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Titolo:
Microstructure and stress development in magnetron sputtered TiAlCr(N) films
Autore:
Huang, F; Wei, GH; Barnard, JA; Weaver, ML;
Indirizzi:
Univ Alabama, Dept Met & Mat Engn, Tuscaloosa, AL 35487 USA Univ Alabama Tuscaloosa AL USA 35487 & Mat Engn, Tuscaloosa, AL 35487 USA
Titolo Testata:
SURFACE & COATINGS TECHNOLOGY
, volume: 146, anno: 2001,
pagine: 391 - 397
SICI:
0257-8972(200109/10)146:<391:MASDIM>2.0.ZU;2-E
Fonte:
ISI
Lingua:
ENG
Soggetto:
RESIDUAL-STRESS; OXIDATION; COATINGS; TI; TI1-XALXN; (TI,CR)N; COMPOUND; AIN;
Keywords:
sputtering; stress; titanium aluminide; X-ray diffraction; oxidation;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
Citazioni:
30
Recensione:
Indirizzi per estratti:
Indirizzo: Weaver, ML Univ Alabama, Dept Met & Mat Engn, Box 870202, Tuscaloosa, AL 35487 USA Univ Alabama Box 870202 Tuscaloosa AL USA 35487 a, AL 35487 USA
Citazione:
F. Huang et al., "Microstructure and stress development in magnetron sputtered TiAlCr(N) films", SURF COAT, 146, 2001, pp. 391-397

Abstract

TiAlCr(N) coatings were reactively magnetron-sputtered from a Ti-51Al-12Cralloy target in this study by changing the nitrogen partial pressure over the range of 0-25% of the total pressure. The influence of nitrogen addition on the microstructure and stress development in the TiAlCr(N) films was investigated. With the increase of nitrogen partial pressure, the film microstructure undergoes a transition from amorphous-like metallic to crystalline nitride films. The crystalline phases are cubic Ti1-xAlxN and Cr1-xAlxN. The intrinsic stresses are compressive and become more so with nitrogen addition over most of the partial pressure range, while the stress-temperaturecurves during annealing vary significantly among the films. Nitrogen additions were found to increase the hardness of the films. (C) 2001 Elsevier Science B.V. All rights reserved.

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Documento generato il 01/10/20 alle ore 16:16:01