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Titolo:
Average power handling capability of multilayer microstrip lines
Autore:
Bahl, IJ;
Indirizzi:
MACOM, Roanoke, VA 24019 USA MACOM Roanoke VA USA 24019MACOM, Roanoke, VA 24019 USA
Titolo Testata:
INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING
fascicolo: 6, volume: 11, anno: 2001,
pagine: 385 - 395
SICI:
1096-4290(200111)11:6<385:APHCOM>2.0.ZU;2-D
Fonte:
ISI
Lingua:
ENG
Soggetto:
THERMAL-RESISTANCE; CIRCUITS; RF;
Keywords:
power rating; power handling of microstrip lines; average power handling; multilayer microstrip lines;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
Citazioni:
14
Recensione:
Indirizzi per estratti:
Indirizzo: Bahl, IJ MACOM, 5310 Valley Pk Dr, Roanoke, VA 24019 USA MACOM 5310 ValleyPk Dr Roanoke VA USA 24019 oanoke, VA 24019 USA
Citazione:
I.J. Bahl, "Average power handling capability of multilayer microstrip lines", INT J RF MI, 11(6), 2001, pp. 385-395

Abstract

This article describes the average power handling capability (APHC) of multilayer microstrip lines, including the effect of mismatch at the terminations. The data presented herein are validated by considering an example of a12-W monolithic microwave integrated circuit power amplifier fabricated using multilayer low-loss microstrip technology. The calculated value of APHCfor a 50-Omega line of a 75-mum-thick GaAs substrate is 1445 W at 10 GHz, whereas the corresponding value for a multilayer microstrip that has 10-mum-thick polyimide is only 44 W. At 40 GHz, these values are reduced by a factor of 2. (C) 2001 John Wiley & Sons, Inc.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 05/04/20 alle ore 19:38:27