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Titolo:
PBII processing of dielectric layers: physical aspects limitations and experimental results
Autore:
Lacoste, A; Le Coeur, F; Arnal, Y; Pelletier, J; Grattepain, C;
Indirizzi:
LEMD, CNRS, F-38042 Grenoble, France LEMD Grenoble France F-38042LEMD, CNRS, F-38042 Grenoble, France Thomson CSF, LCR, F-91404 Orsay, France Thomson CSF Orsay France F-91404Thomson CSF, LCR, F-91404 Orsay, France
Titolo Testata:
SURFACE & COATINGS TECHNOLOGY
fascicolo: 2-3, volume: 135, anno: 2001,
pagine: 268 - 273
SICI:
0257-8972(20010115)135:2-3<268:PPODLP>2.0.ZU;2-8
Fonte:
ISI
Lingua:
ENG
Soggetto:
IMMERSION ION-IMPLANTATION; PLASMA; SHEATHS; MODEL;
Keywords:
plasma immersion; ion implantation; dielectric substrates; polymers; silicon on glass;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
Citazioni:
13
Recensione:
Indirizzi per estratti:
Indirizzo: Pelletier, J LEMD, CNRS, 25 Rue Martyrs,BP 166, F-38042 Grenoble, France LEMD 25 Rue Martyrs,BP 166 Grenoble France F-38042 e, France
Citazione:
A. Lacoste et al., "PBII processing of dielectric layers: physical aspects limitations and experimental results", SURF COAT, 135(2-3), 2001, pp. 268-273

Abstract

Processing of dielectric layers using a plasma-based ion implantation (PBII) technique has general implications in terms of plasma specifications andpulse characteristics. In particular, the different aspects of the processing of dielectric layers are discussed as functions of plasma density, pulse duration, and layer characteristics (thickness and permittivity). Clearly, severe limitations (true implantation energy, arcing) may appear for high-density plasmas as well as for long pulse durations when processing dielectric layers with thicknesses in the millimeter range. Typical examples of ion implantation in dielectric materials are presented, e.g. oxygen ion implantation in polymer sheets (for hydrophilic or adhesion treatments) and nitrogen implantation of polysilicon films on glass. The experimental results demonstrate the feasibility of processing dielectric layers with the PBII technique, but with severe limitations resulting from the process itself. (C) 2001 Elsevier Science B.V. All rights reserved.

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Documento generato il 03/07/20 alle ore 01:22:36