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Titolo:
Evolution of stress and microstructure in NiFe (20 wt.%) thin films duringannealing
Autore:
Bruckner, W; Thomas, J; Schneider, CM;
Indirizzi:
Inst Solid State & Mat Res Dresden, D-01171 Dresden, Germany Inst Solid State & Mat Res Dresden Dresden Germany D-01171 sden, Germany
Titolo Testata:
THIN SOLID FILMS
fascicolo: 1-2, volume: 385, anno: 2001,
pagine: 225 - 229
SICI:
0040-6090(20010402)385:1-2<225:EOSAMI>2.0.ZU;2-L
Fonte:
ISI
Lingua:
ENG
Soggetto:
MECHANICAL-STRESS;
Keywords:
stress; resistivity; structural properties; alloys;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Physical, Chemical & Earth Sciences
Engineering, Computing & Technology
Citazioni:
17
Recensione:
Indirizzi per estratti:
Indirizzo: Bruckner, W Inst Solid State & Mat Res Dresden, POB 270016, D-01171 Dresden, Germany Inst Solid State & Mat Res Dresden POB 270016 Dresden Germany D-01171
Citazione:
W. Bruckner et al., "Evolution of stress and microstructure in NiFe (20 wt.%) thin films duringannealing", THIN SOL FI, 385(1-2), 2001, pp. 225-229

Abstract

The stress evolution on NiFe (20 wt.%) thin films with thickness of 170 nmwas studied during thermal cycles up to maximal 530 degreesC. The results are correlated to microstructural analyses carried out on samples cycled toVarious maximum temperatures by means of transmission electron microscopy,X-ray diffraction, and Auger electron spectroscopy. In addition, resistance-vs.-temperature measurements yielded more information about the microstructural evolution. The atomic rearrangement in grain boundaries is held responsible for a first irreversible stress contribution appearing between 150 and 300 degreesC. A second, more distinct irreversible tensile stress contribution of approximately 400 MPa occurs between 300 and 400 degreesC. It isexplained by abnormal grain growth which can be observed in the same temperature range. (C) 2001 Elsevier Science B.V. All rights reserved.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 16/07/20 alle ore 19:43:59