Catalogo Articoli (Spogli Riviste)

OPAC HELP

Titolo:
Fracture behavior of isotropically conductive adhesives
Autore:
Gupta, S; Hydro, RM; Pearson, RA;
Indirizzi:
Lehigh Univ, Mat Res Ctr, Bethlehem, PA 18015 USA Lehigh Univ Bethlehem PA USA 18015 , Mat Res Ctr, Bethlehem, PA 18015 USA
Titolo Testata:
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
fascicolo: 2, volume: 22, anno: 1999,
pagine: 209 - 214
SICI:
1521-3331(199906)22:2<209:FBOICA>2.0.ZU;2-A
Fonte:
ISI
Lingua:
ENG
Soggetto:
EPOXIES; RUBBER; MECHANISMS; SIZE;
Keywords:
crack path deflection; polymer adhesive; polymer metal interface; silver-filled epoxies; silver-particles;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
--discip_EC--
Citazioni:
15
Recensione:
Indirizzi per estratti:
Indirizzo: Gupta, S Lehigh Univ, Mat Res Ctr, Bethlehem, PA 18015 USA Lehigh Univ Bethlehem PA USA 18015 Ctr, Bethlehem, PA 18015 USA
Citazione:
S. Gupta et al., "Fracture behavior of isotropically conductive adhesives", IEEE T COMP, 22(2), 1999, pp. 209-214

Abstract

The fracture behavior of several commercial, silver-filled epoxies was studied using a combination of fracture mechanics, surface science, and microscopy, Three-point bend tests revealed that the bulk fracture toughness of the silver-filled epoxies fell with a narrow range 1.1-1.3 MPa-m(0.5). Both electron and optical microscopy studies indicated that crack path deflection due to the silver-particles was the primary micromechanical deformation mechanism. Surprisingly, the interfacial fracture energies between the epoxies and a copper surface ranged from 50 to 900 J/m(2), Contact angle measurements on the cured epoxies indicated that some epoxy surfaces are more active than others. However, the correlation between thermodynamic work of adhesion and fracture energy is rather weak and suggests only a modest trend. In summary, although the use of contact angles/surface energies to predict adhesion is promising, much more effort is required to make it a reliable screening tool. Fortunately, the use of interfacial fracture mechanics can detect differences in adhesive strength, and should allow packaging engineersto select die attach adhesives with improved adhesion.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 29/09/20 alle ore 09:45:57