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    1. Crane, EL; Chiu, HT; Nuzzo, RG
      Kinetic and mechanistic studies of the chemical vapor deposition of tungsten nitride from bis(tertbutylimido)bis(tertbutylamido)tungsten

      JOURNAL OF PHYSICAL CHEMISTRY B
    2. Angelkort, C; Lewalter, H; Warbichler, P; Hofer, F; Bock, W; Kolbesen, BO
      Formation of niobium nitride by rapid thermal processing

      SPECTROCHIMICA ACTA PART A-MOLECULAR AND BIOMOLECULAR SPECTROSCOPY
    3. Ghosh, G
      Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizationsin solder joints

      ACTA MATERIALIA
    4. Onuki, J; Chonan, Y; Komiyama, T; Nihei, M; Suwa, M; Kitano, M
      Reliability enhancement of solder joints made by a void free soldering process

      MATERIALS TRANSACTIONS
    5. Norman, JAT
      Advances in copper CVD for the semiconductor industry

      JOURNAL DE PHYSIQUE IV
    6. Levesque, A; Bouteville, A
      Investigation of the tantalum chlorination with hydrogen chloride for LPCVD tantalum elaboration

      JOURNAL DE PHYSIQUE IV
    7. Merchant, SM; Kang, SH; Sanganeria, M; van Schravendijk, B; Mountsier, T
      Copper interconnects for semiconductor devices

      JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY
    8. Liu, ZR; Chung, DDL
      Development of glass-free metal electrically conductive thick films

      JOURNAL OF ELECTRONIC PACKAGING
    9. Juppo, M; Alen, P; Ritala, M; Leskela, M
      Trimethylaluminum as a reducing agent in the atomic layer deposition of Ti(Al)N thin films

      CHEMICAL VAPOR DEPOSITION
    10. Nie, HB; Xu, SY; Wang, SJ; You, LP; Yang, Z; Ong, CK; Li, J; Liew, TYF
      Structural and electrical properties of tantalum nitride thin films fabricated by using reactive radio-frequency magnetron sputtering

      APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
    11. Brandow, SL; Chen, MS; Fertig, SJ; Chrisey, LA; Dulcey, CS; Dressick, WJ
      Surface patterning of polychloromethylstyrene films

      CHEMISTRY-A EUROPEAN JOURNAL
    12. Wahl, R; Mertig, M; Raff, J; Selenska-Pobell, S; Pompe, W
      Electron-beam induced formation of highly ordered palladium and platinum nanoparticle arrays on the S layer of Bacillus sphaericus NCTC 9602

      ADVANCED MATERIALS
    13. Tu, KN; Zeng, K
      Tin-lead (SnPb) solder reaction in flip chip technology

      MATERIALS SCIENCE & ENGINEERING R-REPORTS
    14. Zhang, MC; Kang, ET; Neoh, KG; Tan, KL
      Surface modification of aluminum foil and PTFE film by graft polymerization for adhesion enhancement

      COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
    15. Heino, P
      Microstructure and shear strength of a Cu-Ta interface

      COMPUTATIONAL MATERIALS SCIENCE
    16. Tjong, SC; Ho, HP; Lee, ST
      Development of single- and multi-layered metallic films on diamond by ion beam-assisted deposition

      DIAMOND AND RELATED MATERIALS
    17. Kutchoukov, VG; Mollinger, JR; Shikida, M; Bossche, A
      Patterning of polyimide and metal in deep trenches

      SENSORS AND ACTUATORS A-PHYSICAL
    18. Park, YB; Lee, DW
      Effects of Ti and TiN underlayers on electromigration reliability of Al-Cuinterconnects

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    19. Park, W; Lee, C
      Plasma pretreatments for Cu-MOCVD

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    20. Vargheese, KD; Rao, GM; Balasubramanian, TV; Kumar, S
      Preparation and characterization of TiN films by electron cyclotron resonance (ECR) sputtering for diffusion barrier applications

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    21. Auret, FD; Goodman, SA; Myburg, G; Mohney, SE; de Lucca, JM
      Processing-induced electron traps in n-type GaN

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    22. Dehm, G; Weiss, D; Arzt, E
      In situ transmission electron microscopy study of thermal-stress-induced dislocations in a thin Cu film constrained by a Si substrate

      MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
    23. Ariel, N; Eizenberg, M; Wang, Y; Bakhru, H
      The interface of fluorinated amorphous carbon with copper metallization

      MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
    24. Noya, A; Takeyama, MB
      Thermal stability of ZrN barrier in W/ZrN/poly-Si gate electrode configuration

      IEICE TRANSACTIONS ON ELECTRONICS
    25. Kamijo, C; Hoshi, M; Kawaguchi, T; Yamaoka, H; Kamei, Y
      Production of direct reduced iron by a sheet material inserting metallization method

      ISIJ INTERNATIONAL
    26. Chen, TY; Vaissermann, J; Ruiz, E; Senateur, JP; Doppelt, P
      2-methyl-1-hexen-3-yne Lewis base stabilized, beta-diketonate copper(I) complexes: X-ray structures, theoretical study, and low-temperature chemical vapor deposition of copper metal

      CHEMISTRY OF MATERIALS
    27. Han, CC; Bai, MY; Lee, JT
      A new and easy method for making Ni and Cu microtubules and their regularly assembled structures

      CHEMISTRY OF MATERIALS
    28. Yun, NI; Hong, IP; Park, HK
      Investigation of asymmetrical coupled microstrip lines with finite metallization thickness

      MICROWAVE AND OPTICAL TECHNOLOGY LETTERS
    29. Lee, JH; Park, JH; Lee, YH; Kim, YS
      Effects of Cu and Ni additions to eutectic Pb-Sn solders on Au embrittlement of solder interconnections

      JOURNAL OF MATERIALS RESEARCH
    30. Lucadamo, G; Barmak, K; Rodbell, KP
      Texture in Ti/Al and Nb/Al multilayer thin films: Role of Cu

      JOURNAL OF MATERIALS RESEARCH
    31. Dong, L; Srolovitz, DJ; Was, GS; Zhao, Q; Rollett, AD
      Combined out-of-plane and in-plane texture control in thin films using ionbeam assisted deposition

      JOURNAL OF MATERIALS RESEARCH
    32. Rosenfeld, Y
      Comments on the pressure dissociation of deuterium as related to the Nova laser Hugoniot

      CONTRIBUTIONS TO PLASMA PHYSICS
    33. Koo, J; Lee, JW; Doh, T; Kim, Y; Kim, YD; Jeon, H
      Study on the characteristics of TiAlN thin film deposited by atomic layer deposition method

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
    34. Lee, WH; Ko, YK; Byun, IJ; Seo, BS; Lee, JG; Reucroft, PJ; Lee, JU; Lee, JY
      Chemical vapor deposition of an electroplating Cu seed layer using hexafluoroacetylacetonate Cu(1,5-dimethylcyclooctadiene)

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
    35. Ma, ZH; Tan, KL; Alian, AD; Kang, ET; Neoh, KG
      Electroless plating of copper on poly(tetrafluoroethylene) films modified by NH3 plasma and surface graft copolymerization with aniline

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
    36. Kim, KJ; Kim, KS; Lee, NE; Choi, J; Jung, D
      Chemical interaction and adhesion characteristics at the interface of metals (Cu, Ta) and low-k cyclohexane-based plasma polymer (CHexPP) films

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
    37. Nakayama, A; Fujihisa, H; Takemura, K; Aoki, K; Carlon, RP
      Structural study on pressure-induced metallization of C6I6

      SYNTHETIC METALS
    38. Kim, DY; Yu, JS; Bae, SJ; Song, JD; Kim, JM; Lee, YT
      Thermally stable tungsten ohmic contact to p-InGaAs and effective barrier height measurement by using the I-V-T method

      JOURNAL OF THE KOREAN PHYSICAL SOCIETY
    39. Dhanak, VR; Santoni, A; Grill, L; Petaccia, L
      A high temperature X-ray absorption and valence band spectroscopy study ofthe Si(100) surface

      JOURNAL OF ELECTRON SPECTROSCOPY AND RELATED PHENOMENA
    40. Song, HG; Ahn, JP; Morris, JW
      The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au

      JOURNAL OF ELECTRONIC MATERIALS
    41. Lee, JH; Park, JH; Shin, DH; Lee, YH; Kim, YS
      Kinetics of Au-containing ternary intermetallic redeposition at solder/UBMinterface

      JOURNAL OF ELECTRONIC MATERIALS
    42. Ghosh, G; Pfeifer, MJ
      Interfacial reactions between a Pb-free solder and die backside metallizations

      JOURNAL OF ELECTRONIC MATERIALS
    43. Liu, CM; Ho, CE; Chen, WT; Kao, CR
      Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solderon Au/Ni surface finish

      JOURNAL OF ELECTRONIC MATERIALS
    44. Park, JY; Yang, CW; Ha, JS; Kim, CU; Kwon, EJ; Jung, SB; Kang, CS
      Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film metallization

      JOURNAL OF ELECTRONIC MATERIALS
    45. Young, CC; Duh, JG; Tsai, SY
      Microstructural evolution in the Sn-Cu-Ni and Pb-Sn solder joints with Cu and Pt-Ag metallized Al2O3 substrate

      JOURNAL OF ELECTRONIC MATERIALS
    46. Wang, SJ; Tsai, HY; Sun, SC; Shiao, MH
      Characterization of sputtered Ta-C-N film in the Cu/barrier/Si contact system

      JOURNAL OF ELECTRONIC MATERIALS
    47. Zuruzi, AS; Lahiri, SK; Burman, P; Siow, KS
      Correlation between intermetallic thickness and roughness during solder reflow

      JOURNAL OF ELECTRONIC MATERIALS
    48. Lee, WH; Ko, YK; Choi, JH; Byun, IJ; Kwak, HT; Kim, DH; Rhee, SW; Reucroft, PJ; Lee, JG
      The effect of carrier gas and H(hfac) on MOCVD Cu films using (hfac)Cu(1,5-COD) as a precursor

      JOURNAL OF ELECTRONIC MATERIALS
    49. Lee, WH; Ko, YK; Jang, JH; Kim, CS; Reucroft, PJ; Lee, JG
      Microstructure control of copper films by the addition of molybdenum in anadvanced metallization process

      JOURNAL OF ELECTRONIC MATERIALS
    50. Kim, DW; Bae, JC; Kim, WJ; Baik, HK; Kim, CY; Kim, W; Choi, YH; Kim, CK; Yoo, TK; Hong, CH; Lee, SM
      Development of Al-free ohmic contact to n-GaN

      JOURNAL OF ELECTRONIC MATERIALS
    51. Young, BL; Duh, JG
      Interfacial reaction and microstructural evolution for electroplated Ni and electroless Ni in the under bump metallurgy with 42Sn58Bi solder during annealing

      JOURNAL OF ELECTRONIC MATERIALS
    52. Kordas, K; Bekesi, J; Vajtai, R; Jauhianen, M; Remes, J; Uusimaki, A; Leppavuori, S; George, TF; Nanai, L
      Laser-assisted via hole metallization in PCB materials

      JOURNAL OF ELECTRONIC MATERIALS
    53. Besser, PR; Zschech, E; Blum, W; Winter, D; Ortega, R; Rose, S; Herrick, M; Gall, M; Thrasher, S; Tiner, M; Baker, B; Braeckelmann, G; Zhao, L; Simpson, C; Capasso, C; Kawasaki, H; Weitzman, E
      Microstructural characterization of inlaid copper interconnect lines

      JOURNAL OF ELECTRONIC MATERIALS
    54. Shacham-Diamand, Y
      Barrier layers for Cu ULSI metallization

      JOURNAL OF ELECTRONIC MATERIALS
    55. Song, HG; Ahn, JP; Minor, AM; Morris, JW
      Au-Ni-Sn intermetallic phase relationships in eutectic Pb-Sn solder formedon Ni/Au metallization

      JOURNAL OF ELECTRONIC MATERIALS
    56. Lee, WH; Park, SK; Kang, BJ; Reucroft, PJ; Lee, JG
      Deposition characteristics of Ti-Si-N films reactively sputtered from various targets in a N-2/Ar gas mixture

      JOURNAL OF ELECTRONIC MATERIALS
    57. Kou, SC; Hung, A
      In situ measurement of the mixed potential of electroless copper deposition

      PLATING AND SURFACE FINISHING
    58. Southward, RE; Stoakley, DM
      Reflective and electrically conductive surface silvered polyimide films and coatings prepared via unusual single-stage self-metallization techniques

      PROGRESS IN ORGANIC COATINGS
    59. Werner, MR; Fahrner, WR
      Review on materials, microsensors, systems, and devices for high-temperature and harsh-environment applications

      IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
    60. Mrosk, JW; Berger, L; Ettl, C; Fecht, HJ; Fischerauer, G; Dommann, A
      Materials issues of SAW sensors for high-temperature applications

      IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
    61. Decams, JM; Daniele, S; Hubert-Pfalzgraf, LG; Vaissermann, J; Lecocq, S
      Synthesis and characterization of niobium(V) and tantalum(V) derivatives with diamido ligands. Molecular structure of {4,5-Me-2-0-C6H2(NSiMe3)(2)}(2)NbCl and of a tantalum imide

      POLYHEDRON
    62. Suzuki, N; Otani, M
      Pressure-induced insulator-metal transition and collapse of magnetism in molecular solid oxygen

      POLYHEDRON
    63. Rozenberg, GG; Steinke, JHG; Gelbrich, T; Hursthouse, MB
      Synthesis and spectroscopic studies of novel beta-diketonate copper(I) compounds and solid state structure of tetravinylsilane tetrakis copper(I) 1,1,1,5,5,5-hexafluoroacetylacetonate (TVST[Cu]hfac)

      ORGANOMETALLICS
    64. Shi, JR; Lau, SP; Sun, Z; Shi, X; Tay, BK; Tan, HS
      Structural and electrical properties of copper thin films prepared by filtered cathodic vacuum arc technique

      SURFACE & COATINGS TECHNOLOGY
    65. Yin, KM; Chang, L; Chen, FR; Kai, JJ
      The effect of oxygen on the interfacial reactions of Cu/TaNx/Si multilayers

      MATERIALS CHEMISTRY AND PHYSICS
    66. Zhang, DH; Loh, SW; Li, CY; Foo, PD; Xie, J; Liu, R; Wee, ATS; Zhang, L; Lee, YK
      Study of Cu diffusion in Cu/TaN/SiO2/Si multilayer structures

      SURFACE REVIEW AND LETTERS
    67. Zhang, DH; Loh, SW; Li, CY; Foo, PD; Xie, J
      Surface and structural properties of copper films deposited by metal organic chemical vapor deposition for Si technology

      SURFACE REVIEW AND LETTERS
    68. Kim, JJ; Kim, SK
      Optimized surface pretreatments for copper electroplating

      APPLIED SURFACE SCIENCE
    69. Scheithauer, U
      Improved sputter depth resolution in Auger thin film analysis using in situ low angle cross-sections

      APPLIED SURFACE SCIENCE
    70. Pidun, M; Karduck, P; Mayer, J; Heime, K; Schineller, B; Walther, T
      Auger depth profile analysis and EFTEM analysis of annealed Ti/Al-contactson Si-doped GaN

      APPLIED SURFACE SCIENCE
    71. Baunack, S; Kotter, TG; Wendrock, H; Wetzig, K
      AES analysis of failures in Cu based electromigration test samples

      APPLIED SURFACE SCIENCE
    72. Kordas, K; Remes, J; Leppavuori, S; Nanai, L
      Laser-assisted selective deposition of nickel patterns on porous silicon substrates

      APPLIED SURFACE SCIENCE
    73. Lin, YM; Yen, SC
      Effects of additives and chelating agents on electroless copper plating

      APPLIED SURFACE SCIENCE
    74. Yang, GH; Kang, ET; Neoh, KG
      Electroless deposition of copper and nickel on poly(tetrafluoroethylene) films modified by single and double surface graft copolymerization

      APPLIED SURFACE SCIENCE
    75. Wu, SY; Kang, ET; Neoh, KG
      Interaction of copper atoms with surface graft-copolymerization poly(tetrafluoroethylene) film: an in situ X-ray photoelectron spectroscopic study

      APPLIED SURFACE SCIENCE
    76. Schafer, MM; Seidel, C; Fuchs, H; Voetz, M
      The suppression of water-diffusion in polycarbonate through Ar- and He-plasma as a new model for the origin of improved adhesion of Al

      APPLIED SURFACE SCIENCE
    77. Yang, DQ; Meunier, M; Sacher, E
      The estimation of the average dimensions of deposited clusters from XPS emission intensity ratios

      APPLIED SURFACE SCIENCE
    78. Kordas, K; Bekesi, J; Vajtai, R; Nanai, L; Leppavuori, S; Uusimaki, A; Bali, K; George, TF; Galbacs, G; Ignacz, F; Moilanen, P
      Laser-assisted metal deposition from liquid-phase precursors on polymers

      APPLIED SURFACE SCIENCE
    79. Tanaka, K; Yanashima, H; Yako, T; Kamio, K; Sugai, K; Kishida, S
      Aluminum chemical vapor deposition reaction of dimethylaluminum hydride onTiN studied by X-ray photoelectron spectroscopy and time-of-flight secondary ion mass spectrometry

      APPLIED SURFACE SCIENCE
    80. Zhu, YF; Wang, L; Yao, WQ; Cao, LL
      The interface diffusion and reaction between Cr layer and diamond particleduring metallization

      APPLIED SURFACE SCIENCE
    81. Chen, GS; Chen, ST; Huang, SC; Lee, HY
      Growth mechanism of sputter deposited Ta and Ta-N thin films induced by anunderlying titanium layer and varying nitrogen flow rates

      APPLIED SURFACE SCIENCE
    82. Inagaki, N; Tasaka, S; Baba, T
      Surface modification of polyimide film surface by silane coupling reactions for copper metallization

      JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
    83. Ge, J; Tuominen, R; Kivilahti, JK
      Adhesion of electrolessly-deposited copper to photosensitive epoxy

      JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
    84. Lindner, JKN; Wenzel, S; Stritzker, B
      Metallization of ion beam synthesized Si/3C-SiC/Si layer systems by high-dose implantation of transition metal ions

      NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS
    85. Hossain, SM; Chakraborty, S; Dutta, SK; Saha, H
      Metal patterning for large area electroluminescent porous silicon

      MICROELECTRONIC ENGINEERING
    86. Bystrova, S; Holleman, J; Woerlee, PH
      Growth and properties of LPCVD W-Si-N barrier layers

      MICROELECTRONIC ENGINEERING
    87. Sabbadini, A; Cazzaniga, F; Alberici, S; Bresolin, C; Casati, G; Cusi, V; Pavia, G; Queirolo, G
      Impact of plasma treatment time on MOCVD-TiN properties and on the electrical performance of deep contacts

      MICROELECTRONIC ENGINEERING
    88. Riedel, S; Schulz, SE; Baumann, J; Rennau, M; Gessner, T
      Influence of different treatment techniques on the barrier properties of MOCVD TiN against copper diffusion

      MICROELECTRONIC ENGINEERING
    89. Kohn, A; Eizenberg, M; Shacham-Diamand, Y; Israel, B; Sverdlov, Y
      Evaluation of electroless deposited Co(W,P) thin films as diffusion barriers for copper metallization

      MICROELECTRONIC ENGINEERING
    90. Shacham-Diamand, Y; Israel, B; Sverdlov, Y
      The electrical and material properties of MOS capacitors with electrolessly deposited integrated copper gate

      MICROELECTRONIC ENGINEERING
    91. Alford, TL; Nguyen, P; Zeng, YX; Mayer, JW
      Advanced silver-based metallization patterning for ULSI applications

      MICROELECTRONIC ENGINEERING
    92. Alford, TL; Zeng, YX; Nguyen, P; Chen, LH; Mayer, JW
      Self-encapsulation effects on the electromigration resistance of silver lines

      MICROELECTRONIC ENGINEERING
    93. Urbansky, N; Harris, M; Butler, DC; Rich, P; Buchanan, K; Goergens, C
      Advanced long throw PVD for contact to silicon and via applications

      MICROELECTRONIC ENGINEERING
    94. Tseng, WJ; Tsai, CJ; Hsi, CS
      Influence of particulate Al2O3 addition on interfacial microstructure and electrical sheet resistance of thick film metallized aluminum nitride substrates

      MATERIALS LETTERS
    95. Akahama, Y; Kawamura, H; Shimomura, O
      Structural phase transitions of solid oxygen at low temperature and high pressure - art. no. 054105

      PHYSICAL REVIEW B
    96. Cui, T; Takada, Y; Cui, Q; Ma, Y; Zou, G
      Structural phase transition at high temperatures in solid molecular hydrogen and deuterium - art. no. 024108

      PHYSICAL REVIEW B
    97. Sun, YM; Lee, SY; Lemonds, A; Lozano, J; Zhou, JP; Ekerdt, JG; White, JM; Imesh, I
      Surface and structure analysis of ultrathin multilayer structures for copper diffusion studies

      SURFACE AND INTERFACE ANALYSIS
    98. Zschech, E; Blum, W; Zienert, I; Besser, PR
      Effect of copper line geometry and process parameters on interconnect microstructure and degradation processes

      ZEITSCHRIFT FUR METALLKUNDE
    99. Choi, KK; Rhee, SW
      Chemical vapor deposition of copper film from hexafluoroacetylacetonateCu((I))vinylcyclohexane

      THIN SOLID FILMS
    100. Sun, YM; Lee, SY; Lemonds, AM; Engbrecht, ER; Veldman, S; Lozano, J; White, JM; Ekerdt, JG; Emesh, I; Pfeifer, K
      Low temperature chemical vapor deposition of tungsten carbide for copper diffusion barriers

      THIN SOLID FILMS


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Documento generato il 06/08/20 alle ore 03:46:25