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Titolo:
Synthesis and properties of a novel, liquid, trifunctional, cycloaliphaticepoxide
Autore:
Xie, MR; Wang, ZG; Zhao, YF;
Indirizzi:
Chinese Acad Sci, Inst Chem, Ctr Mol Sci, Beijing 100080, Peoples R China Chinese Acad Sci Beijing Peoples R China 100080 100080, Peoples R China
Titolo Testata:
JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY
fascicolo: 16, volume: 39, anno: 2001,
pagine: 2799 - 2804
SICI:
0887-624X(20010815)39:16<2799:SAPOAN>2.0.ZU;2-O
Fonte:
ISI
Lingua:
ENG
Soggetto:
PHENOL NOVOLAC; CURED POLYMER; ENCAPSULATION; MONOMER; MOIETY; RESINS;
Keywords:
cycloaliphatic epoxide; synthesis; thermal properties; electronic packaging; mechanical properties; thermosets;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Physical, Chemical & Earth Sciences
Citazioni:
13
Recensione:
Indirizzi per estratti:
Indirizzo: Wang, ZG Chinese Acad Sci, Inst Chem, Ctr Mol Sci, Beijing 100080, PeoplesR China Chinese Acad Sci Beijing Peoples R China 100080 Peoples R China
Citazione:
M.R. Xie et al., "Synthesis and properties of a novel, liquid, trifunctional, cycloaliphaticepoxide", J POL SC PC, 39(16), 2001, pp. 2799-2804

Abstract

A novel cycloaliphatic triepoxide, 1,1-bis(2',3'-epoxycyclohexyloxymethyl)-3,4-epoxycyclohexane (II), and its precursor, 1, 1-bis(2 ' -cyclohexenyloxymethyl)-3-cyclohexene, were synthesized. Their chemical structures were confirmed with IR spectroscopy, elemental analysis, and H-1 NMR spectroscopy.11 was easily cured with hexahydro-4-methylphthalic anhydride with 1,3,5-triethylhexahydro-s-triazine as a curing accelerator. The physical properties of the cured product were examined with thermomechanical analysis, thermogravimetric analysis, and dynamic mechanical analysis. Compared with the commercial diepoxide ERL-4221 under the same curing conditions, the cured product based on II showed a much higher glass-transition temperature (198 degreesC), a higher crosslinking density (2.08 X 10(3) mol/cm(3)), and a lowercoefficient of thermal expansion [6.2 X 10(5)(/degreesC)]. II may become apromising candidate material for modern microelectronic packaging. (C) 2001 John Wiley & Sons, Inc.

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Documento generato il 04/07/20 alle ore 14:32:26