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Titolo:
Experimental and numerical verification of fatigue life estimation for solder bumps
Autore:
Mukai, M; Takahashi, H; Kawakami, T; Takahashi, K; Iwasaki, K; Kishimoto, K; Shibuya, T;
Indirizzi:
Toshiba Co Ltd, Res & Dev Ctr, Saiwai Ku, Kawasaki, Kanagawa 2128582, Japan Toshiba Co Ltd Kawasaki Kanagawa Japan 2128582 i, Kanagawa 2128582, Japan Toshiba Co Ltd, Digital Media Network Co, Ome, Tokyo 1988710, Japan Toshiba Co Ltd Ome Tokyo Japan 1988710 work Co, Ome, Tokyo 1988710, Japan Toshiba Corp 1, Semicond Co, Saiwai Ku, Kawasaki, Kanagawa 2128582, Japan Toshiba Corp 1 Kawasaki Kanagawa Japan 2128582 i, Kanagawa 2128582, Japan Tokyo Inst Technol, Dept Mech & Intelligent Syst Eng, Meguro Ku, Tokyo 1528552, Japan Tokyo Inst Technol Tokyo Japan 1528552 , Meguro Ku, Tokyo 1528552, Japan
Titolo Testata:
JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING
fascicolo: 4, volume: 44, anno: 2001,
pagine: 567 - 572
SICI:
1344-7912(200110)44:4<567:EANVOF>2.0.ZU;2-F
Fonte:
ISI
Lingua:
ENG
Soggetto:
JOINTS; PGA;
Keywords:
fatigue; life prediction; structural analysis; solder bump; electronic device; elastic-creep behavior;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
Citazioni:
10
Recensione:
Indirizzi per estratti:
Indirizzo: Mukai, M Toshiba Co Ltd, Res & Dev Ctr, Saiwai Ku, 1 Komukai Toshiba Cho, Kawasaki,Kanagawa 2128582, Japan Toshiba Co Ltd 1 Komukai Toshiba Cho Kawasaki Kanagawa Japan 2128582
Citazione:
M. Mukai et al., "Experimental and numerical verification of fatigue life estimation for solder bumps", JSME A, 44(4), 2001, pp. 567-572

Abstract

Fatigue life estimation of solder bumps is one of the most critical technologies for the development of ball grid array packages. In this study, mechanical fatigue tests were carried out using Sn63-Pb37 solder bump specimens. The cracks were initiated along the entire circumference in the vicinity of the interface. The fatigue life estimation of the solder bumps was performed based on the elastic-creep finite element method (FEM) analysis. It was clear that the strain concentration region coincides with the crack initiation site. The estimation result for the crack initiation was in good agreement with the experimental results. The results reconfirmed that it was desirable to employ the equivalent creep strain range occurring at a distanceof 50 mum from the singularity point. The life ratio, which provides the quantitative correlation between the crack initiation and the ultimate fracture, was determined from the experimental results. The number of cycles to the fatal failure can be roughly estimated by multiplying the analytical estimation results for the crack initiation by this life ratio. This simple estimation of fatal failure may well be of practical use in actual ball gridarray (BGA) design for thermal load conditions.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 29/03/20 alle ore 23:46:57