high CO2 and low O-2 partial pressures

      POSTHARVEST BIOLOGY AND TECHNOLOGY
    13. de Wild, HPJ; Peppelenbos, HW
      Improving the measurement of gas exchange in closed systems

      POSTHARVEST BIOLOGY AND TECHNOLOGY
    14. Gupta, V; Hernandez, R; Charconnet, P
      Effect of humidity and temperature on the tensile strength of polyimide/silicon nitride interface and its implications for electronic device reliability

      MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
    15. Baek, JH; Kim, SY
      A simple expression of maximum SSN for CMOS ground distribution networks

      IEICE TRANSACTIONS ON ELECTRONICS
    16. van Belkum, A; Struelens, M; de Visser, A; Verbrugh, H; Tibayrenc, M
      Role of genomic typing in taxonomy, evolutionary genetics, and microbial epidemiology

      CLINICAL MICROBIOLOGY REVIEWS
    17. Lee, JH; Park, JH; Lee, YH; Kim, YS
      Effects of Cu and Ni additions to eutectic Pb-Sn solders on Au embrittlement of solder interconnections

      JOURNAL OF MATERIALS RESEARCH
    18. Jackson, SD; Muir, PH
      Theory and numerical simulation of nth-order cascaded Raman fiber lasers

      JOURNAL OF THE OPTICAL SOCIETY OF AMERICA B-OPTICAL PHYSICS
    19. Ruiz-Capillas, C; Moral, A
      Formation of biogenic amines in bulk-stored chilled hake (Merluccius merluccius L.) packed under atmospheres

      JOURNAL OF FOOD PROTECTION
    20. Song, HG; Ahn, JP; Morris, JW
      The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au

      JOURNAL OF ELECTRONIC MATERIALS
    21. Lee, JH; Park, JH; Shin, DH; Lee, YH; Kim, YS
      Kinetics of Au-containing ternary intermetallic redeposition at solder/UBMinterface

      JOURNAL OF ELECTRONIC MATERIALS
    22. Liu, CM; Ho, CE; Chen, WT; Kao, CR
      Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solderon Au/Ni surface finish

      JOURNAL OF ELECTRONIC MATERIALS
    23. Snugovsky, P; Arrowsmith, P; Romansky, M
      Electroless Ni/immersion Au interconnects: Investigation of Black Pad in wire bonds and solder joints

      JOURNAL OF ELECTRONIC MATERIALS
    24. Krumbholz, M; Maiden, N
      The implementation of enterprise resource planning packages in different organisational and national cultures

      INFORMATION SYSTEMS
    25. Francalanci, C
      Predicting the implementation effort of ERP projects: empirical evidence on SAP/R3

      JOURNAL OF INFORMATION TECHNOLOGY
    26. Lin, JC; Chiang, KN
      Thermal/mechanical analysis of novel Ceramic-TSOP using nonlinear finite element method

      JOURNAL OF THE CHINESE INSTITUTE OF ENGINEERS
    27. Cho, K; Cho, EC; Park, CE
      Effect of the physical and mechanical properties of epoxy resins on the adhesion behavior of epoxy/copper leadframe joints

      JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
    28. Gunther, M; Hoschek, M; Weiner, R
      ROW methods adapted to a cheap Jacobian

      APPLIED NUMERICAL MATHEMATICS
    29. Kantola, M; Helen, H
      Quality changes in organic tomatoes packaged in biodegradable plastic films

      JOURNAL OF FOOD QUALITY
    30. Bellotti, F; De Gloria, A; Risso, M; Villamaina, A
      AutoGraL: a Java 2D graphics library for configurable automotive dashboards

      COMPUTERS & GRAPHICS-UK
    31. Singh, SP; Burgess, GJ; Hays, ZG
      Measurement and analysis of the United Parcel Service ground shipping environment for large and heavy packages

      JOURNAL OF TESTING AND EVALUATION
    32. Langmyhr, T
      The rationality of transport investment packages

      TRANSPORTATION
    33. Moore, TD; Jarvis, JL
      Improved reliability in small multichip ball grid arrays

      MICROELECTRONICS RELIABILITY
    34. Franke, T; Froehler, U
      Thermal modelling of semiconductor packages

      MICROELECTRONICS JOURNAL
    35. Ruiz-Capillas, C; Morales, J; Moral, A
      Combination of bulk storage in controlled and modified atmospheres with modified atmosphere packaging system for chilled whole gutted hake

      JOURNAL OF THE SCIENCE OF FOOD AND AGRICULTURE
    36. Guo, TF; Cheng, L
      Thermal and vapor pressure effects on cavitation and void growth

      JOURNAL OF MATERIALS SCIENCE
    37. Van de Velde, MD; Hendrickx, ME
      Influence of storage atmosphere and temperature on quality evolution of cut Belgian endives

      JOURNAL OF FOOD SCIENCE
    38. Simpson, R; Almonacid, S; Acevedo, C
      Development of a mathematical model for MAP systems applied to nonrespiring foods

      JOURNAL OF FOOD SCIENCE
    39. Zhu, M; Chu, CL; Wang, SL; Lencki, RW
      Influence of oxygen, carbon dioxide, and degree of cutting on the respiration rate of rutabaga

      JOURNAL OF FOOD SCIENCE
    40. Jaime, P; Salvador, ML; Oria, R
      Respiration rate of sweet cherries: 'Burlat', 'Sunburst' and 'Sweetheart' cultivars

      JOURNAL OF FOOD SCIENCE
    41. Browning, J; Newman, N; Ghetzler, R; Mast, M; Swendson, B
      Adhesive strength of rubber bonded to Al2O3 surfaces: The role of chemistry and morphology

      JOURNAL OF ADHESION
    42. Horng, TS; Wu, SM; Huang, HH; Chiu, CT; Hung, CP
      Modeling of lead-frame plastic CSPs for accurate prediction of their low-pass filter effects on RFICs

      IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
    43. Ju, Y; Saka, M; Abe, H
      NDI of delamination in IC packages using millimeter-waves

      IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT
    44. Fu, WS; Yang, SJ
      A new model for heat transfer of fins swinging back and forth in a flow

      INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
    45. Nagel, C
      Knowledge management: A pragmatic process based approach

      SOFTWARE QUALITY: STATE OF THE ART IN MANAGEMENT, TESTING, AND TOOLS
    46. Radeck, S; Kellenberger, D; Luechinger, C
      Soft solder die bonding of multiple die devices

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    47. Aranyosi, A; Ortega, A; Griffin, RA; West, S; Edwards, DR
      Compact thermal models of packages used in conduction cooled applications

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    48. Zribi, A; Chromik, RR; Presthus, R; Teed, K; Zavalij, L; DeVita, J; Tova, J; Cotts, EJ; Clum, JA; Erich, R; Primavera, A; Westby, G; Coyle, RJ; Wenger, GM
      Solder metallization interdiffusion in microelectronic interconnects

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    49. Maszenan, AM; Seviour, RJ; Patel, BKC; Wanner, J
      A fluorescently-labelled r-RNA targeted oligonucleotide probe for the in situ detection of G-bacteria of the genus Amaricoccus in activated sludge

      JOURNAL OF APPLIED MICROBIOLOGY
    50. Van Belkum, A
      Molecular epidemiology of methicillin-resistant Staphylococcus aureus strains: State of affairs and tomorrow's possibilities

      MICROBIAL DRUG RESISTANCE-MECHANISMS EPIDEMIOLOGY AND DISEASE
    51. Yu, WH; Mittra, R
      A conformal FDTD software package modeling antennas and microstrip circuitcomponents

      IEEE ANTENNAS AND PROPAGATION MAGAZINE
    52. Kassim, AA; Zhou, H; Ranganath, S
      Automatic IC orientation checks

      MACHINE VISION AND APPLICATIONS
    53. Hung, KC; Chan, YC; Ong, HC; Tu, PL; Tang, CW
      Effect of pinhole Au/Ni/Cu substrate on self-alignment of advanced packages

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    54. Lee, HY; Yu, J
      Effects of oxidation treatments on the fracture toughness of leadframe/epoxy interfaces

      MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
    55. Lambert, Y; Demazeau, G; Largeteau, A; Bouvier, JM; Laborde-Croubit, S; Cabannes, M
      New packaging solutions for high pressure treatments of food

      HIGH PRESSURE RESEARCH
    56. Larsen, H; Kohler, A; Magnus, EM
      Ambient oxygen ingress rate method - An alternative method to ox-tron for measuring oxygen transmission rate of whole packages

      PACKAGING TECHNOLOGY AND SCIENCE
    57. James, KM; Scotti, JR
      The educative approach to intervention with child excess behavior: Toward an application to parent training packages

      CHILD & FAMILY BEHAVIOR THERAPY
    58. Scott, JA; Kaindl, L
      Enhancing functionality in an enterprise software package

      INFORMATION & MANAGEMENT
    59. Cho, KW; Cho, EC
      Effect of the microstructure of copper oxide on the adhesion behavior of epoxy/copper leadframe joints

      JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
    60. Rodriguez-Toral, MA; Morton, W; Mitchell, DR
      Using new packages for modelling, equation oriented simulation and optimization of a cogeneration plant

      COMPUTERS & CHEMICAL ENGINEERING
    61. Gupta, V; Hernandez, R; Wu, JX; Charconnet, P
      Interfacial adhesion and its degradation in selected metal/oxide and dielectric/oxide interfaces in multi-layer devices

      VACUUM
    62. Yi, S; Kim, JK; Yue, CY; Hsieh, JH
      Bonding strengths at plastic encapsulant-gold-plated copper leadframe interface

      MICROELECTRONICS RELIABILITY
    63. Amagai, M
      The effect of polyimide surface chemistry and morphology on critical stress intensity factor

      MICROELECTRONICS RELIABILITY
    64. Kumar, KR
      Moisture sorption and packaging characteristics of Arabian dry cereal foods

      JOURNAL OF FOOD SCIENCE AND TECHNOLOGY-MYSORE
    65. Yi, S; Kim, JK; Yue, CY; Hsieh, JH
      Adhesion strengths of epoxy molding compounds to gold-plated copper leadframes

      JOURNAL OF ADHESION
    66. Muller, R; Heckmann, K; Habermann, M; Paul, T; Stratmann, M
      New adhesion promoters for copper leadframes and epoxy resin

      JOURNAL OF ADHESION
    67. Spiegel, SJ; Madjar, A
      Impact of light illumination and passivation layer on silicon finite-ground coplanar-waveguide transmission-line properties

      IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
    68. Roy, L; Rollin, JJ; Arcari, G
      Measurement of IC package shielding effectiveness using an integrated antenna

      IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT
    69. Machacha, LL; Bhattacharya, P
      A fuzzy-logic-based approach to project selection

      IEEE TRANSACTIONS ON ENGINEERING MANAGEMENT
    70. Tarvainen, T
      Simplified modeling of parallel plate resonances on multilayer printed circuit boards

      IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
    71. Kawamura, Y; Maehara, T; Suzuki, T; Yamada, T
      Determination of organotin compounds in kitchen utensils, food packages and toys by gas chromatography/atomic emission detection method

      JOURNAL OF THE FOOD HYGIENIC SOCIETY OF JAPAN
    72. Kawamura, Y; Maehara, T; Iijima, H; Yamada, T
      Nonylphenol in food contact plastics and toys

      JOURNAL OF THE FOOD HYGIENIC SOCIETY OF JAPAN
    73. Kawamura, Y; Yonezawa, R; Maehara, T; Yamada, T
      Determination of additives in food contact polypropylene

      JOURNAL OF THE FOOD HYGIENIC SOCIETY OF JAPAN
    74. Akimoto, K; Uchino, T; Nakano, K; Yasunaga, E; Kuroki, S; Hamanaka, D
      Comparison between fixed and flexible chamber methods for measuring respiratory rate under steady and unsteady states

      JOURNAL OF THE JAPANESE SOCIETY FOR HORTICULTURAL SCIENCE
    75. Parthiban, A; Jeevan, K; Seetharamu, KN; Azid, IA
      Evolutionary genetic approach to determine junction temperature in electronic packages

      PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE
    76. Zhu, H; Guo, YF; Li, WY; Tseng, AA; Martin, B
      Micro-mechanical characterization of solder mask materials

      PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE
    77. Zhang, GQ; Tay, AAO; Ernst, LJ
      Virtual thermo-mechanical prototyping of electronic packaging - the bottlenecks and solutions for damage modeling

      PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE
    78. Soboyejo, WO; Lu, GY; Chengalva, S; Zhang, J; Kenner, V
      A modified mixed-mode bending specimen for the interfacial fracture testing of dissimilar materials

      FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES
    79. Tay, AAO; Lin, TY
      Influence of temperature, humidity, and defect location on delamination inplastic IC packages

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    80. Zhang, L; Hunter, B; Subbarayan, G; Rose, D
      The accuracy of structural approximations employed in analysis of area array packages

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    81. Herrell, DJ; Beker, B
      Modeling of power distribution systems for high-performance microprocessors

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    82. Jeong, J; Nam, S; Shin, YS; Kim, YS; Jeong, J
      Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    83. Sese, J; Lera, F; Camon, A; Rillo, C
      Calculation of effective inductances of superconducting devices - Application to the cryogenic current comparator

      IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
    84. Varoquaux, P; Gouble, B; Barron, C; Yildiz, F
      Respiratory parameters and sugar catabolism of mushroom (Agaricus bisporusLange)

      POSTHARVEST BIOLOGY AND TECHNOLOGY
    85. Vauhkonen, A; Grahn, KJ
      Low power down-conversion RF mixers based on the Gilbert cell approach

      ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING
    86. Kolek, J
      Method for calculating the lifetime of unit metal packages

      PACKAGING TECHNOLOGY AND SCIENCE
    87. Hewett, TT; Porpora, DV
      A case study report on integrating statistics, problem-based learning, andcomputerized data analysis

      BEHAVIOR RESEARCH METHODS INSTRUMENTS & COMPUTERS
    88. Hadjisterkotis, E
      The survival of captive bred chukar Alectoris chukar cypriotes, released for restocking in Cyprus

      ZEITSCHRIFT FUR JAGDWISSENSCHAFT
    89. Bialecki, B; Fernandes, RI
      An orthogonal spline collocation alternating direction implicit Crank-Nicolson method for linear parabolic problems on rectangles

      SIAM JOURNAL ON NUMERICAL ANALYSIS
    90. Fabis, PM
      Material property, compatibility, and reliability issues in diamond-enhanced, GaAs-based plastic packages

      MICROELECTRONICS RELIABILITY
    91. Weide, K
      Impact of FEM simulation on reliability improvement of packaging

      MICROELECTRONICS RELIABILITY
    92. Szekely, V; Rencz, M; Courtois, B
      A step forward in the transient thermal characterization of chips and packages

      MICROELECTRONICS AND RELIABILITY
    93. Sanz, C; Perez, AG; Olias, R; Olias, JM
      Quality of strawberries packed with perforated polypropylene

      JOURNAL OF FOOD SCIENCE
    94. Katopis, GA; Becker, WD; Mazzawy, TR; Smith, HH; Vakirtzis, CK; Kuppinger, SA; Singh, B; Lin, PC; Bartells, J; Kihlmire, GV; Venkatachalam, PN; Stoller, HI; Frankel, JL
      MCM technology and design for the S/390 G5 system

      IBM JOURNAL OF RESEARCH AND DEVELOPMENT
    95. Decraene, LPR; Smets, EF
      The floral development and anatomy of Carica papaya (Caricaceae)

      CANADIAN JOURNAL OF BOTANY-REVUE CANADIENNE DE BOTANIQUE
    96. da Silva, MDH; Pasquini, C
      Bisegmented flow system for determination of low concentrations of gaseousconstituents in gaseous samples

      ANALYTICA CHIMICA ACTA
    97. Perou, AL; Laoubi, S; Vergnaud, JM
      Contaminant transfer during the coextrusion of tri-layer polymer films with a recycled layer. Effect of this transfer on the time of protection of the food

      ADVANCES IN COLLOID AND INTERFACE SCIENCE
    98. Hong, MH; Lu, YF; Chen, Q
      Optical emission spectrum analyses during pulsed laser deflash of integrated circuit packages

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    99. Lodge, KJ
      Shaped electronic substrates in low-temperature co-fired ceramics

      GEC JOURNAL OF TECHNOLOGY
    100. OGDEN J; HOPPE R
      CHANGING PRACTICE NURSES MANAGEMENT OF OBESITY

      Journal of human nutrition and dietetics


ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 25/10/20 alle ore 09:31:00