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Titolo:
Copper-iron filamentary microcomposites
Autore:
Hong, SI;
Indirizzi:
Chungnam Natl Univ, Dept Met Engn, Taejon 305764, South Korea Chungnam Natl Univ Taejon South Korea 305764 Taejon 305764, South Korea
Titolo Testata:
ADVANCED ENGINEERING MATERIALS
fascicolo: 7, volume: 3, anno: 2001,
pagine: 475 - 479
SICI:
1438-1656(200107)3:7<475:CFM>2.0.ZU;2-4
Fonte:
ISI
Lingua:
ENG
Soggetto:
IN-SITU COMPOSITES; CU-NB ALLOYS; ELECTRICAL-CONDUCTIVITY; FE ALLOYS; STRENGTH; MICROSTRUCTURE; WIRES;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
Citazioni:
23
Recensione:
Indirizzi per estratti:
Indirizzo: Hong, SI Chungnam Natl Univ, Dept Met Engn, Taejon 305764, South Korea Chungnam Natl Univ Taejon South Korea 305764 05764, South Korea
Citazione:
S.I. Hong, "Copper-iron filamentary microcomposites", ADV ENG MAT, 3(7), 2001, pp. 475-479

Abstract

The Cu-Fe system is of particular interest because of the relatively low cost of Fe compared to other insoluble BCC phases such as Nb, Mo, Cr, and Ta. The relatively high solubility of Fe in Cu at high temperatures, coupled with the slow kinetics of Fe precipitation at low temperatures is, however,known to reduce electrical conductivity. The key to improving strength/conductivity properties is to reduce the initial dendrite size and to precipitate Fe effectively in the Cu matrix. Thermomechanical treatments have been employed by some investigators to optimize the strength and conductivity ofCu-Fe microcomposites. The study also shows that refinement of dendrites and easier nucleation of precipitates by the addition of third alloying elements can lead to improved strength/conductivity properties of Cu-Fe microcomposites.

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Documento generato il 10/07/20 alle ore 19:16:02