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La ricerca find articoli where soggetti phrase all words 'FLIP-CHIP BONDING' sort by level,fasc_key/DESCEND, pagina_ini_num/ASCEND ha restituito 42 riferimenti
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    1. Maezawa, M; Yamamori, H; Shoji, A
      Demonstration of chip-to-chip propagation of single flux quantum pulses

      IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
    2. Prather, DW; Venkataraman, S; Lecompte, M; Kiamilev, F; Mait, JN; Simonis, GJ
      Optoelectronic multichip module integration for chip level optical interconnects

      IEEE PHOTONICS TECHNOLOGY LETTERS
    3. Ishii, T; Aoyama, S; Tokumitsu, M
      Fabrication of 0.95Sn-0.05Au solder micro-bumps for flip-chip bonding

      JOURNAL OF ELECTRONIC MATERIALS
    4. Jordanov, VT; Macri, JR; Clayton, JE; Larson, KA
      Multi-electrode CZT detector packaging using polymer flip chip bonding

      NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT
    5. Sun, M
      Conductivity of conductive polymer for flip chip bonding and BGA socket

      MICROELECTRONICS JOURNAL
    6. Takahashi, K; Terao, H; Tomita, Y; Yamaji, Y; Hoshino, M; Sato, T; Morifuji, T; Sunohara, M; Bonkohara, M
      Current status of research and development for three-dimensional chip stack technology

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    7. Hizukuri, M; Watanabe, N; Asano, T
      Dynamic strain and chip damage during ultrasonic flip chip bonding

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    8. McLaren, TS; Lee, YC
      Modeling and evaluation criterion for thermocompression flip-chip bonding

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    9. Joo, GC; Lee, SH; Park, KS; Choi, JS; Hwang, N; Song, MK
      A novel bidirectional optical coupling module for subscribers

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    10. Chen, KY; Zenner, RLD; Arneson, M; Mountain, D
      Ultra-thin electronic device package

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    11. Tilmans, HAC; Van de Peer, MDJ; Beyne, E
      The indent reflow sealing (IRS) technique - A method for the fabrication of sealed cavities for MEMS devices

      JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
    12. Milanovic, V; Maharbiz, M; Pister, KSJ
      Batch transfer integration of RF microrelays

      IEEE MICROWAVE AND GUIDED WAVE LETTERS
    13. Edman, CF; Swint, RB; Gurtner, C; Formosa, RE; Roh, SD; Lee, KE; Swanson, PD; Ackley, DE; Coleman, JJ; Heller, MJ
      Electric field directed assembly of an InGaAs LED onto silicon circuitry

      IEEE PHOTONICS TECHNOLOGY LETTERS
    14. Krishnamoorthy, AV; Goossen, KW; Chirovsky, LMF; Rozier, RG; Chandramani, P; Hobson, WS; Hui, SP; Lopata, J; Walker, JA; D'Asaro, LA
      16 x 16 VCSEL array flip-chip bonded to CMOS VLSI circuit

      IEEE PHOTONICS TECHNOLOGY LETTERS
    15. Krishnamoorthy, AV; Chirovsky, LMF; Hobson, WS; Lopata, J; Shah, J; Rozier, R; Cunningham, JE; D'Asaro, LA
      Small-signal characteristics of bottom-emitting intracavity contacted VCSEL's

      IEEE PHOTONICS TECHNOLOGY LETTERS
    16. Xu, JJ; Keller, S; Parish, G; Heikman, S; Mishra, UK; York, RA
      A 3-10-GHz GaN-based flip-chip integrated broad-band power amplifier

      IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
    17. Datta, M; Merritt, SA; Dagenais, M
      Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL's)

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    18. Oh, KW; Ahn, CH
      A new flip-chip bonding technique using micromachined conductive polymer bumps

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    19. Itagaki, M; Amami, K; Tomura, Y; Yuhaku, S; Ishimaru, Y; Bessho, Y; Eda, K; Ishida, T
      Packaging properties of ALIVH-CSP using SBB flip-chip bonding technology

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    20. Segawa, M; Ono, M; Musha, S; Kishimoto, Y; Ohashi, A
      A CMOS image sensor module applied for a digital still camera utilizing the TAB on glass (TOG) bonding method

      IEEE TRANSACTIONS ON ADVANCED PACKAGING
    21. Pu, R; Hayes, EM; Wilmsen, CW; Choquette, KD; Hou, HQ; Geib, KM
      Comparison of techniques for bonding VCSELS directly to ICs

      JOURNAL OF OPTICS A-PURE AND APPLIED OPTICS
    22. Pu, R; Duan, CJ; Wilmsen, CW
      Hybrid integration of VCSEL's to CMOS integrated circuits

      IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
    23. Oh, KW; Ahn, CH; Roenker, KP
      Flip-chip packaging using micromachined conductive polymer bumps and alignment pedestals for MOEMS

      IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
    24. Kato, T; Sasaki, J; Shimoda, T; Hatakeyama, H; Tamanuki, T; Kitamura, S; Yamaguchi, M; Sasaki, T; Komatsu, K; Kitamura, M; Itoh, M
      Hybrid integrated 4 x 4 optical matrix switch module on silica based planar waveguide platform

      IEICE TRANSACTIONS ON ELECTRONICS
    25. Takahashi, K; Ogura, H; Sagawa, M
      Miniaturized millimeter-wave hybrid IC technology using non-photosensitivemulti-layered BCB thin films and stud bump bonding

      IEICE TRANSACTIONS ON ELECTRONICS
    26. Ito, M; Maruhashi, K; Kusamitsu, H; Morishita, Y; Ohata, K
      Millimeter-wave flip-chip MMIC structure with high performance and high reliability interconnects

      IEICE TRANSACTIONS ON ELECTRONICS
    27. Kato, T; Sasaki, J; Shimoda, T; Hatakeyama, H; Tamanuki, T; Kitamura, S; Yamaguchi, M; Sasaki, T; Komatsu, K; Kitamura, M; Itoh, M
      Hybrid integrated 4 x 4 optical matrix switch module on silica based planar waveguide platform

      IEICE TRANSACTIONS ON COMMUNICATIONS
    28. Ohyama, T; Akahori, Y; Yanagisawa, M; Tsunetsugu, H; Mino, S
      Assembly and electrical wiring technologies on planar lightwave circuit (PLC) platform providing hybrid integration of optoelectronic devices and integrated circuits (ICs)

      IEICE TRANSACTIONS ON COMMUNICATIONS
    29. Belouet, C; Villard, C; Fages, C; Keller, D
      Achievement of homogeneous AuSn solder by pulsed laser-assisted deposition

      JOURNAL OF ELECTRONIC MATERIALS
    30. Sim, JH; Lee, JH
      A piezoresistive silicon accelerometer using porous silicon micromachiningand flip-chip bonding

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    31. TAN Q; ZHANG WG; SCHAIBLE B; BOND LJ; JU TH; LEE YC
      THERMOSONIC FLIP-CHIP BONDING USING LONGITUDINAL ULTRASONIC VIBRATION

      IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
    32. HAN HS; CHUNG HS; JOE YI; PARK SS; JOO GC; HWANG N; SONG MY
      THE APPLICATION OF FLIP-CHIP BONDING INTERCONNECTION TECHNIQUE ON THEMODULE ASSEMBLY OF 10 GBPS LASER-DIODE

      Journal of electronic materials
    33. FUKUDA Y; IIDA A; KIZAKI Y; MORI M
      AN INVESTIGATION OF BONDING MECHANISM FOR AU-AL SOLID-PHASE DIFFUSIONFLIP-CHIP BONDING

      Electronics & communications in Japan. Part 2, Electronics
    34. KUO JM; WANG YC; GOOSSEN KW; CHIROVSKY LMF; HUI SP; TSENG BT; WALKER J; LENTINE AL; LEIBENGUTH RE; LIVESCU G; JAN WY; CUNNINGHAM JE; DASARO LA; RON A; DAHRINGER D; KOSSIVES D; BACON DD; MORRISON RL; NOVOTNY RA; BUCHHOLZ DB; MAYO WE
      LARGE ARRAY OF GAAS MODULATORS AND DETECTORS FLIP-CHIP SOLDER BONDED TO SILICON CMOS USING INGAP AS THE SELECTIVE ETCH-STOP FOR GAAS SUBSTRATE REMOVAL

      Journal of crystal growth
    35. DEPESTEL G; AMBROSY A; TAN QS; VRANA M; MIGOM F; RICHTER H; VANDEWEGE J; VETTER P
      MULTICHANNEL OPTICAL MODULES COMPATIBLE WITH THE FIBER-IN-BOARD TECHNOLOGY

      IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
    36. AMBROSY A; RICHTER H; HEHMANN J; FERLING D
      SILICON MOTHERBOARDS FOR MULTICHANNEL OPTICAL MODULES

      IEEE transactions on components, packaging, and manufacturing technology. Part A
    37. KRISHNAMOORTHY AV; FORD JE; GOOSSEN KW; WALKER JA; LENTINE AL; HUI SP; TSENG B; CHIROVSKY LMF; LEIBENGUTH R; KOSSIVES D; DAHRINGER D; DASARO LA; KIAMILEV FE; APLIN GF; ROZIER RG; MILLER DAB
      PHOTONIC PAGE BUFFER BASED ON GAAS MULTIPLE-QUANTUM-WELL MODULATORS BONDED DIRECTLY OVER ACTIVE SILICON COMPLEMENTARY-METAL-OXIDE-SEMICONDUCTOR (CMOS) CIRCUITS

      Applied optics
    38. OGASHIWA T; NAKAGAWA H; AKIMOTO H; SHIGYO H; TAKADA S
      FLIP-CHIP BONDING USING SUPERCONDUCTING SOLDER BUMP

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    39. ACKLIN B; JAHNS J
      PACKAGING CONSIDERATIONS FOR PLANAR OPTICAL INTERCONNECTION SYSTEMS

      Applied optics
    40. ONISHI K; SEKI S; TAGUCHI Y; BESSHO Y; EDA K; ISHIDA T
      AN APPLICATION OF A FLIP-CHIP-BONDING TECHNIQUE TO GHZ-BAND SAW FILTERS FOR MOBILE COMMUNICATION

      IEICE transactions on electronics
    41. KUSAKA T; SENBA N; NISHIZAWA A; TAKAHASHI N; SHIMOTO T; KOIKE T
      A SILICON-ON-SILICON RISC MODULE

      NEC research & development
    42. NAGANO T; UEDA E; ONAYAMA S; KATAYAMA R; HAMADA H; ONO Y
      THIN OPTICAL HEAD WITH FLIP-CHIP BONDED MODULE FOR COMPACT DISC READ ONLY MEMORY DRIVES

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS


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Documento generato il 29/10/20 alle ore 13:16:56