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Titolo:
Initial deposition mechanism of electroless nickel plating on magnesium alloys
Autore:
Xiang, YH; Hu, WB; Liu, XK; Zhao, CZ; Ding, WJ;
Indirizzi:
Shanghai Jiao Tong Univ, State Key Lab MMCs, Shanghai 200030, Peoples R China Shanghai Jiao Tong Univ Shanghai Peoples R China 200030 Peoples R China
Titolo Testata:
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING
, volume: 79, anno: 2001,
parte:, 1
pagine: 30 - 32
SICI:
0020-2967(200101)79:<30:IDMOEN>2.0.ZU;2-#
Fonte:
ISI
Lingua:
ENG
Keywords:
electroless nickel plating; magnesium alloy; initial deposition;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
Citazioni:
5
Recensione:
Indirizzi per estratti:
Indirizzo: Xiang, YH Shanghai Jiao Tong Univ, State Key Lab MMCs, Shanghai 200030, Peoples R China Shanghai Jiao Tong Univ Shanghai Peoples R China 200030 China
Citazione:
Y.H. Xiang et al., "Initial deposition mechanism of electroless nickel plating on magnesium alloys", T I MET FIN, 79, 2001, pp. 30-32

Abstract

In this paper: the initial deposition mechanism of electroless nickel plating (EN) on magnesium alloys was studied by X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM) and scanning auger microscopy (SAM). It was shown that the substrate became catalytically active after thesurface oxide dissolved into the plating hath. which made the replacement reaction between the substrate and nickel ion happen. The results indicatedthat different F/O ratios caused different initial deposition rates. It was also found that nickel nucleated at the second phase of the substrate andbeneath the fluoride film formed during activation. No phosphorus was found in the initial deposited nickel.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 11/08/20 alle ore 15:29:58