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Titolo:
Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections
Autore:
Lee, JH; Park, JH; Lee, YH; Kim, YS; Shin, DH;
Indirizzi:
Hong Ik Univ, Dept Met & Mat Sci, Seoul 121791, South Korea Hong Ik Univ Seoul South Korea 121791 Mat Sci, Seoul 121791, South Korea Hanyang Univ, Dept Met & Mat Sci, Ansan 425791, Kyungki Do, South Korea Hanyang Univ Ansan Kyungki Do South Korea 425791 Kyungki Do, South Korea
Titolo Testata:
JOURNAL OF MATERIALS RESEARCH
fascicolo: 5, volume: 16, anno: 2001,
pagine: 1227 - 1230
SICI:
0884-2914(200105)16:5<1227:SOCAAS>2.0.ZU;2-I
Fonte:
ISI
Lingua:
ENG
Soggetto:
DIFFUSION COUPLES; NUMERICAL-METHOD; EUTECTIC SNPB; CU-SN; JOINTS;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Physical, Chemical & Earth Sciences
Engineering, Computing & Technology
--discip_EC--
Citazioni:
22
Recensione:
Indirizzi per estratti:
Indirizzo: Lee, JH Hong Ik Univ, Dept Met & Mat Sci, Seoul 121791, South Korea Hong Ik Univ Seoul South Korea 121791 Seoul 121791, South Korea
Citazione:
J.H. Lee et al., "Stability of channels at a scalloplike Cu6Sn5 layer in solder interconnections", J MATER RES, 16(5), 2001, pp. 1227-1230

Abstract

The thermodynamic stability of the solder channels at a scalloplike Cu6Sn5layer formed between Sn-containing solders and Cu substrate was evaluated by studying the penetration behavior of the liquid solders into the grain boundaries of a Cu6Sn5 substrate. The orientational relationship between thegrains of the Cu6Sn5 layer formed during reflow soldering was also analyzed using the electron backscattered diffraction technique. The results showed that liquid solders penetrate into the grain boundaries at an order of faster speed than the growth rate of the layer, which provided a direct evidence of thermodynamic stability of the channel.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 28/03/20 alle ore 10:23:19