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Titolo:
Effect of cooling rate on the isothermal fatigue behavior of CBGA solder joints in shear
Autore:
Fan, SH; Chan, YC; Tang, CW; Lai, JKL;
Indirizzi:
City Univ Hong Kong, Dept Elect Engn, Kowloon, Hong Kong, Peoples R China City Univ Hong Kong Kowloon Hong Kong Peoples R China g, Peoples R China City Univ Hong Kong, Dept Phys & Mat Sci, Kowloon, Hong Kong, Peoples R China City Univ Hong Kong Kowloon Hong Kong Peoples R China g, Peoples R China
Titolo Testata:
IEEE TRANSACTIONS ON ADVANCED PACKAGING
fascicolo: 1, volume: 24, anno: 2001,
pagine: 10 - 16
SICI:
1521-3323(200102)24:1<10:EOCROT>2.0.ZU;2-2
Fonte:
ISI
Lingua:
ENG
Keywords:
ceramic BGA; cooling rate; fatigue lifetime distribution; shear cycle test; solder joint reliability; solidification;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
--discip_EC--
Citazioni:
19
Recensione:
Indirizzi per estratti:
Indirizzo: Fan, SH City Univ Hong Kong, Dept Elect Engn, Kowloon, Hong Kong, Peoples R China City Univ Hong Kong Kowloon Hong Kong Peoples R China es R China
Citazione:
S.H. Fan et al., "Effect of cooling rate on the isothermal fatigue behavior of CBGA solder joints in shear", IEEE T AD P, 24(1), 2001, pp. 10-16

Abstract

This paper investigates the distribution characteristics of the isothermalfatigue lifetime of ceramic ball grid array (CBGA) solder joints in shear,Placement direction of the board-level assembly on the oven conveyor during reflow critically influences the fatigue lifetime of solder joints in shear: the front or outer solder joints have a longer shear lifetime than the rear or inner ones, The solder joints that moved diagonally during reflow have a longer fatigue lifetime and a tighter distribution. Cracks initiated in the eutectic solder region on the card and package side and tend to propagated in that region, while final failure occurred mainly on the card-saideutectic solder region. This phenomenon can be explained that the front orouter solder bumps have a resistant effect to the gas fluid which passes through the rear or inner solder bumps, and lower these solder joints' cooling rate during solidification. Fast cooling rate can cause a more fine-grained and homogeneous microstructure in eutectic solder alloy, which can delay crack initiation and slow crack growth. When the board-level assembly moves diagonally during reflow, the resistant effect of front solder bumps to the gas fluid reduces markedly. So the fatigue lifetime of solder joints and its distribution characteristic enhance substantially. The theories of fluid dynamics and heat transmission are used to calculate the decrease of gas fluid velocity and the corresponding reduction of mean coefficient of heat transfer (h(m)).

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Documento generato il 04/04/20 alle ore 21:20:38