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Titolo:
FABRICATION PROCESSES FOR HIGH-T-C SUPERCONDUCTING INTEGRATED-CIRCUITS BASED ON EDGE-TYPE JOSEPHSON-JUNCTIONS
Autore:
SATOH T; HIDAKA M; TAHARA S;
Indirizzi:
NEC CORP LTD,FUNDAMENTAL RES LABS TSUKUBA IBARAKI 3058501 JAPAN
Titolo Testata:
IEICE transactions on electronics
fascicolo: 10, volume: E81C, anno: 1998,
pagine: 1532 - 1537
SICI:
0916-8524(1998)E81C:10<1532:FPFHSI>2.0.ZU;2-1
Fonte:
ISI
Lingua:
ENG
Soggetto:
ROUGHENING INSTABILITY; SURFACE;
Keywords:
YBA2CU3OX; PRBA2CU3OX; JOSEPHSON JUNCTION; INTEGRATED CIRCUIT; GROUNDPLANE;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Citazioni:
13
Recensione:
Indirizzi per estratti:
Citazione:
T. Satoh et al., "FABRICATION PROCESSES FOR HIGH-T-C SUPERCONDUCTING INTEGRATED-CIRCUITS BASED ON EDGE-TYPE JOSEPHSON-JUNCTIONS", IEICE transactions on electronics, E81C(10), 1998, pp. 1532-1537

Abstract

We have studied an in situ edge preparation process and the effect ofa substrate rotation during the edge preparation in order to improve the uniformity and electrical characteristics of high-T-c edge-type Josephson junctions. The improved YBa2Cu3Ox/PrBa2Cu3Ox/YBa2Cu3Ox edge junctions showed small la-critical current spreads as low as 10% for 12 junctions. We have confirmed that the spreads do not increase significantly by adding groundplane over the junctions. In this paper, we willdescribe these processes developed for the fabrication of high-T-c superconducting integrated circuits.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 03/12/20 alle ore 10:50:58