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Titolo:
Thermal and mechanical characterization of ViaLuX (TM) 81: A novel epoxy photo-dielectric dry film (PDDF) for microvia applications
Autore:
Dunne, RC; Sitaraman, SK; Luo, SJ; Wong, CP; Estes, WE; Periyasamy, M; Coburn, J;
Indirizzi:
Georgia Inst Technol, George W Woodruff Sch Mech Engn, CASPaR, Atlanta, GA30332 USA Georgia Inst Technol Atlanta GA USA 30332 n, CASPaR, Atlanta, GA30332 USA Georgia Inst Technol, Sch Mat Sci & Engn, Packaging Res Ctr, Atlanta, GA 30332 USA Georgia Inst Technol Atlanta GA USA 30332 Res Ctr, Atlanta, GA 30332 USA DuPont Photopolymers & Elect Mat, Res Triangle Pk, NC 27709 USA DuPont Photopolymers & Elect Mat Res Triangle Pk NC USA 27709 C 27709 USA
Titolo Testata:
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
fascicolo: 3, volume: 24, anno: 2001,
pagine: 436 - 444
SICI:
1521-3331(200109)24:3<436:TAMCOV>2.0.ZU;2-K
Fonte:
ISI
Lingua:
ENG
Soggetto:
COMPOSITES; POLYMERS; CURE;
Keywords:
cure kinetics; differential scanning calorimetry (DSC); dynamic mechanical analysis; high-density wiring; interlayer dielectric; microvias; substrate processing;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
--discip_EC--
Citazioni:
18
Recensione:
Indirizzi per estratti:
Indirizzo: Dunne, RC Georgia Inst Technol, George W Woodruff Sch Mech Engn, CASPaR, Atlanta, GA30332 USA Georgia Inst Technol Atlanta GA USA 30332 Atlanta, GA30332 USA
Citazione:
R.C. Dunne et al., "Thermal and mechanical characterization of ViaLuX (TM) 81: A novel epoxy photo-dielectric dry film (PDDF) for microvia applications", IEEE T COMP, 24(3), 2001, pp. 436-444

Abstract

Multilayered high density interconnect (HDI) processing on organic substrates typically introduces warpage and residual stresses. The magnitude of the warpage and the residual stresses depends on, among other factors, the processing temperatures and the thermomechanical properties of the dielectricand substrate materials. In this work, a prospective epoxy-based dielectric material for such sequentially built up (SBU) high density-interconnect printed wiring boards (HDI-PWB) is considered. The polymer is a photo-dielectric dry film (PDDF) material called ViaLux(TM) 81, which exhibits a complicated curing behavior due to the long lifetime of the cationic photoinitiators generated by ultraviolet (UV) exposure. The objectives of this work are1) to conduct differential scanning calorimetry (DSC) experiments and develop a cure kinetics model;2) to develop a cure shrinkage model based on thermal and chemical shrinkage experiments;3) to determine the thermomechanical properties of partially and fully cured Vialux(TM) 81 dry film. All of these experimental characterizations are necessary to select suitable process parameters and to obtain a consistent product with the desired physical and mechanical properties.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 11/07/20 alle ore 10:49:37