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Titolo:
Solder metallization interdiffusion in microelectronic interconnects
Autore:
Zribi, A; Chromik, RR; Presthus, R; Teed, K; Zavalij, L; DeVita, J; Tova, J; Cotts, EJ; Clum, JA; Erich, R; Primavera, A; Westby, G; Coyle, RJ; Wenger, GM;
Indirizzi:
SUNY Binghamton, Dept Phys, Binghamton, NY 13902 USA SUNY Binghamton Binghamton NY USA 13902 pt Phys, Binghamton, NY 13902 USA Amkor Technol, Chandler, AZ 85248 USA Amkor Technol Chandler AZ USA 85248Amkor Technol, Chandler, AZ 85248 USA Universal Instruments Corp, Binghamton, NY 13902 USA Universal InstrumentsCorp Binghamton NY USA 13902 nghamton, NY 13902 USA Bell Labs, Lucent Technol, Princeton, NJ 08542 USA Bell Labs Princeton NJUSA 08542 Lucent Technol, Princeton, NJ 08542 USA
Titolo Testata:
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
fascicolo: 2, volume: 23, anno: 2000,
pagine: 383 - 387
SICI:
1521-3331(200006)23:2<383:SMIIMI>2.0.ZU;2-F
Fonte:
ISI
Lingua:
ENG
Soggetto:
INTERMETALLIC COMPOUND FORMATION; COUPLES; PACKAGES; GOLD; SN; PD;
Keywords:
AuNiSn; AuSn; intermetallic compounds; solder alloys; solder joints; solder joint failure; thermal aging;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
--discip_EC--
Citazioni:
27
Recensione:
Indirizzi per estratti:
Indirizzo: Zribi, A SUNY Binghamton, Dept Phys, Binghamton, NY 13902 USA SUNY Binghamton Binghamton NY USA 13902 Binghamton, NY 13902 USA
Citazione:
A. Zribi et al., "Solder metallization interdiffusion in microelectronic interconnects", IEEE T COMP, 23(2), 2000, pp. 383-387

Abstract

We investigated the growth of intermetallic compounds in Cu/Ni/Au/PbSn solder joints. The substrates that we investigated had been Au plated by one of two different techniques, The An finish thicknesses ranged from 0.25 to 2.6 mu m. After solder reflow, structural examinations using optical and electron microscopy of cross-sectioned solder joints revealed the growth of Ni3Sn4 at the solder/Ni interface after reflow. Solder joints with thicker layers of An annealed in Ar gas at a temperature of 150 degrees C for up to 450 h, displayed an appreciable growth of Au0.5Ni0.5Sn4 at the Ni3Sn4/solderinterface. Previous investigators correlated growth of a Au-Sn alloy with the degradation of the mechanical properties of the solder joint. The determination of the stoichiometry of the Au0.5Ni0.5Sn4 phase provides some understanding of why this phase grew at the Ni3Sn4/solder interface, as Sn, Au and Ni are all readily available at this interface. The growth of this ternary alloy is also consistent with trends observed in the kinetics of formation of solder alloys.

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Documento generato il 06/07/20 alle ore 08:55:34