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Titolo:
FABRICATION OF TI TI5SI3 FUNCTIONALLY GRADED MATERIAL BY EUTECTIC BONDING METHOD/
Autore:
KIRIHARA S; TOMOTA Y; TSUJIMOTO T;
Indirizzi:
IBARAKI UNIV,FAC ENGN,DEPT MAT SCI HITACHI IBARAKI 316 JAPAN
Titolo Testata:
Materials transactions, JIM
fascicolo: 7, volume: 38, anno: 1997,
pagine: 650 - 652
SICI:
0916-1821(1997)38:7<650:FOTTFG>2.0.ZU;2-2
Fonte:
ISI
Lingua:
ENG
Keywords:
TI; TI5SI3; FUNCTIONALLY GRADED MATERIAL; EUTECTIC REACTION; EUTECTIC BONDING METHOD; MICROSTRUCTURE CONTROL;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Science Citation Index Expanded
Citazioni:
6
Recensione:
Indirizzi per estratti:
Citazione:
S. Kirihara et al., "FABRICATION OF TI TI5SI3 FUNCTIONALLY GRADED MATERIAL BY EUTECTIC BONDING METHOD/", Materials transactions, JIM, 38(7), 1997, pp. 650-652

Abstract

Ti/Ti5Si3 functionally graded material was fabricated by a eutectic bonding method. A metal TI and an intermetallic compound Ti5Si3 were bonded by utilizing a eutectic reaction, where Ti5Si3 was chosen becauseof its high heat resistance and high oxidation one. In the case of bonding the stoichiometric Ti5Si3 with the pure Ti, cracks were formed within the Ti5Si3 part. Since the cracking was suspected to occur due to the low ductility of the stoichiometric Ti5Si3, a Ti-rich Ti5Si3 which is ductiler than the stoichiometric Ti5Si3 was applied in place of the stoichiometric Ti5Si3. As a result, a sound FGM without any detectable defects was realized.

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Documento generato il 11/08/20 alle ore 15:40:33