Catalogo Articoli (Spogli Riviste)

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La ricerca find articoli where soggetti phrase all words 'ELECTRONIC COMPONENTS' sort by level,fasc_key/DESCEND, pagina_ini_num/ASCEND ha restituito 19 riferimenti
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    1. Eriksson, P; Carlsson, B; Wallinder, IO
      Design of accelerated corrosion tests for electronic components in automotive applications

      IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
    2. Lanin, VL
      Ultrasonic soldering in electronics

      ULTRASONICS SONOCHEMISTRY
    3. Hung, TC
      A conceptual design of thermal modeling for efficiently cooling an array of heated devices under low Reynolds numbers

      NUMERICAL HEAT TRANSFER PART A-APPLICATIONS
    4. Bilen, K; Yapici, S; Celik, C
      A Taguchi approach for investigation of heat transfer from a surface equipped with rectangular blocks

      ENERGY CONVERSION AND MANAGEMENT
    5. Huang, YJ; Fu, SL; Jen, SL; Guo, MH
      Fuzzy thermal modeling for MCM placement

      MICROELECTRONICS JOURNAL
    6. Bessaih, R; Kadja, M
      Turbulent natural convection cooling of electronic components mounted on avertical channel

      APPLIED THERMAL ENGINEERING
    7. Craig, KJ; de Kock, DJ; Gauche, P
      Minimization of heat sink mass using CFD and mathematical optimization

      JOURNAL OF ELECTRONIC PACKAGING
    8. Bevan, MG; Romenesko, BM
      Modern electronic packaging technology

      JOHNS HOPKINS APL TECHNICAL DIGEST
    9. Young, TJ; Vafai, K
      Experimental and numerical investigation of forced convective characteristics of arrays of channel mounted obstacles

      JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
    10. CHEN YM; WANG KC
      EXPERIMENTAL-STUDY ON THE FORCED CONVECTIVE FLOW IN A CHANNEL WITH HEATED BLOCKS IN TANDEM

      Experimental thermal and fluid science
    11. BINET B; LACROIX M
      NUMERICAL-ANALYSIS OF MELTING IN RECTANGULAR ENCLOSURES HEATED UNIFORMLY OR DISCRETELY BY THE CONDUCTING SIDE WALLS

      Revue generale de thermique
    12. RHI SH; KIM WT; LEE Y
      COOLING SYSTEM USING WICKLESS HEAT PIPES FOR MULTICHIP MODULES - EXPERIMENT AND ANALYSIS

      KSME International Journal
    13. SEIFERT CC; STIMLER M
      ENTOREL DATABASE FOR ELECTRONIC COMPONENTS UNDER GAMMA-RADIATION - A DESCRIPTION

      IEEE robotics & automation magazine
    14. EVANS JW; EVANS JY; YU BK
      DESIGNING AND BUILDING-IN RELIABILITY IN ADVANCED MICROELECTRONIC ASSEMBLIES AND STRUCTURES

      IEEE transactions on components, packaging, and manufacturing technology. Part A
    15. KONSTANTINOU ND; STUBOS AK; STATHARAS JC; KANELLOPOULOS NK; PAPAIOANNOU AC
      ENHANCED BOILING HEAT-TRANSFER IN POROUS LAYERS WITH APPLICATION TO ELECTRONIC-COMPONENT COOLING

      Journal of enhanced heat transfer
    16. CHEN YM; WANG KC
      SIMULATION AND MEASUREMENT OF TURBULENT HEAT-TRANSFER IN A CHANNEL WITH A SURFACE-MOUNTED RECTANGULAR HEATED BLOCK

      Heat and mass transfer
    17. VIANCO PT; HOSKING FM; REJENT JA
      ULTRASONIC SOLDERING FOR STRUCTURAL AND ELECTRONIC APPLICATIONS

      Welding journal
    18. KONCZAKOWSKA A
      QUALITY AND 1 F NOISE OF ELECTRONIC COMPONENTS/

      Quality and reliability engineering international
    19. MENDES PRS
      THE NAPHTHALENE SUBLIMATION TECHNIQUE

      Experimental thermal and fluid science


ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 11/08/20 alle ore 22:06:41