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Titolo:
Moire interferometry for engineering mechanics: current practices and future developments
Autore:
Han, B; Post, D; Ifju, P;
Indirizzi:
Univ Maryland, Dept Mech Engn, Inst Technol, College Pk, MD 20742 USA UnivMaryland College Pk MD USA 20742 t Technol, College Pk, MD 20742 USA Virginia Polytech Inst & State Univ, Dept Engn Sci & Mech, Blacksburg, VA 24061 USA Virginia Polytech Inst & State Univ Blacksburg VA USA 24061 VA 24061 USA Univ Florida, Gainesville, FL USA Univ Florida Gainesville FL USAUniv Florida, Gainesville, FL USA
Titolo Testata:
JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN
fascicolo: 1, volume: 36, anno: 2001,
pagine: 101 - 117
SICI:
0309-3247(200101)36:1<101:MIFEMC>2.0.ZU;2-4
Fonte:
ISI
Lingua:
ENG
Soggetto:
RESIDUAL-STRESS DISTRIBUTION; TEXTILE COMPOSITE-MATERIALS; FRINGE PATTERN-ANALYSIS; ENERGY-RELEASE RATES; COMPRESSION; HETERODYNE; TITANIUM; STRAINS; FIELD; JOINT;
Keywords:
moire interferometry; engineering mechanics;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
Citazioni:
75
Recensione:
Indirizzi per estratti:
Indirizzo: Han, B Univ Maryland, Dept Mech Engn, Inst Technol, 2181 Glenn L Martin Hall, College Pk, MD 20742 USA Univ Maryland 2181 Glenn L Martin Hall CollegePk MD USA 20742 USA
Citazione:
B. Han et al., "Moire interferometry for engineering mechanics: current practices and future developments", J STRAIN A, 36(1), 2001, pp. 101-117

Abstract

In the past decade, the optical method called moire interferometry has matured rapidly to emerge as an invaluable tool, proved by many industrial andscientific applications. It has been applied to numerous problems in engineering mechanics. It measures in-plane displacement fields with high sensitivity and high spatial resolution. This paper reviews current practices of moire interferometry and its extensions. Applications in diverse fields areaddressed to demonstrate the wide applicability of the method, especially the recent applications for thermal deformation analyses of microelectronics devices. Speculation on future developments and practices is presented.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 03/07/20 alle ore 01:25:48