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Titolo: Fully physical timedependent compact thermal modelling of complex non linear 3dimensional systems for device and circuit level electrothermal CAD
Autore: Batty, W; Christoffersen, CE; David, S; Panks, AJ; Johnson, RG; Snowden, CM; Steer, MB;
 Indirizzi:
 Univ Leeds, Sch Elect & Elect Engn, Inst Microwaves & Photon, Leeds LS2 9JT, W Yorkshire, England Univ Leeds Leeds W Yorkshire England LS2 9JT S2 9JT, W Yorkshire, England
 Titolo Testata:
 SEVENTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2001
,
,
anno: 2001,
pagine: 71  84
 SICI:
 10652221(2001):<71:FPTCTM>2.0.ZU;28
 Fonte:
 ISI
 Lingua:
 ENG
 Soggetto:
 MICROWAVE INTEGRATEDCIRCUITS; NONLINEAR BOUNDARYCONDITIONS; NUMERICAL INVERSION; DIFFUSIONPROBLEMS; SIMULATION; ICS; CONDUCTIVITY; TRANSIENTS; HYBRID; TOOL;
 Keywords:
 thermal; electrothermal; compact modelling; non linear CAD; power FETs; circuits;
 Tipo documento:
 Article
 Natura:
 Collana
 Settore Disciplinare:
 Engineering, Computing & Technology
 Citazioni:
 58
 Recensione:
 Indirizzi per estratti:
 Indirizzo: Batty, W Univ Leeds, Sch Elect & Elect Engn, Inst Microwaves & Photon, Leeds LS2 9JT, W Yorkshire, England Univ Leeds Leeds W Yorkshire England LS2 9JT Yorkshire, England



 Citazione:
 W. Batty et al., "Fully physical timedependent compact thermal modelling of complex non linear 3dimensional systems for device and circuit level electrothermal CAD", P IEEE SEM, 2001, pp. 7184
Abstract
An original, fully analytical, spectral domain decomposition approach to compact solution of the non linear timedependent heat diffusion equation incomplex volumes, is introduced. Its application to device and circuit level electrothermal simulation on CAD timescales is illustrated. The first full treatment in coupled electrothermal CAD, of thermal non linearity due totemperature dependent diffusivity, is described. Original thermal solutions are presented in the form of analytically exact thermal impedance matrix expressions for thermal subsystems. These include double Fourier series solutions for rectangular multilayers, which are an order of magnitude faster to evaluate than existing semianalytical Fourier solutions based on DFTFFT. They also include double Fourier series solutions for arbitrarily distributed volume heat sources and sinks, constructed without the use of Green'sfunction techniques, and for rectangular volumes with prescribed fluxes onall faces. These analytical solutions allow treatment of arbitrary device structures without invoking conventional numerical methods. They provide minimal boundary condition independent compact thermal models, allowing CAD timescale coupled electrothermal solution for complex systems, without requiring lumped element RC network extraction or node reduction. The timeindependent thermal resistance matrix description of detailed device structure is illustrated by a fully physical, coupled electrothermal study of the interaction of substrate thickness and surface convection in power HEMTs. The thermal timedependent implementation is illustrated by circuit level harmonic balance simulation of a 3x3 MMIC amplifier array.
ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 20/09/20 alle ore 00:23:59