Catalogo Articoli (Spogli Riviste)

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La ricerca find articoli where authors phrase all words ' RENNAU M' sort by level,fasc_key/DESCEND, pagina_ini_num/ASCEND ha restituito 8 riferimenti
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    1. Riedel, S; Schulz, SE; Baumann, J; Rennau, M; Gessner, T
      Influence of different treatment techniques on the barrier properties of MOCVD TiN against copper diffusion

      MICROELECTRONIC ENGINEERING
    2. Konig, D; Rennau, M; Henker, M; Ebest, G
      Evidence of a high density of fixed negative charges in an insulation layer compound on silicon

      THIN SOLID FILMS
    3. Mrwa, A; Ebest, G; Rennau, M; Beyer, A
      Comparison of different emitter diffusion methods for MINP solar cells: Thermal diffusion and RTP

      SOLAR ENERGY MATERIALS AND SOLAR CELLS
    4. Uhlig, M; Bertz, A; Rennau, M; Schulz, SE; Werner, T; Gessner, T
      Electrical and adhesion properties of plasma-polymerised ultra-low k dielectric films with high thermal stability

      MICROELECTRONIC ENGINEERING
    5. BAUMANN J; WERNER T; EHRLICH A; RENNAU M; KAUFMANN C; GESSNER T
      TIN DIFFUSION-BARRIERS FOR COPPER METALLIZATION

      Microelectronic engineering
    6. BAUMANN J; MARKERT M; WERNER T; EHRLICH A; RENNAU M; KAUFMANN C; GESSNER T
      W TIN DOUBLE-LAYERS AS BARRIER SYSTEM FOR USE IN CU METALLIZATION/

      Microelectronic engineering
    7. BAUMANN J; KAUFMANN C; RENNAU M; WERNER T; GESSNER T
      INVESTIGATION OF COPPER METALLIZATION INDUCED FAILURE OF DIODE STRUCTURES WITH AND WITHOUT A BARRIER LAYER

      Microelectronic engineering
    8. KAUFMANN C; BAUMANN J; GESSNER T; RASCHKE T; RENNAU M; ZICHNER N
      ELECTRICAL CHARACTERIZATION OF REACTIVELY SPUTTERED TIN DIFFUSION BARRIER LAYERS FOR COPPER METALLIZATION

      Applied surface science


ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 03/08/20 alle ore 14:48:59