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La ricerca find articoli where authors phrase all words ' Baik, HK' sort by level,fasc_key/DESCEND, pagina_ini_num/ASCEND ha restituito 107 riferimenti
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    1. Kim, DW; Bae, JC; Kim, WJ; Baik, HK; Lee, SM
      Electrical properties of Pd-based ohmic contact to p-GaN

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    2. Yoon, YJ; Baik, HK
      Synthesis of carbon nanotubes by chemical vapor deposition for field emitters

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    3. Ha, DW; Oh, SS; Ha, HS; Lee, NJ; Ko, RK; Kwon, YK; Ryu, KS; Baik, HK
      Influence of Ge addition on phase formation and electromagnetic propertiesin internal tin processed Nb3Sn wires

      IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
    4. Shim, JY; Baik, HK
      Effect of non-diamond carbon etching on the field emission property of highly sp(2) bonded nanocrystalline diamond films

      DIAMOND AND RELATED MATERIALS
    5. Yoon, YJ; Baik, HK
      Catalytic growth mechanism of carbon nanofibers through chemical vapor deposition

      DIAMOND AND RELATED MATERIALS
    6. Kim, CC; Je, JH; Kim, DW; Baik, HK; Lee, SM; Ruterana, P
      Annealing behavior of Pd/GaN (0001) microstructure

      MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
    7. Kim, YH; Lee, DY; Kim, IK; Baik, HK
      Effects of electron-beam irradiation on the properties of CN thin films deposited by direct dual ion beams

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
    8. Lee, SJ; Lee, JK; Chung, SH; Lee, HY; Lee, SM; Baik, HK
      Stress effect on cycle properties of the silicon thin-film anode

      JOURNAL OF POWER SOURCES
    9. Kim, DW; Bae, JC; Kim, WJ; Baik, HK; Kim, CY; Kim, W; Choi, YH; Kim, CK; Yoo, TK; Hong, CH; Lee, SM
      Development of Al-free ohmic contact to n-GaN

      JOURNAL OF ELECTRONIC MATERIALS
    10. Yoon, DS; Baik, HK; Lee, SM; Roh, JS
      Amorphous Ta-nanocrystalline RuOx diffusion barrier for lower electrode ofhigh density memory devices

      JOURNAL OF ELECTRONIC MATERIALS
    11. Kim, DW; Bae, JC; Kim, WJ; Baik, HK; Myoung, JM; Lee, SM
      The improvement of electrical properties of Pd-based contact to p-GaN by surface treatment

      JOURNAL OF ELECTRONIC MATERIALS
    12. Baik, HK; Budoff, MJ
      Three-dimensional visualization of nonobstructive coronary artery stenosisusing electron beam tomography

      CLINICAL CARDIOLOGY
    13. Yoon, DS; Bae, JC; Lee, SM; Baik, HK
      Investigation of RuO2-incorporated Pt layer as a bottom electrode and diffusion barrier for high epsilon capacitor applications

      ELECTROCHEMICAL AND SOLID STATE LETTERS
    14. Kim, CC; Kim, WH; Je, JH; Kim, DW; Baik, HK; Lee, SM
      Structural evolution of Pd/GaN(0001) films during postannealing

      ELECTROCHEMICAL AND SOLID STATE LETTERS
    15. Kim, GB; Kwak, JS; Baik, HK; Lee, SM
      Characteristics of diodes prepared using epitaxial CoSi2 as a boron diffusion source

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    16. Kang, TS; Je, JH; Kim, GB; Baik, HK; Lee, SM
      Mosaic structure of various oriented grains in CoSi2/Si(001)

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    17. Yoon, YJ; Yoon, DS; Baik, HK; Lee, SM; Song, KM; Lee, SJ
      Suppression of oxidation of metal emitters by incorporating ruthenium oxide

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    18. Shim, JY; Chi, EJ; Baik, HK; Song, KM; Lee, SJ
      Relationship between field emission properties and spatial distributions of emission sites: Diamond films and graphitic carbon films

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    19. Shim, JY; Chi, EJ; Baik, HK; Song, KM; Lee, SJ
      Effects of substrate bias on the structural and field emission properties of diamond films

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    20. Ha, DW; Oh, SS; Lee, NJ; Ha, HS; Bae, JH; Kwon, YK; Ryu, KS; Baik, HK
      The effect of Sn arrangement and intermediate pre-heating on critical current in internal tin processed Nb3Sn wires

      IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
    21. Lee, SM; Park, YJ; Lee, HY; Kim, KC; Baik, HK
      Hydrogen absorption properties of a Zr-Al alloy ball-milled with Ni powder

      INTERMETALLICS
    22. Shim, JY; Chi, EJ; Baik, HK; Song, KM
      Effect of non-diamond carbon content on the spatial distributions of emission sites of the diamond films

      DIAMOND AND RELATED MATERIALS
    23. Song, SK; Kim, D; Kim, S; Koh, SK; Jung, HJ; Lee, JY; Baik, HK
      Structure and chemical characteristics of tin oxide films prepared by reactive-ion-assisted deposition as a function of oxygen ion beam energy

      JOURNAL OF MATERIALS RESEARCH
    24. Shim, JY; Baik, HK; Song, KM
      Effect of nondiamond carbon on electron transport path of field-emitted electrons from undoped polycrystalline diamond films

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
    25. Jang, SW; Lee, HY; Shin, KC; Lee, SM; Lee, JK; Lee, SJ; Baik, HK; Rhee, DS
      Synthesis and characterization of spinel LiMn2O4 for lithium secondary battery

      JOURNAL OF POWER SOURCES
    26. Sim, CM; Chang, KO; Sohn, JM; Chon, BS; Baik, HK
      Burg spectrum estimation of neutron noise for the monitoring of reactor internal vibration with a hypothesis test

      INTERNATIONAL JOURNAL OF PRESSURE VESSELS AND PIPING
    27. Baik, HK; Budoff, MJ; Lane, KL; Bakhsheshi, H; Brundage, BH
      Accurate measures of left ventricular ejection fraction using electron beam tomography: A comparison with radionuclide angiography, and cine angiography

      INTERNATIONAL JOURNAL OF CARDIAC IMAGING
    28. Ryu, HJ; Baik, HK; Hong, SH
      Effect of thermomechanical treatments on microstructure and properties of Cu-base leadframe alloy

      JOURNAL OF MATERIALS SCIENCE
    29. Shim, JY; Baik, HK; Song, KM
      Mechanism of field emission from chemical vapor deposited undoped polycrystalline diamond films

      JOURNAL OF APPLIED PHYSICS
    30. Yoon, DS; Lee, SM; Baik, HK
      Investigation of the electrical properties of tantalum-ruthenium dioxide as a diffusion barrier for high dielectric capacitors

      JOURNAL OF THE ELECTROCHEMICAL SOCIETY
    31. Yoon, DS; Lee, SM; Baik, HK
      Effect of CeO2 addition on the performance of a Ta barrier for high-density memory device applications

      JOURNAL OF THE ELECTROCHEMICAL SOCIETY
    32. Kim, DW; Baik, HK
      Current conduction mechanism of Si/Ti-based Ohmic contacts to n-GaN

      APPLIED PHYSICS LETTERS
    33. Kim, GB; Kwak, JS; Baik, HK; Lee, SM; Oh, SH; Park, CG
      Reaction of Co and capping layers and its effect on CoSi2 formation in Si/SiOx/Co system

      APPLIED PHYSICS LETTERS
    34. Yoon, DS; Baik, HK; Lee, SM
      Electrical properties of the Ta-RuO2 diffusion barrier for high-density memory devices

      JOURNAL OF THE AMERICAN CERAMIC SOCIETY
    35. Lee, JK; Lee, SJ; Baik, HK; Lee, HY; Jang, SW; Lee, SM
      Substrate effect on the microstructure and electrochemical properties in the deposition of a thin film LiCoO2 electrode

      ELECTROCHEMICAL AND SOLID STATE LETTERS
    36. Yoon, DS; Baik, HK; Lee, SM; Lee, SI
      Barrier properties of Ta-RuO2 diffusion barrier for dynamic random access memory capacitor bottom electrodes

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    37. Yoon, YJ; Kim, GB; Baik, HK
      Effects of phase and thickness of cobalt silicide on field emission properties of silicon emitters

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    38. Chi, EJ; Shim, JY; Baik, HK
      Effects of nitrogen addition on the structure and field emission properties of amorphous carbon

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    39. Chi, EJ; Shim, JY; Baik, HK; Lee, HY; Lee, SM; Lee, SJ
      Enhancement of electron emission from silicon tips by nitrogen doped amorphous carbon coating

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    40. Kim, GB; Kwak, JS; Baik, HK; Lee, SM
      Ex situ formation of oxide-interlayer-mediated-epitaxial CoSi2 film using Ti capping

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    41. Yoon, DS; Baik, HK; Lee, SM
      Role of cerium dioxide in a tantalum diffusion barrier film for a Cu/Ta+CeO2/Si structure

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    42. Kim, JH; Lee, SM; Kwak, JS; Baik, HK; Ryu, HJ; Je, JH
      The effectiveness of a thin refractory metal layer inserted into a Ta filmby ion-assisted deposition as a diffusion barrier between copper and silicon

      JOURNAL OF THE KOREAN PHYSICAL SOCIETY
    43. Kim, DW; Park, HS; Kwak, JS; Baik, HK; Lee, SM
      The ohmic contact formation mechanism of Au/Pt/Pd ohmic contact to p-ZnTe

      JOURNAL OF ELECTRONIC MATERIALS
    44. Kim, J; Yoon, DS; Kwak, JS; Baik, HK; Lee, SM
      Study on Ta diffusion barrier in Al/Si system

      JOURNAL OF ELECTRONIC MATERIALS
    45. Choe, YS; Chung, JH; Kim, DS; Baik, HK
      Synthesis of tin oxide films by dual ion beam sputtering using Sn target and oxygen ion beam

      SURFACE & COATINGS TECHNOLOGY
    46. Rho, SJ; Jeong, SM; Baik, HK; Song, KM
      The structural, optical and secondary electron emission properties of MgO and Mg-O-Cs thin films prepared by ion beam assisted deposition

      THIN SOLID FILMS
    47. Han, DW; Kim, YH; Choi, DJ; Chi, EJ; Yoon, WY; Baik, HK
      Field emission characteristics of cesiated amorphous carbon films by negative carbon ion

      THIN SOLID FILMS
    48. Shim, JY; Chi, EJ; Baik, HK; Song, KM
      Field emission characteristic of diamond films grown by electron assisted chemical vapor deposition

      THIN SOLID FILMS
    49. Lee, DY; Kim, YH; Kim, IK; Baik, HK
      The effects of substrates on carbon nitride thin films prepared by direct dual ion beam deposition

      THIN SOLID FILMS
    50. Yoon, YJ; Kim, KW; Baik, HK; Jang, SW; Lee, SM
      Effects of catalytic surface layer on Zr-based alloy getters for hydrogen absorption

      THIN SOLID FILMS
    51. Choe, YS; Chung, JH; Kim, DS; Baik, HK
      Ion beam sputtering of SnO2 with low energy oxygen ion beams

      THIN SOLID FILMS
    52. Preuss, SB; Jiang, CZ; Baik, HK; Kado, CI; Britt, AB
      Radiation-sensitive Arabidopsis mutants are proficient for T-DNA transformation (vol 261, pg 623, 1999)

      MOLECULAR AND GENERAL GENETICS
    53. Preuss, SB; Jiang, CZ; Baik, HK; Kado, CI; Britt, AB
      Radiation-sensitive Arabidopsis mutants are proficient for T-DNA transformation

      MOLECULAR AND GENERAL GENETICS
    54. Choe, YS; Chung, JH; Kim, DS; Kim, GH; Baik, HK
      Phase transformation and morphological evolution of ion-beam sputtered tinoxide films on silicon substrate

      MATERIALS RESEARCH BULLETIN
    55. Yoon, DS; Baik, HK; Lee, SM; Lee, SI
      Tantalum-ruthenium dioxide as a diffusion barrier between Pt bottom electrode and TiSi2 ohmic contact layer for high density capacitors

      JOURNAL OF APPLIED PHYSICS
    56. Kwak, JS; Baik, HK; Kim, JH; Lee, SM; Ryu, HJ; Je, JH
      Effect of thin V insertion layer into Ta film on the performance of Ta diffusion barrier in Cu metallization

      JOURNAL OF APPLIED PHYSICS
    57. Kim, J; Kwak, JS; Yoon, DS; Baik, HK; Lee, SM
      Effects of CeO2 incorporation on the performance of a Ta diffusion barrierfor Al metallization

      JOURNAL OF APPLIED PHYSICS
    58. Kim, GB; Kwak, JS; Baik, HK; Lee, SM
      Effect of Ti-capping thickness on the formation of an oxide-interlayer-mediated-epitaxial CoSi2 film by ex situ annealing

      JOURNAL OF APPLIED PHYSICS
    59. Lee, JC; Choi, ES; Yoon, SG; Yoon, DS; Baik, HK
      Integration of high dielectric (Ba1-xSrx)TiO3 thin films into new barrier layer electrode structures

      JOURNAL OF THE ELECTROCHEMICAL SOCIETY
    60. Chang, JH; Kim, GB; Yoon, DS; Baik, HK; Yoo, DJ; Lee, SM
      Investigation of the mechanism of titanium silicide reaction using ion-beam-assisted deposition

      APPLIED PHYSICS LETTERS
    61. YOON DS; BAIK HK; LEE SM; LEE SI; RYU H; LEE HJ
      INVESTIGATION OF PT TA DIFFUSION BARRIER USING HYBRID CONDUCTIVE OXIDE (RUO2) FOR HIGH DIELECTRIC APPLICATIONS/

      Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena
    62. CHI EJ; SHIM JY; CHOI DJ; BAIK HK
      EFFECTS OF HEAT-TREATMENT ON THE FIELD-EMISSION PROPERTY OF AMORPHOUS-CARBON NITRIDE

      Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena
    63. Yoon, DS; Baik, HK; Lee, SM; Park, CS; Lee, SI
      Investigation of Ta-RuO2 diffusion barrier for high density memory capacitor applications

      JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
    64. SONG SK; CHO JS; CHOI WK; JUNG HJ; CHOI DS; LEE JY; BAIK HK; KOH SK
      STRUCTURE AND GAS-SENSING CHARACTERISTICS OF UNDOPED TIN OXIDE THIN-FILMS FABRICATED BY ION-ASSISTED DEPOSITION

      Sensors and actuators. B, Chemical
    65. KWAK JS; LEE JL; BAIK HK
      IMPROVED UNIFORMITY OF CONTACT RESISTANCE IN GAAS-MESFET USING PD GE/TI/AU OHMIC CONTACTS/

      IEEE electron device letters
    66. You, HW; Lee, HY; Jang, SW; Shin, KC; Lee, SM; Lee, JK; Lee, SJ; Baik, HK; Rhee, DS
      Synthesis of LiCoO2 by mechanical alloying

      JOURNAL OF MATERIALS SCIENCE LETTERS
    67. CHOI DJ; KIM YH; HAN DW; BAIK HK; KIM SI
      FORMATION OF POLYCRYSTALLINE SILICON FILMS ON GLASS SUBSTRATES AT LOW-TEMPERATURES BY A DIRECT NEGATIVE SI ION-BEAM DEPOSITION SYSTEM

      Journal of crystal growth
    68. KIM CY; KIM SW; HONG CH; KIM DW; BAIK HK; WHANG CN
      EFFECTS OF TITANIUM SILICIDE ON AUSITI N-GAN OHMIC CONTACT SYSTEMS/

      Journal of crystal growth
    69. YOON DS; BAIK HK; LEE SM
      TANTALUM-MICROCRYSTALLINE CEO2 DIFFUSION BARRIER FOR COPPER METALLIZATION

      Journal of applied physics
    70. YOON DS; BAIK HK; LEE SM
      EFFECT ON THERMAL-STABILITY OF A CU TA/SI HETEROSTRUCTURE OF THE INCORPORATION OF CERIUM OXIDE INTO THE TA BARRIER/

      Journal of applied physics
    71. YOON DS; BAIK HK; LEE SM; PARK CS; LEE SI
      OXIDATION RESISTANCE OF TANTALUM-RUTHENIUM DIOXIDE DIFFUSION BARRIER FOR MEMORY CAPACITOR BOTTOM ELECTRODES

      Applied physics letters
    72. KWAK JS; BAIK HK; KIM JH; LEE SM
      IMPROVEMENT OF TA DIFFUSION BARRIER PERFORMANCE IN CU METALLIZATION BY INSERTION OF A THIN ZR LAYER INTO TA FILM

      Applied physics letters
    73. SHIM JY; CHI EJ; BAIK HK; LEE SM
      STRUCTURAL, OPTICAL, AND FIELD-EMISSION PROPERTIES OF HYDROGENATED AMORPHOUS-CARBON FILMS GROWN BY HELICAL RESONATOR PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    74. SONG SK; CHOI WK; JUNG HJ; BAIK HK; KOH SK
      COMPARISON OF PROPERTIES OF TIN OXIDE-FILMS DEPOSITED BY REACTIVE-PARTIALLY IONIZED BEAM, ION-ASSISTED, AND HYBRID ION-BEAM METHODS

      Nanostructured materials
    75. YOON DS; BAIK HK; LEE SM
      MICROCRYSTALLINE OXIDE-INCORPORATED NEW DIFFUSION BARRIER FOR DYNAMICRANDOM-ACCESS MEMORY AND FERROELECTRIC RANDOM-ACCESS MEMORY CAPACITORELECTRODE

      Journal of vacuum science & technology. A. Vacuum, surfaces, and films
    76. PARK SW; KIM YI; KWAK JS; BAIK HK
      INVESTIGATION OF CO SIC INTERFACE REACTION

      Journal of electronic materials
    77. KIM DW; KWAK JS; PARK HS; KIM HN; BAIK HK; LEE SM; KIM CS; NOH SK
      INTERFACIAL REACTION AND ELECTRICAL PROPERTY OF GE NI/ZNSE FOR BLUE LASER-DIODE/

      Journal of electronic materials
    78. SHIM JY; PARK SW; BAIK HK
      SILICIDE FORMATION IN COBALT AMORPHOUS-SILICON, AMORPHOUS CO-SI AND BIAS-INDUCED CO-SI FILMS

      Thin solid films
    79. KIM JH; BAIK HK
      STRUCTURAL AND OPTICAL-PROPERTIES OF AMORPHOUS HYDROGENATED CARBON NITRIDE FILMS PREPARED BY PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION

      Solid state communications
    80. JUNG HN; KIM MH; KIM KN; BAIK HK
      THE EFFECTS OF ZR ADDITION ON MECHANICAL-PROPERTIES AND MICROSTRUCTURE OF AG-PD ALLOY

      Journal of dental research
    81. KIM GB; KWAK JS; BAIK HK; LEE SM
      INTERFACIAL REACTION AND FORMATION MECHANISM OF EPITAXIAL COSI2 BY RAPID THERMAL ANNEALING IN CO TI/SI(100) SYSTEM/

      Journal of applied physics
    82. KIM JH; AHN DH; KIM YH; BAIK HK
      CHARACTERIZATION OF AMORPHOUS HYDROGENATED CARBON NITRIDE FILMS PREPARED BY PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION USING A HELICAL RESONATOR DISCHARGE

      Journal of applied physics
    83. LEE JL; KIM YT; KWAK JS; BAIK HK; UEDONO A; TANIGAWA S
      EVIDENCE FOR THE FORMATION OF N(-GAAS LAYER IN PD())GE OHMIC CONTACT TO N-TYPE GAAS/

      Journal of applied physics
    84. KANG BS; LEE SM; KWAK JS; YOON DS; BAIK HK
      THE EFFECTIVENESS OF TA PREPARED BY ION-ASSISTED DEPOSITION AS A DIFFUSION BARRIER BETWEEN COPPER AND SILICON

      Journal of the Electrochemical Society
    85. SONG SK; JUNG HJ; KOH SK; BAIK HK
      MODELING OF ELECTRICAL CONDUCTANCE VARIATION IN SUBSTRATE DURING INITIAL GROWTH OF ULTRA-THIN FILM

      Applied physics letters
    86. CHI EJ; SHIM JY; BAIK HK; LEE SM
      FABRICATION OF AMORPHOUS-CARBON-NITRIDE FIELD EMITTERS

      Applied physics letters
    87. KWAK JS; BAIK HK; KIM JH; LEE SM
      SUPPRESSION OF SILICIDE FORMATION IN TA SI SYSTEM BY ION-BEAM-ASSISTED DEPOSITION/

      Applied physics letters
    88. SONG SK; CHOI WK; CHO JS; JUNG HJ; CHOI D; LEE JY; BAIK HK; KOH SK
      EFFECT OF OXYGEN-ION ENERGY AND ANNEALING IN FORMATION OF TIN OXIDE THIN-FILMS

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    89. RHO SJ; SHIM JY; CHI EJ; BAIK HK; LEE SM
      THE FIELD-EMISSION CHARACTERISTICS OF A-C-H THIN-FILMS PREPARED BY HELICAL RESONATOR PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS
    90. DOH JM; YOO KK; BAIK HK; CHOI J; HUR SK
      EFFECT OF CREEP STRESS ON MICROSTRUCTURE OF A NI-CR-W-AL-TI SUPERALLOY

      Scripta materialia
    91. JANG SY; LEE SM; BAIK HK
      TANTALUM AND NIOBIUM AS A DIFFUSION BARRIER BETWEEN COPPER AND SILICON

      Journal of materials science. Materials in electronics
    92. KWAK JS; BAIK HK; LEE JL; PARK CG; KIM H; SUH KS
      A LOW-RESISTANCE PD GE/TI/AU OHMIC CONTACT TO A HIGH-LOW DOPED GAAS FIELD-EFFECT TRANSISTOR/

      Thin solid films
    93. KIM JH; KIM YH; CHOI DJ; BAIK HK
      STRUCTURAL-PROPERTIES OF AMORPHOUS-CARBON NITRIDE FILMS PREPARED BY REMOTE PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION

      Thin solid films
    94. SHIM JY; KWAK JS; BAIK HK
      SOLID-STATE REACTIONS IN COBALT AMORPHOUS-SILICON MULTILAYER THIN-FILMS/

      Thin solid films
    95. KWAK JS; KIM HN; BAIK HK; LEE JL; SHIN DW; PARK CG; KIM H; PYUN KE
      MICROSTRUCTURAL AND ELECTRICAL INVESTIGATIONS OF PD GE/TI/AU OHMIC CONTACT TO N-TYPE GAAS/

      Journal of applied physics
    96. YOON DS; BAIK HK; KANG BS; LEE SM
      EFFECT OF INTERPOSED CR LAYER ON THE THERMAL-STABILITY OF CU TA/SI STRUCTURE/

      Journal of applied physics
    97. LEE SJ; LEE JK; KIM DW; BAIK HK; LEE SM
      FABRICATION OF THIN-FILM LICO0.5NI0.5O2 CATHODE FOR LI RECHARGEABLE MICROBATTERY

      Journal of the Electrochemical Society
    98. KIM GB; BAIK HK; LEE SM
      CONTROL OF CO FLUX THROUGH TERNARY COMPOUND FOR THE FORMATION OF EPITAXIAL COSI2 USING CO TI/SI SYSTEM/

      Applied physics letters
    99. KWAK JS; LEE JL; BAIK HK; SHIN DW; PARK CG; KIM H
      EFFECT OF PENETRATION DEPTH ON ELECTRICAL-PROPERTIES IN PD GE/TI/AU OHMIC CONTACT TO HIGH-LOW-DOPED N-GAAS/

      JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
    100. PARK SW; SHIM JY; BAIK HK
      LOW-TEMPERATURE EPITAXIAL-GROWTH OF SI0.5GE0.5 ALLOY LAYER ON SI(100)BY ION-BEAM-ASSISTED DEPOSITION

      Journal of electronic materials


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Documento generato il 05/08/20 alle ore 12:08:37