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    1. Dewan, MNA; McNally, PJ; Perova, T; Herbert, PAF
      Use of plasma impedance monitoring for the determination of SF6 reactive ion etch process end points in a SiO2/Si system

      MATERIALS RESEARCH INNOVATIONS
    2. Rusu, C; van't Oever, R; de Boer, MJ; Jansen, HV; Berenschot, JW; Bennink, ML; Kanger, JS; de Grooth, BG; Elwenspoek, M; Greve, J; Brugger, J; van den Berg, A
      Direct integration of micromachined pipettes in a flow channel for single DNA molecule study by optical tweezers

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    3. Griss, P; Enoksson, P; Tolvanen-Laakso, HK; Merilainen, P; Ollmar, S; Stemme, G
      Micromachined electrodes for biopotential measurements

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    4. Kim, SJ; Latyshev, YI; Yamashita, T; Kishida, S
      Fabrication of ultra-small and long intrinsic Josephson junctions on Bi-2212 single crystal whiskers

      IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
    5. Stokes, D; May, GS
      Indirect adaptive control of reactive ion etching using neural networks

      IEEE TRANSACTIONS ON ROBOTICS AND AUTOMATION
    6. Su, GDJ; Toshiyoshi, H; Wu, MC
      Surface-micromachined 2-D optical scanners with high-performance single-crystalline silicon micromirrors

      IEEE PHOTONICS TECHNOLOGY LETTERS
    7. Piotrowski, TT; Piotrowska, A; Kaminska, E; Szopniewski, Z; Kolesnik, S; Wrobel, J; Gierlowski, P; Lewandowski, S
      Electron beam lithography and reactive ion etching of nanometer size features in niobium films

      MATERIALS SCIENCE & ENGINEERING C-BIOMIMETIC AND SUPRAMOLECULAR SYSTEMS
    8. Lyebyedyev, D; Schulz, H; Scheer, HC; Pfeiffer, K
      Characterisation of new thermosetting polymer materials for nanoimprint lithography

      MATERIALS SCIENCE & ENGINEERING C-BIOMIMETIC AND SUPRAMOLECULAR SYSTEMS
    9. Otterbach, R; Hilleringmann, U; Horstmann, JT; Goser, K
      Structures with a minimum feature size of less than 100 nm in CVD-diamond for sensor applications

      DIAMOND AND RELATED MATERIALS
    10. Grigaliunas, V; Kopustinskas, V; Meskinis, S; Margelevicius, M; Mikulskas, I; Tomasiunas, R
      Replication technology for photonic band gap applications

      OPTICAL MATERIALS
    11. London, AP; Ayon, AA; Epstein, AH; Spearing, SM; Harrison, T; Peles, Y; Kerrebrock, JL
      Microfabrication of a high pressure bipropellant rocket engine

      SENSORS AND ACTUATORS A-PHYSICAL
    12. Bayt, RL; Breuer, KS
      Analysis and testing of a silicon intrinsic-point heater in a micropropulsion application

      SENSORS AND ACTUATORS A-PHYSICAL
    13. Ayon, AA; Zhang, X; Khanna, R
      Anisotropic silicon trenches 300-500 mu m deep employing time multiplexed deep etching (TMDE)

      SENSORS AND ACTUATORS A-PHYSICAL
    14. Matsuura, T; Chabloz, M; Jiao, J; Yoshida, Y; Tsutsumi, K
      A method to evade silicon backside damage in deep reactive ion etching foranodically bonded glass-silicon structures

      SENSORS AND ACTUATORS A-PHYSICAL
    15. Mitani, S; Takanashi, K; Yakushiji, K; Chiba, J; Fujimori, H
      Study on spin dependent tunneling and Coulomb blockade in granular systemswith restricted tunneling paths

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    16. Aperathitis, E; Cengher, D; Kayambaki, M; Androulidaki, M; Deligeorgis, G; Tsagaraki, K; Hatzopoulous, Z; Georgakilas, A
      Evaluation of reactive ion etching processes for fabrication of integratedGaAs/AlGaAs optoelectronic devices

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    17. Schoop, U; Schonecke, M; Thienhaus, S; Schymon, S; Alff, L; Gross, R
      Role of ion beam etching in the fabrication of ramp-type junctions

      PHYSICA C
    18. Yang, SC; Chiu, HC; Chien, FT; Chan, YJ; Kuo, JM
      RIE gate-recessed (Al0.3Ga0.7)(0.5)In0.5P/InGaAs double doped-channel FETsusing CHF3+BCl3 mixing plasma

      IEEE ELECTRON DEVICE LETTERS
    19. Aoyama, T; Okawa, S; Hattori, K; Hatate, H; Wada, Y; Uchiyama, K; Kagotani, T; Nishio, H; Sato, I
      Fabrication and magnetic properties of CoPt perpendicular patterned media

      JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS
    20. Naoe, M; Hamaya, K; Fujiwara, N; Taniyama, T; Kitamoto, Y; Yamazaki, Y
      Selective dry etching of manganite thin films for high sensitive magnetoresistive sensors

      JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS
    21. Mao, DS; Li, W; Wang, X; Liu, XH
      Diamond-like carbon films prepared by filtered are deposition for electronfield emission application

      SURFACE & COATINGS TECHNOLOGY
    22. Chen, SH; Yi, XJ; Li, Y; He, M; Kong, LB; Ma, H
      Hybrid integration between long focus microlens array and IR detector array

      INTERNATIONAL JOURNAL OF INFRARED AND MILLIMETER WAVES
    23. Paszti, Z; Peto, G; Horvath, ZE; Geszti, O; Karacs, A; Guczi, L
      Formation of supported nanoparticles from island thin films during ion etching

      NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS
    24. Alkaisi, MM; Blaikie, RJ; McNab, SJ
      Low temperature nanoimprint lithography using silicon nitride molds

      MICROELECTRONIC ENGINEERING
    25. Rong, B; Reeves, RJ; Brown, SA; Alkaisi, MM; van der Drift, E; Cheung, R; Sloof, WG
      A study of reactive ion etching damage effects in GaN

      MICROELECTRONIC ENGINEERING
    26. Avary, K; Rennon, S; Klopf, F; Reithmaier, JP; Forchel, A
      Reactive ion etching of deeply etched DBR-structures with reduced air-gapsfor-highly reflective monolithically integrated laser mirrors

      MICROELECTRONIC ENGINEERING
    27. Hodgekinson, I; Wu, QH; Arnold, M; Blaikie, R
      Direct nanoengineering and lithographic patterning of optically anisotropic thin films

      MICROELECTRONIC ENGINEERING
    28. Peyrade, D; Chen, Y; Manin-Ferlazzo, L; Lebib, A; Grandjean, N; Coquillat, D; Legros, R; Lascaray, JP
      Fabrication of GaN photonic crystals for 400 nm wavelength

      MICROELECTRONIC ENGINEERING
    29. Kowalski, ZW
      Ion sputter induced surface morphology - biomedical implications

      VACUUM
    30. Lalinsky, T; Skriniarova, J; Kostic, I; van der Hart, A; Hrkut, P; Hascik, S; Matay, L; Mozolova, Z; Kordos, P
      T-shaped gates for heterostructure field effect transistors

      VACUUM
    31. Yamaguchi, T; Kato, H; Fujimura, N; Ito, T
      Annealing behavior of electrical properties in plasma-exposed Ti/p-Si interfaces

      THIN SOLID FILMS
    32. Marso, M; Wolter, M; Arens-Fischer, R; Luth, H
      Fabrication of laterally displaced porous silicon filters

      THIN SOLID FILMS
    33. Jung, MY; Choi, SS; Kim, JW; Kim, DW
      The influence of He addition on Cl-etching procedure for Si-nanoscale structure fabrication using reactive ion etching system

      SURFACE SCIENCE
    34. Shimizu, D; Fujiwara, T; Kon, K; Isshiki, N; Tsunokuni, H
      Three-dimensional reconstruction by scanning electron microscopy from serial epoxy resin semi-thin sections after ion-etching

      JOURNAL OF ELECTRON MICROSCOPY
    35. Guo, L; Li, KC; Liu, DG; Ou, YH; Zhang, J; Yi, Q; Xu, SL
      Reactive ion etching of Si1-xGex alloy with hydrogen bromide

      JOURNAL OF CRYSTAL GROWTH
    36. Belas, E; Grill, R; Franc, J; Moravec, P; Varghova, R; Hoschl, P; Sitter, H; Toth, AL
      Dynamics of native point defects in H-2 and Ar plasma-etched narrow gap (HgCd)Te

      JOURNAL OF CRYSTAL GROWTH
    37. Aoyama, T; Uchiyama, K; Kagotani, T; Hattori, K; Wada, Y; Okawa, S; Hatate, H; Nishio, H; Sato, I
      Fabrication and properties of CoPt patterned media with perpendicular magnetic anisotropy

      IEEE TRANSACTIONS ON MAGNETICS
    38. Lee, HY; Kim, JW; Shin, K; Kim, ES; Chung, HB
      Amorphous-Si transmission gratings prepared by Ga+-focused-ion-beam milling and their polarization characteristics

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    39. Kang, JW; Kim, JS; Kim, JJ
      Optimized oxygen plasma etching of polycarbonate for low-loss optical waveguide fabrication

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    40. Yokoi, H; Waniishi, T; Mizumoto, T; Shimizu, M; Sakurai, K; Futakuchi, N; Nakano, Y
      Integration of terraced laser diode and garnet crystals by wafer direct bonding

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    41. Raj, MM; Wiedmann, J; Toyoshima, S; Saka, Y; Ebihara, K; Arai, S
      High-reflectivity semiconductor/benzocyclobutene Bragg reflector mirrors for GaInAsP/InP lasers

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    42. Ichimura, I; Kishima, K; Saito, K; Yamamoto, K; Kuroda, Y; Iida, A; Masuhara, S; Osato, K
      Near-field optical recording on a pre-grooved phase-change disk in the blue-violet

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    43. Kanoh, M; Yamage, M; Takada, H
      End-point detection of reactive ion etching by plasma impedance monitoring

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    44. Maruyama, M; Furutani, T; Yoshinaga, Y; Kito, T; Matsuda, G; Akaike, H; Inoue, M; Fujimaki, A; Hayakawa, H
      Planarization of the YBa2Cu3O7-x base electrodes in trilayer Josephson junctions

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    45. Toyota, H; Takahara, K; Okano, M; Yotsuya, T; Kikuta, H
      Fabrication of microcone array for antireflection structured surface usingmetal dotted pattern

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    46. Lee, K; Auh, K
      Properties of freestanding GaN substrates grown by hydride vapor phase epitaxy

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    47. Kim, HC; Wiedmann, J; Matsui, K; Tamura, S; Arai, S
      1.5-mu m-wavelength distributed feedback lasers with deeply etched first-order vertical grating

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    48. Arens-Fischer, R; Kruger, M; Thonissen, M; Ganse, V; Hunkel, D; Marso, M; Luth, H
      Formation of porous silicon filter structures with different properties onsmall areas

      JOURNAL OF POROUS MATERIALS
    49. Taniguchi, J; Miyamoto, I
      Fine patterning and fabrication of diamond chips with electron beam and focused-ion beam

      NEW DIAMOND AND FRONTIER CARBON TECHNOLOGY
    50. Tanabe, K; Umezawa, H; Tachiki, M; Kawarada, H
      Oxygen plasma etching of polycrystalline diamond

      NEW DIAMOND AND FRONTIER CARBON TECHNOLOGY
    51. Ayazi, F; Najafi, K
      High aspect-ratio combined poly and single-crystal silicon (HARPSS) MEMS technology

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    52. Oosterbroek, RE; Berenschot, JW; Jansen, HV; Nijdam, AJ; Pandraud, G; van den Berg, A; Elwenspoek, MC
      Etching methodologies in < 111 >-oriented silicon wafers

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    53. Partridge, A; Reynolds, JK; Chui, BW; Chow, EM; Fitzgerald, AM; Zhang, L; Maluf, NI; Kenney, TW
      A high-performance planar piezoresistive accelerometer

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    54. Jo, BH; Van Lerberghe, LM; Motsegood, KM; Beebe, DJ
      Three-dimensional micro-channel fabrication in polydimethylsiloxane (PDMS)elastomer

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    55. Cheung, R; Reeves, RJ; Brown, SA
      Process-induced defects and optical memory in gallium nitride

      DEFECTS AND DIFFUSION IN CERAMICS
    56. Rahman, M
      Damage in III-V semiconductors from very low-energy process plasmas

      DEFECTS AND DIFFUSION IN SEMICONDUCTORS
    57. Regnier, FE
      Microfabricated monolith columns for liquid chromatography - Sculpting supports for liquid chromatography

      HRC-JOURNAL OF HIGH RESOLUTION CHROMATOGRAPHY
    58. de Heij, B; van der Schoot, B; Bo, H; Hess, J; de Rooij, NF
      Characterisation of a fL droplet generator for inhalation drug therapy

      SENSORS AND ACTUATORS A-PHYSICAL
    59. Malinin, A; Ovchinnikov, V; Novikov, S; Tuovinen, C; Hovinen, A
      Fabrication of a silicon based electroluminescent device

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    60. Paskaleva, A; Atanassova, E
      Structural nature of the N-2 RIE plasma induced slow states and bulk trapsin thin SiO2-Si structures

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    61. Stokes, D; May, GS
      Real-time control of reactive ion etching using neural networks

      IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
    62. Sowa, MJ; Littau, ME; Pohray, V; Cecchi, JL
      Fluorocarbon polymer deposition kinetics in a low-pressure, high density, inductively coupled plasma reactor

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
    63. Moussant, C; Lucas, B; Moliton, A
      Etching techniques using a collimated ion beam for the realization of waveguides

      SYNTHETIC METALS
    64. Antoszewski, J; Musca, CA; Dell, JM; Faraone, L
      Characterization of Hg0.7Cd0.3Te n- on p-type structures obtained by reactive ion etching induced p- to n conversion

      JOURNAL OF ELECTRONIC MATERIALS
    65. Dell, JM; Antoszewski, J; Rais, MH; Musca, C; White, JK; Nener, BD; Faraone, L
      HgCdTe mid-wavelength IR photovoltaic detectors fabricated using plasma induced junction technology

      JOURNAL OF ELECTRONIC MATERIALS
    66. Smith, EPG; Musca, CA; Redfern, DA; Dell, JM; Faraone, L
      H-2-based dry plasma etching for mesa structuring of HgCdTe

      JOURNAL OF ELECTRONIC MATERIALS
    67. Fujimura, N; Yamaguchi, T; Kato, H; Ito, T
      Influence of reactive ion etching damage on the Schottky barrier height ofTi/p-Si interface

      APPLIED SURFACE SCIENCE
    68. Diwan, PK; Singh, L; Singh, G; Kumar, S
      Study of heavy ion range in different solid state nuclear track detector materials

      NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS
    69. Dreeskornfeld, L; Segler, R; Haindl, G; Wehmeyer, O; Rahn, S; Majkova, E; Kleineberg, U; Heinzmann, U; Hudek, P; Kostic, I
      Reactive ion etching with end point detection of microstructured Mo/Si multilayers by optical emission spectroscopy

      MICROELECTRONIC ENGINEERING
    70. Ang, TW; Reed, GT; Evans, AGR; Routley, PR; Josey, MR
      Fabrication of silicon-blazed gratings for couplers

      FIBER AND INTEGRATED OPTICS
    71. Zhang, XY; Tang, QL; Yi, XJ; Zhang, Z; Pei, XD
      Cylindrical microlens array fabricated by argon ion-beam etching

      OPTICAL ENGINEERING
    72. Hascik, S; Hrkut, P; Kostic, I; Konecnikova, A
      Dry etching of carbon layers in various etch gases

      VACUUM
    73. Piotrowska, A; Kaminska, E; Piotrowski, TT; Guziewicz, M; Golaszewska, K; Papis, E; Wrobel, J; Perchuc, L
      Application of CCl2F2- and CCl4-based plasmas for RIE of GaSb and related materials

      VACUUM
    74. Kechagias, VG; Gioti, M; Logothetidis, S; Benferhat, R; Teer, D
      'Real-time' multiwavelength ellipsometry diagnostics for monitoring dry etching of Si and TiNx deposition

      THIN SOLID FILMS
    75. Otte, K; Lippold, G; Hirsch, D; Schindler, A; Bigl, F
      XPS and raman investigations of nitrogen ion etching for depth profiling of CuInSe2 and CuGaSe2

      THIN SOLID FILMS
    76. Imai, A; Kamiya, C; Fujimoto, Y; Okuyama, F
      Thinning of surface cones by the focused ion beam technique

      SURFACE SCIENCE
    77. Degawa, M; Minoda, H; Tanishiro, Y; Yagi, K
      Direct-current-induced drift direction of silicon adatoms on Si(111)-(1 x 1) surfaces

      SURFACE SCIENCE
    78. Rais, MH; Musca, CA; Dell, JM; Antoszewski, J; Nener, BD; Faraone, L
      HgCdTe photovoltaic detectors fabricated using a new junction formation technology

      MICROELECTRONICS JOURNAL
    79. Fujiwara, T; Shimizu, D; Kon, K; Isshiki, N; Tsunokuni, H; Aoyagi, S
      A new method for detecting and localizing cell markers endocytosed by fibroblasts in epoxy resin semi-thin sections using scanning electron microscopy combined with energy dispersive X-ray microanalysis after ion-etching

      JOURNAL OF ELECTRON MICROSCOPY
    80. Rais, MH; Musca, CA; Antoszewski, J; Dell, JM; Nener, BD; Faraone, L
      Characterisation of dark current in novel Hg1-xCdxTe mid-wavelength infrared photovoltaic detectors based on n-on-p junctions formed by plasma-induced type conversion

      JOURNAL OF CRYSTAL GROWTH
    81. Guo, QX; Matsuse, M; Nishio, M; Ogawa, H
      Reactive ion etching of indium nitride using CH4 and H-2 gases

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    82. Taguchi, K; Ueguchi, T; Ikeda, M
      A study of ion beam etching of polymethylmethacrylate using N-2 and Na/O-2-mixtures

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    83. Han, S; Yang, SA; Hwang, T; Lee, J; Lee, JD; Shin, H
      Lateral silicon field-emission devices using electron beam lithography

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    84. Awazu, K; Ishii, S; Shima, K
      Formation of individual holes in amorphous SiO2 by swift heavy-ion bombardment followed by wet and dry etching

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    85. Kumazaki, H; Yamada, Y; Oshima, T; Inaba, S; Hane, K
      Micromachining of optical fiber using reactive ion etching and its application

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    86. Saitoh, T; Sogawa, T; Notomi, M; Tamamura, T; Kodama, S; Furuta, T; Ando, H
      GaAs photonic crystals on SiO2 fabricated by very-high-frequency anode-coupled reactive ion etching and wafer bonding

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    87. Makita, T; Toma, K; Ishikawa, K; Zama, H; Tano, H; Tanabe, K
      Fabrication of ramp-edge junction with NdBa2Cu3Oy-based interface-modifiedbarrier

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    88. Kashimura, S; Takeuchi, M; Maru, K; Okano, H
      Loss reduction of GeO2-doped silica waveguide with high refractive index difference by high-temperature annealing

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    89. Maruyama, M; Yoshida, K; Furutani, T; Inagaki, Y; Horibe, M; Inoue, M; Fujimaki, A; Hayakawa, H
      Interface-treated Josephson junctions in trilayer structures

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    90. Raj, MM; Wiedmann, J; Saka, Y; Ebihara, K; Arai, S
      Highly uniform 1.5 mu m wavelength deeply etched semiconductor/benzocyclobutene distributed Bragg reflector lasers

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    91. Sugihara, O; Tomiki, M; Fujimura, H; Egami, C; Okamoto, N; Akizuki, T; Shirai, H
      Heat-resistant polyarylates for waveguide-type device application

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    92. Schilling, A; Nussbaum, P; Ossmann, C; Traut, S; Rossi, M; Schift, H; Herzig, HP
      Miniaturized, focusing fan-out elements: design, fabrication and characterization

      JOURNAL OF OPTICS A-PURE AND APPLIED OPTICS
    93. Ishihara, K; Yung, CF; Ayon, AA; Schmidt, MA
      An inertial sensor technology using DRIE and wafer bonding with interconnecting capability

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    94. Lee, S; Park, S; Cho, D
      The surface/bulk micromachining (SBM) process: A new method for fabricating released MEMS in single crystal silicon

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    95. Yeh, JLA; Jiang, HR; Tien, NC
      Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    96. Mehra, A; Ayon, AA; Waitz, IA; Schmidt, MA
      Microfabrication of high-temperature silicon devices using wafer bonding and deep reactive ion etching

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    97. Gu, CZ; Jiang, X; Jin, ZS
      The preparation of high quality oriented diamond thin films via low temperature and hydrogen ion etched nucleation

      DIAMOND AND RELATED MATERIALS
    98. Schwank, M; Muller, U; Hauert, R; Rossi, R; Volkert, M; Wintermantel, E
      Production of a microelectrode for intracellular potential measurements based on a Pt Ir needle insulated with amorphous hydrogenated carbon

      SENSORS AND ACTUATORS B-CHEMICAL
    99. Ratier, B; Jeong, YS; Moliton, A; Audebert, P
      Vapor deposition polymerization and reactive ion beam etching of poly(p-xylylene) films for waveguide applications

      OPTICAL MATERIALS
    100. Gray, BL; Jaeggi, D; Mourlas, NJ; van Drieenhuizen, BP; Williams, KR; Maluf, NI; Kovacs, GTA
      Novel interconnection technologies for integrated microfluidic systems

      SENSORS AND ACTUATORS A-PHYSICAL


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Documento generato il 19/01/21 alle ore 01:10:05