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Titolo:
Creep properties of Sn-Ag solder joints containing intermetallic particles
Autore:
Choi, S; Lee, JG; Guo, F; Bieler, TR; Subramanian, KN; Lucas, JP;
Indirizzi:
Michigan State Univ, Dept Mech & Mat Sci, E Lansing, MI 48824 USA MichiganState Univ E Lansing MI USA 48824 t Sci, E Lansing, MI 48824 USA
Titolo Testata:
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY
fascicolo: 6, volume: 53, anno: 2001,
pagine: 22 - 26
SICI:
1047-4838(200106)53:6<22:CPOSSJ>2.0.ZU;2-N
Fonte:
ISI
Lingua:
ENG
Soggetto:
EUTECTIC SOLDERS; MICROSTRUCTURE; DEFORMATION; COMPOSITE;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
Citazioni:
21
Recensione:
Indirizzi per estratti:
Indirizzo: Subramanian, KN Michigan State Univ, Dept Mech & Mat Sci, 3536 Engn Bldg, E Lansing, MI 48824 USA Michigan State Univ 3536 Engn Bldg E Lansing MI USA48824
Citazione:
S. Choi et al., "Creep properties of Sn-Ag solder joints containing intermetallic particles", JOM-J MIN, 53(6), 2001, pp. 22-26

Abstract

The creep behavior of the eutectic tin-silver joints and tin-silver composite solder joints containing 20 vol.% of Cu6Sn5, Ni3Sn4 and FeSn2 intermetallic reinforcements introduced by in-situ methods was investigated. These creep tests were carried out using single shear lap solder joints at room temperature, 85 degreesC, and 125 degreesC. The creep resistance was similar in magnitude for all alloys, and with increasing temperature, the stress exponents decreased in a manner consistent with power-law breakdown behavior. The FeSn2 intermetallic reinforced composite solder was found to be the most creep-resistant alloy at room temperature. Creep failure was observed tooccur within the solder matrix in all these solder joints. Although a detailed analysis of the processes involved was difficult because of smearing of the features in the fracture surface, there were indications of grain-boundary separation, ductile fracture, and interfacial separation.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 25/09/20 alle ore 22:53:44