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Titolo:
Defects and diffusion in Al and Al-Cu alloy
Autore:
Liu, CL; Liu, XY; Borucki, LJ;
Indirizzi:
Motorola Inc, Adv Syst Res Lab, Mesa, AZ 85202 USA Motorola Inc Mesa AZ USA 85202 Inc, Adv Syst Res Lab, Mesa, AZ 85202 USA
Titolo Testata:
DEFECTS AND DIFFUSION IN METALS III
, volume: 188-1, anno: 2001,
pagine: 93 - 99
SICI:
1012-0386(2001)188-1:<93:DADIAA>2.0.ZU;2-Q
Fonte:
ISI
Lingua:
ENG
Soggetto:
EMBEDDED-ATOM-METHOD; GRAIN-BOUNDARY DIFFUSION; MOLECULAR-DYNAMICS; ELECTROMIGRATION; INTERCONNECTS;
Keywords:
grain boundary; atomistics; twins; computer modelling and simulation; defects; segregation; diffusion; Al; Al-Cu;
Tipo documento:
Article
Natura:
Collana
Settore Disciplinare:
Physical, Chemical & Earth Sciences
Engineering, Computing & Technology
Citazioni:
20
Recensione:
Indirizzi per estratti:
Indirizzo: Liu, CL Motorola Inc, Adv Syst Res Lab, Mesa, AZ 85202 USA Motorola Inc Mesa AZ USA 85202 v Syst Res Lab, Mesa, AZ 85202 USA
Citazione:
C.L. Liu et al., "Defects and diffusion in Al and Al-Cu alloy", DEFECT DIFF, 188-1, 2001, pp. 93-99

Abstract

Atomistic modeling and simulation plays an ever increasing role in understanding defects, segregation, and diffusion in a variety of materials systems. In this paper. we describe a newly-developed defect generation mechanism, namely tile grain boundary Frenkel pair (GBFP) model, and corresponding diffusion mechanisms during electromigration developed using atomic molecular statics (MS), Monte Carlo (MC), and molecular dynamics (MD) simulation techniques in Al and AI-Cu. We contend that large numbers of interstitials and vacancies exist at grain boundaries and both contribute to mass transport. Cu preferentially segregates to the interstitial sites at grain boundaries via a Frenkel pair generation process and reduces the overall grain boundary diffusivity due to the strong binding in the AI-CU dimer. Predictions from our models are in excellent agreement with available experimental data and observations. implications of the GBFP model on grain boundary segregation, mass transport, and diffusion induced migration will be discussed.

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Documento generato il 28/03/20 alle ore 23:36:38