Catalogo Articoli (Spogli Riviste)

OPAC HELP

Titolo:
Growth of eta phase scallops and whiskers in liquid tin-solid copper reaction couples
Autore:
Gagliano, RA; Fine, ME;
Indirizzi:
Northwestern Univ, Dept Mat Sci, Evanston, IL 60208 USA Northwestern UnivEvanston IL USA 60208 t Mat Sci, Evanston, IL 60208 USA Northwestern Univ, Inst Technol, Evanston, IL 60208 USA Northwestern UnivEvanston IL USA 60208 t Technol, Evanston, IL 60208 USA
Titolo Testata:
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY
fascicolo: 6, volume: 53, anno: 2001,
pagine: 33 - 38
SICI:
1047-4838(200106)53:6<33:GOEPSA>2.0.ZU;2-R
Fonte:
ISI
Lingua:
ENG
Soggetto:
CU-SN; INTERMETALLIC COMPOUND; SOLDERING REACTION; DIFFUSION COUPLES; EUTECTIC SNPB; TEMPERATURE; MORPHOLOGY; INTERFACE; JOINT;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
Citazioni:
27
Recensione:
Indirizzi per estratti:
Indirizzo: Gagliano, RA Northwestern Univ, Dept Mat Sci, 2225 N Campus Dr, Evanston, IL 60208 USA Northwestern Univ 2225 N Campus Dr Evanston IL USA 60208 USA
Citazione:
R.A. Gagliano e M.E. Fine, "Growth of eta phase scallops and whiskers in liquid tin-solid copper reaction couples", JOM-J MIN, 53(6), 2001, pp. 33-38

Abstract

In the microelectronics industry, many solder junctions rely upon reactionbetween a copper substrate and a molten tin-based alloy. For the tin/copper system, interfacial continuity is afforded by the formation of the eta (Cu6Sn5) and epsilon (Cu3Sn) phase intermetallic compounds. The eta grows in a scalloped morphology along the tin interface with whiskers emanating fromtheir tops. This article quantitatively describes the unusual growth behavior of the eta phase scallops and whiskers formed during reaction of liquidtin with a solid copper substrate.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 29/03/20 alle ore 08:45:34