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Titolo:
Corrosion at the grain boundary and a fluorine-related passivation layer on etched Al-Cu (1%) alloy surfaces
Autore:
Baek, KH; Yoon, YS; Park, JM; Kwon, KH; Kim, CI; Nam, KS;
Indirizzi:
Elect & Telecommun Res Inst, Semicond Technol Div, Taejon, South Korea Elect & Telecommun Res Inst Taejon South Korea Div, Taejon, South Korea
Titolo Testata:
ETRI JOURNAL
fascicolo: 3, volume: 21, anno: 1999,
pagine: 16 - 21
SICI:
1225-6463(199909)21:3<16:CATGBA>2.0.ZU;2-X
Fonte:
ISI
Lingua:
ENG
Soggetto:
MECHANISM; FILMS;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
Citazioni:
14
Recensione:
Indirizzi per estratti:
Indirizzo: Baek, KH Elect & Telecommun Res Inst, Semicond Technol Div, Taejon, South Korea Elect & Telecommun Res Inst Taejon South Korea on, South Korea
Citazione:
K.H. Baek et al., "Corrosion at the grain boundary and a fluorine-related passivation layer on etched Al-Cu (1%) alloy surfaces", ETRI J, 21(3), 1999, pp. 16-21

Abstract

After etching Al-Cu alloy films using SiCl4/Cl2He/ CHF3 mixed gas plasma, the corrosion phenomenon at the grain boundary of the etched surface and a passivation layer on the etched surface with an SF6 plasma treatment subsequent to the etching were studied. In Al-Cu alloy system, corrosion occurs rapidly on the etched surface by residual chlorine atoms, and it occurs dominantly at the grain boundaries rather than the crystalline surfaces. To prevent corrosion, the SF6 gas plasma treatment subsequent to etching was carried out. The passivation layer is composed of fluorine-related compounds onthe etched.41-Cu surface after the SF6 treatment, and it suppresses effectively corrosion on the surface as the SF6 treatment pressure increases. Corrosion could be suppressed successfully with the SF6 treatment at a total pressure of 300 mTorr: To investigate the reason why corrosion could be suppressed with the SF6 treatment, behaviors of chlorine and fluorine were studied by various analysis techniques, It was also found that the residual chlorine incorporated at the grain boundary of the etched surface accelerates corrosion and could not be re moved after the SF6 plasma treatment.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 28/11/20 alle ore 03:57:34