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Titolo:
Comparative study of Cu and CuAl0.3 wt.% films
Autore:
Schwalbe, G; Baumann, J; Kaufmann, C; Gessner, T; Koenigsmann, H; Bartzsch, A; Gilman, P;
Indirizzi:
Chemnitz Univ Technol, Ctr Microtechnol, D-09107 Chemnitz, Germany Chemnitz Univ Technol Chemnitz Germany D-09107 D-09107 Chemnitz, Germany Mat Res Corp, Orangeburg, NY 10962 USA Mat Res Corp Orangeburg NY USA 10962 t Res Corp, Orangeburg, NY 10962 USA
Titolo Testata:
MICROELECTRONIC ENGINEERING
fascicolo: 1-4, volume: 55, anno: 2001,
pagine: 341 - 348
SICI:
0167-9317(200103)55:1-4<341:CSOCAC>2.0.ZU;2-0
Fonte:
ISI
Lingua:
ENG
Soggetto:
COPPER; AL;
Keywords:
Cu; Al; alloy; microstructure; stress; resistivity; adhesion; corrosion;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
--discip_EC--
Citazioni:
14
Recensione:
Indirizzi per estratti:
Indirizzo: Schwalbe, G Chemnitz Univ Technol, Ctr Microtechnol, D-09107 Chemnitz, Germany Chemnitz Univ Technol Chemnitz Germany D-09107 nitz, Germany
Citazione:
G. Schwalbe et al., "Comparative study of Cu and CuAl0.3 wt.% films", MICROEL ENG, 55(1-4), 2001, pp. 341-348

Abstract

Cu and CuAl0.3 wt.% films were deposited by DC magnetron sputtering on SiO2 or a Ta interlayer. They are characterized with respect to resistivity, sl ess, adhesion, roughness and microstructure. The Al concentration is homogeneous within the CuAl0.3 wt.% films and equals the target composition. Alis enriched at the surface after annealing. No Al precipitation or formation of intermetallic phases is observed. The addition of Al results in a decreased roughness, which is caused by significantly smaller grains of nearlyconstant size. Adhesion on SiO2 (after annealing) and oxidation resistanceare improved due to the addition of Al. The modified properties of the alloy are balanced with an increase in resistivity of 3.3 mu Omega cm after deposition, which decreases to the bulk value of 2.6 mu Omega cm after annealing. Process parameters and target erosion profile are equal to pure Cu targets. (C) 2001 Elsevier Science B.V. All rights reserved.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 13/07/20 alle ore 05:11:43