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Titolo:
A MULTIPLICITY-VERTEX DETECTOR FOR THE PHENIX EXPERIMENT AT RHIC
Autore:
KAPUSTINSKY J; BOISSEVAIN J; BOSZE E; BRITTON C; CHANG J; CLARK D; EMERY M; ERICSON N; FUNG SY; JACAK B; JAFFE D; MAREK L; SETO R; SIMONGILLO J; SIMPSON M; SMITH R; SULLIVAN J; TAKAHASHI Y; VANHECKE H; WALKER J; XU N;
Indirizzi:
LOS ALAMOS NATL LAB,POB 1663,MAIL STOP H846 LOS ALAMOS NM 87545 UNIV CALIF RIVERSIDE RIVERSIDE CA 92521 OAK RIDGE NATL LAB OAK RIDGE TN 37831 UNIV ALABAMA HUNTSVILLE AL 35899
Titolo Testata:
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment
fascicolo: 1-3, volume: 392, anno: 1997,
pagine: 192 - 196
SICI:
0168-9002(1997)392:1-3<192:AMDFTP>2.0.ZU;2-B
Fonte:
ISI
Lingua:
ENG
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Science Citation Index Expanded
Science Citation Index Expanded
Science Citation Index Expanded
Citazioni:
5
Recensione:
Indirizzi per estratti:
Citazione:
J. Kapustinsky et al., "A MULTIPLICITY-VERTEX DETECTOR FOR THE PHENIX EXPERIMENT AT RHIC", Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment, 392(1-3), 1997, pp. 192-196

Abstract

A Multiplicity-Vertex Detector (MVD) has been designed, and is in construction for the PHENIX Experiment at the Relativistic Heavy Ion Collider (RHIC). The 35 000 channel silicon detector is a two-layer barrelcomprised of 112 strip detectors, and two disk-shaped endcaps comprised of 24 wedge-shaped pad detectors. The support structure of the MVD is very low mass, only 0.4% of a radiation length in the central barrel. The detector front-end electronics are a custom CMOS chip set containing preamplifier, discriminator, analog memory unit, and analog-to-digital converter. The system has pipelined acquisition, performs in simultaneous read/write mode, and is clocked by the 10 MHz beam crossingrate at RHIC. These die, together with a pair of commercial FPGAs that are used for control logic, are packaged in a mutlichip-module (MCM). The MCM will be fabricated in the High-Density-Interconnect (HDI) process. The prototype MCM design layout is described.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 25/11/20 alle ore 15:08:15