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Titolo:
Thermal interface materials
Autore:
Chung, DDL;
Indirizzi:
SUNY Buffalo, Composite Mat Res Lab, Buffalo, NY 14260 USA SUNY Buffalo Buffalo NY USA 14260 site Mat Res Lab, Buffalo, NY 14260 USA
Titolo Testata:
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
fascicolo: 1, volume: 10, anno: 2001,
pagine: 56 - 59
SICI:
1059-9495(200102)10:1<56:TIM>2.0.ZU;2-H
Fonte:
ISI
Lingua:
ENG
Soggetto:
PHASE-CHANGE MATERIALS; HEAT-STORAGE MATERIALS; CHANGE MATERIALS PCMS; ENERGY-STORAGE; SYSTEMS;
Keywords:
conduction; heat transfer; phase change material; solder; thermal contact; thermal interface; thermal paste;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
Citazioni:
30
Recensione:
Indirizzi per estratti:
Indirizzo: Chung, DDL SUNY Buffalo, Composite Mat Res Lab, Buffalo, NY 14260 USA SUNYBuffalo Buffalo NY USA 14260 s Lab, Buffalo, NY 14260 USA
Citazione:
D.D.L. Chung, "Thermal interface materials", J MAT ENG P, 10(1), 2001, pp. 56-59

Abstract

Thermal interface materials for facilitating heat transfer by conduction across two adjacent surfaces are reviewed. They include thermal fluids and pastes, solders, phase change materials (PCMs), and resilient thermal conductors.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 07/07/20 alle ore 22:21:47