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Titolo:
Plasma doping: Progress and potential - Part two of two
Autore:
Chu, PK; Felch, SB; Kellerman, P; Sinclair, F; Larson, LA; Mizuno, B;
Indirizzi:
City Univ Hong Kong, Dept Phys & Math Sci, Kowloon, Hong Kong City Univ Hong Kong Kowloon Hong Kong ys & Math Sci, Kowloon, Hong Kong Varian Semicond Equipment Assoc, Palo Alto, CA USA Varian Semicond Equipment Assoc Palo Alto CA USA ssoc, Palo Alto, CA USA Eaton Corp, Beverly, MA 01915 USA Eaton Corp Beverly MA USA 01915Eaton Corp, Beverly, MA 01915 USA SEMATECH, Austin, TX 78741 USA SEMATECH Austin TX USA 78741SEMATECH, Austin, TX 78741 USA Matsushita Elect Ind Co Ltd, Osaka, Japan Matsushita Elect Ind Co Ltd Osaka Japan Elect Ind Co Ltd, Osaka, Japan
Titolo Testata:
SOLID STATE TECHNOLOGY
fascicolo: 10, volume: 42, anno: 1999,
pagine: 77 -
SICI:
0038-111X(199910)42:10<77:PDPAP->2.0.ZU;2-6
Fonte:
ISI
Lingua:
ENG
Soggetto:
IMMERSION ION-IMPLANTATION;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
--discip_EC--
Citazioni:
30
Recensione:
Indirizzi per estratti:
Indirizzo: Chu, PK City Univ Hong Kong, Dept Phys & Math Sci, 83 Tat Chee Ave, Kowloon, Hong Kong City Univ Hong Kong 83 Tat Chee Ave Kowloon Hong Kong Hong Kong
Citazione:
P.K. Chu et al., "Plasma doping: Progress and potential - Part two of two", SOL ST TECH, 42(10), 1999, pp. 77

Abstract

Plasma doping is the leading candidate to replace today's beam-line ion implantation, which is being pushed to the limit by the need for ultra-shallow junctions. Cluster-compatible hardware is envisioned to provide simpler, more economical, higher-throughput wafer processing. Part one of this article, in the September issue of SST, reviewed the status of plasma doping, cited device data, and touched on process and equipment issues. Part two discusses potential problems, including charge damage, equipment requirements, and economic factors.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 25/11/20 alle ore 15:48:23