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La ricerca find articoli where soggetti phrase all words 'AL ETCHING' sort by level,fasc_key/DESCEND, pagina_ini_num/ASCEND ha restituito 10 riferimenti
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    1. Baek, KH; Park, C; Lee, WG
      Role of O-2 in aluminum etching with BCl3/Cl-2/O-2 plasma in high density plasma reactor

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    2. YOKOYAMA T; YAMADA Y; KISHIMOTO K; USAMI T; KAWAMOTO H; UENO K; GOMI H
      A 0.7-MU-M-PITCH DOUBLE LEVEL AL INTERCONNECTION TECHNOLOGY FOR 1-GBIT DRAMS USING SIO2 MASK AL ETCHING AND PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION SIOF

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    3. KIM YS; JI HY; HAN KS; SONG CW
      SECONDARY CORROSION OF ALUMINUM-ALLOY DUE TO RESIDUAL SIDEWALL AND ITS REMOVAL USING M=0 HELICON PLASMA REACTOR

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    4. BANJO T; TSUCHIHASHI M; HANAZAKI M; TUDA M; ONO K
      EFFECTS OF O-2 ADDITION ON BCL3 CL-2 PLASMA CHEMISTRY FOR AL ETCHING/

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    5. KAZUMI H; HAMASAKI R; TAGO K
      RADICAL AND ION COMPOSITIONS OF BCL3 CL-2 PLASMA AND THEIR RELATION TO ALUMINUM ETCH CHARACTERISTICS/

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    6. TSUKADA T; NOGAMI H; NAKAGAWA Y; WANI E
      ETCHING CHARACTERISTICS BY M=0 HELICON WAVE PLASMA

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    7. SAKUMA K; YAGI S; IMAI K
      STUDY OF A VEIL STRUCTURE AND A 2-STEP CORROSION SUPPRESSION PROCESS IN AL-SI-CU ETCHING

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    8. JIWARI N; IWASAWA H; NARAI A; SAKAUE H; SHINDO H; SHOJI T; HORIIKE Y
      AL ETCHING CHARACTERISTICS EMPLOYING HELICON WAVE PLASMA

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    9. JIMBO S; SHIMOMURA K; OHIWA T; SEKINE M; MORI H; HORIOKA K; OKANO H
      RESIST AND SIDEWALL FILM REMOVAL AFTER AL REACTIVE ION ETCHING (RIE) EMPLOYING F+H2O DOWNSTREAM ASHING

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    10. UCHIDA T; AOKI H; HANE M; HASEGAWA S; IKAWA E
      MODEL FOR AL ETCH-RATE ENHANCEMENT AT LOW-TEMPERATURES

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS


ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 22/01/21 alle ore 03:47:32