Catalogo Articoli (Spogli Riviste)

HELP
ATTENZIONE: attualmente gli articoli Current Contents (fonte ISI) a partire dall'anno 2002 sono consultabili sulla Risorsa On-Line

Le informazioni sugli articoli di fonte ISI sono coperte da copyright

La ricerca find articoli where soggetti phrase all words 'ELECTROMIGRATION' sort by level,fasc_key/DESCEND, pagina_ini_num/ASCEND ha restituito 638 riferimenti
Si mostrano 100 riferimenti a partire da 1
Selezionare un intervallo

Per ulteriori informazioni selezionare i riferimenti di interesse.

    1. HIGASHIHARA T; KINOSHITA K; SATO S; KOZAKI T
      Electromigration of sodium ions and electro-osmotic flow in water-saturated, compacted Na-montmorillonite

      Applied clay science
    2. Banerjee, K; Mehrotra, A
      Global (interconnect) warming

      IEEE CIRCUITS & DEVICES
    3. Mingo, N; Yang, L; Han, J
      Current-induced forces upon atoms adsorbed on conducting carbon nanotubes

      JOURNAL OF PHYSICAL CHEMISTRY B
    4. Lin, HH; Cheng, SL; Chen, LJ
      Electromigration of Cu and Ti atoms and dopant junction profiles in the p(+)-Si implanted channel under high-density current

      MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
    5. Field, DP; Dornisch, D; Tong, HH
      Investigating the microstructure-reliability relationship in Cu damascene lines

      SCRIPTA MATERIALIA
    6. Bertolino, N; Garay, J; Anselmi-Tamburini, U; Munir, ZA
      Electromigration effects in Al-Au multilayers

      SCRIPTA MATERIALIA
    7. Park, YJ; Joo, YC
      Electromigration-induced stress interaction between vias and polygranular clusters

      SCRIPTA MATERIALIA
    8. Divinski, S; Lohmann, M; Herzig, C
      Ag grain boundary diffusion and segregation in Cu: Measurements in the types B and C diffusion regimes

      ACTA MATERIALIA
    9. Yoo, S; Kim, YH; Yoon, CS
      Effect of the Ti-underlayer microstructure on the texture of Al thin films

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    10. Li, S; Lee, YK; Gao, W; White, T; Dong, ZL; Latt, KM
      High density diffusion barrier of ionized metal plasma deposited Ti in Al-0.5%Cu/Ti/SiO2/Si structure

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    11. Gluzman, S; Sornette, D
      Self-consistent theory of rupture by progressive diffuse damage - art. no.066129

      PHYSICAL REVIEW E
    12. Lodder, A
      On the 'mature' wind force and a 'laggard' direct force in electromigration

      DEFECTS AND DIFFUSION IN METALS III
    13. Liu, CL; Liu, XY; Borucki, LJ
      Defects and diffusion in Al and Al-Cu alloy

      DEFECTS AND DIFFUSION IN METALS III
    14. de Pablo, PJ; Colchero, J; Gomez-Herrero, J; Serena, PA; Baro, AM
      Thermal maps of gold micro-stripes obtained using scanning force microscopy

      NANOTECHNOLOGY
    15. Pennetta, C; Reggiani, L; Trefan, G
      Scaling relations and universality in electrical failure processes of thinfilms: is it possible to predict failure times?

      COMPUTATIONAL MATERIALS SCIENCE
    16. Pennetta, C; Reggiani, L
      Electrical instability of thin films driven by Joule heating

      COMPUTATIONAL MATERIALS SCIENCE
    17. Khenner, M; Averbuch, A; Israeli, M; Nathan, M; Glickman, E
      Level set modeling of transient electromigration grooving

      COMPUTATIONAL MATERIALS SCIENCE
    18. Tan, CM; Yeo, KNC
      A reliability statistics perspective on the pitfalls of standard wafer-level electromigration accelerated test (SWEAT)

      JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS
    19. Park, YB; Lee, DW
      Effects of Ti and TiN underlayers on electromigration reliability of Al-Cuinterconnects

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    20. Liu, CY; Lee, S; Chuang, TJ
      Grain boundary crack growth in interconnects with an electric current

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    21. Latt, KM; Lee, K; Osipowicz, T; Lee, YK
      Properties of electroplated copper thin film and its interfacial reactionsin the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    22. Chernyak, L; Ghabboun, J; Lyahovitskaya, V; Cahen, D
      Electric field-induced fabrication of microscopic Si-based optoelectronic devices for 1.55 and 1.16 mu m IR electroluminescence

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    23. Lucadamo, G; Barmak, K; Rodbell, KP
      Texture in Ti/Al and Nb/Al multilayer thin films: Role of Cu

      JOURNAL OF MATERIALS RESEARCH
    24. Yongsunthon, R; McCoy, J; Williams, ED
      Calibrated magnetic force microscopy measurement of current-carrying lines

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
    25. Pennetta, C; Reggiani, L; Trefan, G
      A Monte Carlo percolative approach to reliability analysis of semiconductor structures

      MATHEMATICS AND COMPUTERS IN SIMULATION
    26. Gungor, MR; Maroudas, D
      Modeling of electromechanically-induced failure of passivated metallic thin films used in device interconnections

      INTERNATIONAL JOURNAL OF FRACTURE
    27. Goldstein, RV; Sarychev, ME; Shirabaikin, DB; Vladimirov, AS; Zhitnikov, YV
      Modeling electromigration and the void nucleation in thin-film interconnects of integrated circuits

      INTERNATIONAL JOURNAL OF FRACTURE
    28. Glickman, EE
      Creep and contact opening electromigration failures in miniaturized interconnects

      INTERNATIONAL JOURNAL OF FRACTURE
    29. Timm, F; Moller, P
      The relation between electric and redox potential: evidence from laboratory and field measurements

      JOURNAL OF GEOCHEMICAL EXPLORATION
    30. Liu, CL
      Modeling and simulation for microelectronic materials research

      PHYSICA STATUS SOLIDI B-BASIC RESEARCH
    31. Savenko, VN; Nasimov, DA; Latyshev, AV; Aseev, AL
      The odering of gold nanoclusters on the silicon surface

      IZVESTIYA AKADEMII NAUK SERIYA FIZICHESKAYA
    32. Lee, WH; Ko, YK; Jang, JH; Kim, CS; Reucroft, PJ; Lee, JG
      Microstructure control of copper films by the addition of molybdenum in anadvanced metallization process

      JOURNAL OF ELECTRONIC MATERIALS
    33. Besser, PR; Zschech, E; Blum, W; Winter, D; Ortega, R; Rose, S; Herrick, M; Gall, M; Thrasher, S; Tiner, M; Baker, B; Braeckelmann, G; Zhao, L; Simpson, C; Capasso, C; Kawasaki, H; Weitzman, E
      Microstructural characterization of inlaid copper interconnect lines

      JOURNAL OF ELECTRONIC MATERIALS
    34. Huang, JS; Gates, AS; Kang, SH; Shofner, TL; Ashton, RA; Obeng, YS
      Comparative study on the effect of misalignment on bordered and borderlesscontacts

      JOURNAL OF ELECTRONIC MATERIALS
    35. Shen, YL
      Local Joule heating and overall resistance increase in void-containing aluminum interconnects

      JOURNAL OF ELECTRONIC MATERIALS
    36. Hau-Riege, CS; Hau-Riege, SP; Thompson, CV
      Simulation of microstructural evolution induced by scanned laser annealingof metallic interconnects

      JOURNAL OF ELECTRONIC MATERIALS
    37. Krstic, A; Jiang, YM; Cheng, KT
      Pattern generation for delay testing and dynamic timing analysis considering power-supply noise effects

      IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
    38. Mrosk, JW; Berger, L; Ettl, C; Fecht, HJ; Fischerauer, G; Dommann, A
      Materials issues of SAW sensors for high-temperature applications

      IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
    39. Zehe, A
      The stress-induced escape of migrating aluminium from silicide interconnects

      SEMICONDUCTOR SCIENCE AND TECHNOLOGY
    40. Murarka, SP
      Materials aspects of copper interconnection technology for semiconductor applications

      MATERIALS SCIENCE AND TECHNOLOGY
    41. Kish, LB; Chaoguang, P; Ederth, J; Marlow, WH; Granqvist, CG; Savage, SJ
      In situ electrical transport measurements and self-organization in gold nanoparticle films during and after deposition

      SURFACE & COATINGS TECHNOLOGY
    42. Li, CY; He, L; Wu, JJ; Qian, Y; Koh, LT; Yu, B; Foo, PD; Xie, J; Zhang, DH
      Comparative study of ionized metal plasma Ta, TaN and multistacked Ta/TaN structure as diffusion barriers for Cu metallization

      SURFACE REVIEW AND LETTERS
    43. Bocek, P; Gebauer, P; Beckers, JL
      Success and failure with phthalate buffers in capillary tone electrophoresis

      ELECTROPHORESIS
    44. Baunack, S; Kotter, TG; Wendrock, H; Wetzig, K
      AES analysis of failures in Cu based electromigration test samples

      APPLIED SURFACE SCIENCE
    45. Pierre-Louis, O; Einstein, TL
      Electromigration of single-layer clusters

      APPLIED SURFACE SCIENCE
    46. Rous, PJ
      Theory of surface electromigration on heterogeneous metal surfaces

      APPLIED SURFACE SCIENCE
    47. Sakamoto, K; Wu, NJ; Natori, A; Yasunaga, H
      Surface electromigration of In on vicinal Si(001)

      APPLIED SURFACE SCIENCE
    48. Wu, NJ; Shimizu, S; Hermie, MT; Sakamoto, K; Natori, A; Yasunaga, H
      Surface electromigration of Au ultrathin film on MoS2

      APPLIED SURFACE SCIENCE
    49. Azzam, R; Oey, W
      The utilization of electrokinetics in geotechnical and environmental engineering

      TRANSPORT IN POROUS MEDIA
    50. MacDowell, AA; Celestre, RS; Tamura, N; Spolenak, R; Valek, B; Brown, WL; Bravman, JC; Padmore, HA; Batterman, BW; Patel, JR
      Submicron X-ray diffraction

      NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT
    51. Pal, DK; Pandey, SM; Jain, H; Roy, JN
      Model for metal interconnection design rule optimization

      MICROELECTRONIC ENGINEERING
    52. Gonella, R
      Key reliability issues for copper integration in damascene architecture

      MICROELECTRONIC ENGINEERING
    53. Pennetta, C; Reggiani, L; Trefan, G; Fantini, F; DeMunari, I; Scorzoni, A
      A percolative simulation of electromigration phenomena

      MICROELECTRONIC ENGINEERING
    54. Alford, TL; Zeng, YX; Nguyen, P; Chen, LH; Mayer, JW
      Self-encapsulation effects on the electromigration resistance of silver lines

      MICROELECTRONIC ENGINEERING
    55. Bradley, RM
      Transverse instability of solitons propagating on current-carrying metal thin films

      PHYSICA D
    56. Ghosh, A; Raychaudhuri, AK
      Electric-field-induced migration of oxygen ions in epitaxial metallic oxide films: Non-Debye relaxation and 1/f noise - art. no. 104304

      PHYSICAL REVIEW B
    57. Degawa, M; Minoda, H; Tanishiro, Y; Yagi, K
      In-phase step wandering on Si(111) vicinai surfaces: Effect of direct current heating tilted from the step-down direction - art. no. 045309

      PHYSICAL REVIEW B
    58. Zschech, E; Blum, W; Zienert, I; Besser, PR
      Effect of copper line geometry and process parameters on interconnect microstructure and degradation processes

      ZEITSCHRIFT FUR METALLKUNDE
    59. Huang, JS; Deng, XJ; Yih, PH; Shofner, TL; Obeng, YS; Darling, C
      Effect of silicon nitride capping layer on via electromigration and failure criterion methodology in multilevel interconnection

      THIN SOLID FILMS
    60. Moritz, W; Roth, U; Heyde, M; Rademann, K; Reichling, M; Hartmann, J
      Submicrosecond range surface heating and temperature measurement for efficient sensor reactivation

      THIN SOLID FILMS
    61. Obeng, YS; Kang, SH; Huang, JS; Oates, AS; Lin, X; Obeng, JS
      Impact of post via-etch cleans on mechanical reliability of W-plug vias

      THIN SOLID FILMS
    62. Rodriguez-Navarro, AB
      Model of texture development in polycrystalline films growing on amorphoussubstrates with different topographies

      THIN SOLID FILMS
    63. Filippi, RG; Gribelyuk, MA; Joseph, T; Kane, T; Sullivan, TD; Clevenger, LA; Costrini, G; Gambino, J; Iggulden, RC; Kiewra, EW; Ning, XJ; Ravikumar, R; Schnabel, RF; Stojakovic, G; Weber, SJ; Gignac, LM; Hu, CK; Rath, DL; Rodbell, KP
      Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching

      THIN SOLID FILMS
    64. Yoo, S; Eun, BS; Kim, YH; Chung, YC
      The effect of low dielectric polymer thickness on the electromigration characteristics of Al(1% Cu-0.5% Si) thin films

      THIN SOLID FILMS
    65. Sato, M; Uwaha, M; Saito, Y
      Growth of permeable step bunches formed by drift of adatoms

      SURFACE SCIENCE
    66. Minoda, H; Morishima, I; Degawa, M; Tanishiro, Y; Yagi, K
      Time evolution of DC heating-induced in-phase step wandering on Si(111) vicinal surfaces

      SURFACE SCIENCE
    67. Degawa, M; Thurmer, K; Morishima, I; Minoda, H; Yagi, K; Williams, ED
      Initial stage of in-phase step wandering on Si(111) vicinal surfaces

      SURFACE SCIENCE
    68. Metois, JJ; Heyraud, JC; Stoyanov, S
      Step flow growth of vicinal (111)Si surface at high temperatures: step kinetics or surface diffusion control

      SURFACE SCIENCE
    69. Nielsen, JF; Pettersen, MS; Pelz, JP
      Anisotropy of mass transport on Si(001) surfaces heated with direct current

      SURFACE SCIENCE
    70. Weber, U; Houbertz, R; Hartmann, U
      Modification of thin gold films with the scanning tunneling microscope

      SURFACE SCIENCE
    71. Kang, SH; Shin, E
      A three-dimensional nonlinear analysis of electromigration-induced resistance change and Joule heating in microelectronic interconnects

      SOLID-STATE ELECTRONICS
    72. Wu, W; Yuan, JS
      Copper electromigration modeling including barrier layer effect

      SOLID-STATE ELECTRONICS
    73. Wu, W; Yuan, JS; Kang, SH; Oates, AS
      Electromigration subjected to Joule heating under pulsed DC stress

      SOLID-STATE ELECTRONICS
    74. Mauerhofer, E; Kling, O; Rosch, F
      Electroosmotic effects in the determination of ion mobilities of carrier-free radionuclides in free aqueous electrolyte solutions

      RADIOCHIMICA ACTA
    75. Degawa, M; Minoda, H; Tanishiro, Y; Yagi, K
      New phase diagram of step instabilities on Si(111) vicinal surfaces induced by DC annealing

      JOURNAL OF THE PHYSICAL SOCIETY OF JAPAN
    76. Pierre-Louis, O
      Continuum model for low temperature relaxation of crystal steps - art. no.106104

      PHYSICAL REVIEW LETTERS
    77. Pierre-Louis, O; Haftel, MI
      Oscillatory driving of crystal surfaces: A route to controlled pattern formation - art. no. 048701

      PHYSICAL REVIEW LETTERS
    78. Wu, LF; Liu, ZH
      Full-chip reliability simulation for VDSM integrated circuits

      MICROELECTRONICS RELIABILITY
    79. Sukharev, V; Shieh, BP; Choudhury, R; Park, C; Saraswat, KC
      Reliability studies on multilevel interconnection with intermetal dielectric air gaps

      MICROELECTRONICS RELIABILITY
    80. Ji, Y; Li, ZG; Wang, D; Cheng, YH; Luo, D; Zong, B
      Scanning thermal microscopy studies of local temperature distribution of micron-sized metallization lines

      MICROELECTRONICS RELIABILITY
    81. Dion, MJ
      Improved understanding of metal ion reservoirs within barrier-metal systems

      MICROELECTRONICS RELIABILITY
    82. Tang, ZR; Shi, FG
      Effects of preexisting voids on electromigration failure of flip chip solder bumps

      MICROELECTRONICS JOURNAL
    83. Tang, Z; Shi, FG
      Stochastic simulation of electromigration failure of flip chip solder bumps

      MICROELECTRONICS JOURNAL
    84. Garikipati, K; Bassman, L; Deal, M
      A lattice-based micromechanical continuum formulation for stress-driven mass transport in polycrystalline solids

      JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS
    85. Latt, KM; Lee, YK; Van Kan, JA; Mahabai, AA
      Study on electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure

      JOURNAL OF MATERIALS SCIENCE
    86. Khenner, M; Averbuch, A; Israeli, M; Nathan, M
      Numerical simulation of grain-boundary grooving by level set method

      JOURNAL OF COMPUTATIONAL PHYSICS
    87. Kirsch, PD; Ekerdt, JG
      Chemical and thermal reduction of thin films of copper (II) oxide and copper (I) oxide

      JOURNAL OF APPLIED PHYSICS
    88. Rous, PJ
      Theoretical study of the surface resistivity of (111) surfaces of NixPt1-x(111) alloys

      JOURNAL OF APPLIED PHYSICS
    89. Hau-Riege, SP; Thompson, CV
      Experimental characterization and modeling of the reliability of interconnect trees

      JOURNAL OF APPLIED PHYSICS
    90. Mondal, K; Mandich, NV; Lalvani, SB
      Regeneration of hexavalent chromium using a Bi-doped PbO2 anode

      JOURNAL OF APPLIED ELECTROCHEMISTRY
    91. Tsui, BY; Fang, KL; Lee, SD
      Electrical instability of low-dielectric constant diffusion barrier film (a-SiC : H) for copper interconnect

      IEEE TRANSACTIONS ON ELECTRON DEVICES
    92. Havemann, RH; Hutchby, JA
      High-performance interconnects: An integration overview

      PROCEEDINGS OF THE IEEE
    93. Singh, RP; Rosakis, AJ
      Determination of the yield properties of thin films using enhanced coherent gradient sensing

      EXPERIMENTAL MECHANICS
    94. Lee, KW; Lee, S; Park, JW
      Electroplated Cu and sputtered Ta crystallographic texture degradation in Cu/Ta/SiOF layered structures

      JOURNAL OF THE ELECTROCHEMICAL SOCIETY
    95. Hsu, HH; Lin, KH; Lin, SJ; Yeh, JW
      Electroless copper deposition for ultralarge-scale integration

      JOURNAL OF THE ELECTROCHEMICAL SOCIETY
    96. Chankvetadze, B; Kartozia, I; Burjanadze, N; Bergenthal, D; Luftmann, H; Blaschke, G
      Enantioseperation of chiral phenothiazine derivatives in capillary electrophoresis using cyclodextrin type chiral selectors

      CHROMATOGRAPHIA
    97. Jackman, SA; Maini, G; Sharman, AK; Sunderland, G; Knowles, CJ
      Electrokinetic movement and biodegradation of 2,4-dichlorephenoxyacetic acid in silt soil

      BIOTECHNOLOGY AND BIOENGINEERING
    98. Gartsman, K; Cahen, D; Scheer, R
      Electric field-induced junctions in epitaxial layers of CuInSe2

      APPLIED PHYSICS LETTERS
    99. Herley, PJ; Greer, AL; Jones, W
      Hillock formation on copper at room temperature by cleaning in ammonia vapor

      APPLIED PHYSICS LETTERS
    100. Xu, GY; Su, X; Stagarescu, CB; Eastman, DE; Lai, B; Cai, Z; Noyan, IC; Hu, CK
      Quantitative metrology study of Cu/SiO2 interconnect structures using fluorescence x-ray microscopy

      APPLIED PHYSICS LETTERS


ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 22/10/20 alle ore 21:19:11