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Titolo:
Interpretation of potential transients during aluminum etch tunnel growth in the presence of sulfuric acid
Autore:
Choi, J; Lee, KH; Tak, Y;
Indirizzi:
Inha Univ, Dept Chem Engn, Inchon 402751, South Korea Inha Univ Inchon South Korea 402751 hem Engn, Inchon 402751, South Korea Max Planck Inst Microstruct Phys, D-06120 Halle Saale, Germany Max Planck Inst Microstruct Phys Halle Saale Germany D-06120 le, Germany
Titolo Testata:
ELECTROCHEMISTRY
fascicolo: 11, volume: 69, anno: 2001,
pagine: 843 - 847
SICI:
1344-3542(200111)69:11<843:IOPTDA>2.0.ZU;2-W
Fonte:
ISI
Lingua:
ENG
Soggetto:
PITTING CORROSION; CHLORIDE; PASSIVATION; ALLOYS;
Keywords:
aluminum etching; potential transients; passivation; current interruption method;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Physical, Chemical & Earth Sciences
Engineering, Computing & Technology
Citazioni:
18
Recensione:
Indirizzi per estratti:
Indirizzo: Choi, J Inha Univ, Dept Chem Engn, Inchon 402751, South Korea Inha Univ Inchon South Korea 402751 , Inchon 402751, South Korea
Citazione:
J. Choi et al., "Interpretation of potential transients during aluminum etch tunnel growth in the presence of sulfuric acid", ELECTROCH, 69(11), 2001, pp. 843-847

Abstract

When sulfuric acid is added in an etching solution of 1 M hydrochloric acid, the effect of the sulfate ions on the aluminum etch pit formation and tunnel growth was investigated with the morphology study and current interruptions in applied etching current. Initial potential transient supports thatsulfate ion works as a film forming agent and inhibits the pit initiation during the anodic current etching. Observation of ruptured oxide films suggests that cathodic hydrogen evolution can take place inside the pits. Current step reduction and cathodic pulse superimposition experiments indicate that the actively dissolving tunnel tip surface is covered with aluminum chloride salts and sulfate ion moves far behind inside tunnels during the tunnel growth.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 03/04/20 alle ore 10:56:11