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Titolo:
Synthesis, characterization, thermal and flame-retardant properties of silicon-based epoxy resins
Autore:
Hsiue, GH; Wang, WJ; Chang, FC;
Indirizzi:
Natl Tsing Hua Univ, Dept Chem Engn, Hsinchu 300, Taiwan Natl Tsing Hua Univ Hsinchu Taiwan 300 pt Chem Engn, Hsinchu 300, Taiwan Natl Chaio Toun Univ, Dept Appl Chem, Hsinchu 300, Taiwan Natl Chaio Toun Univ Hsinchu Taiwan 300 t Appl Chem, Hsinchu 300, Taiwan
Titolo Testata:
JOURNAL OF APPLIED POLYMER SCIENCE
fascicolo: 7, volume: 73, anno: 1999,
pagine: 1231 - 1238
SICI:
0021-8995(19990815)73:7<1231:SCTAFP>2.0.ZU;2-1
Fonte:
ISI
Lingua:
ENG
Soggetto:
ALKOXYSILANE GROUPS; POLYMERIZATION; COMPOSITES; MORPHOLOGY; STRENGTH; MONOMERS;
Keywords:
silicon; epoxy; char yield; limiting oxygen index;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Physical, Chemical & Earth Sciences
Engineering, Computing & Technology
Citazioni:
23
Recensione:
Indirizzi per estratti:
Indirizzo: Hsiue, GH Natl Tsing Hua Univ, Dept Chem Engn, Hsinchu 300, Taiwan Natl Tsing Hua Univ Hsinchu Taiwan 300 gn, Hsinchu 300, Taiwan
Citazione:
G.H. Hsiue et al., "Synthesis, characterization, thermal and flame-retardant properties of silicon-based epoxy resins", J APPL POLY, 73(7), 1999, pp. 1231-1238

Abstract

A new silicon-containing oxirane triglycidyl phenyl silane oxide (TGPSO) and its corresponding silicon-containing epoxy resins are synthesized and characterized. The activation energies of TGPSO curing reaction with various curing agents, including 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylsulfone, and dicyanodiaminde, are found to be 180, 196.5, and 154 kJ/mol. The curing reaction of TGPSO with diamines is determined to be a first-order reaction through means of Arrhenius plots. The introduction of the silicon-containing group results in higher curing reactivity. This silicon-containingresin possesses higher char yield as well as higher limiting oxygen index (LOI = 35) than the commercial epoxy resins, confirming the usefulness of these silicon-containing epoxy resins as flame retardants. Char yields and LOI measurements demonstrate that incorporating silicon into epoxy resins isable to improve their flame retardancy. (C) 1999 John Wiley & Sons, Inc.

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Documento generato il 07/07/20 alle ore 12:49:36