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Titolo:
TEXTURES OF THIN COPPER-FILMS
Autore:
KUSCHKE WM; KRETSCHMANN A; KELLER RM; VINCI RP; KAUFMANN C; ARZT E;
Indirizzi:
UNIV STUTTGART,MAX PLANCK INST MET RES,SEESTR 71 D-70174 STUTTGART GERMANY UNIV STUTTGART,INST METALLKUNDE D-70174 STUTTGART GERMANY STANFORD UNIV,DEPT MAT SCI & ENGN STANFORD CA 94305 TU CHEMNITZ ZWICKAU,FAK ELEKTROTECH & INFORMAT TECH,ZENTRUM MIKROTECHNOL D-09126 CHEMNITZ GERMANY
Titolo Testata:
Journal of materials research
fascicolo: 10, volume: 13, anno: 1998,
pagine: 2962 - 2968
SICI:
0884-2914(1998)13:10<2962:>2.0.ZU;2-5
Fonte:
ISI
Lingua:
ENG
Soggetto:
ELECTROMIGRATION; MICROSTRUCTURE; STRESS; LAYER; AL;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Citazioni:
21
Recensione:
Indirizzi per estratti:
Citazione:
W.M. Kuschke et al., "TEXTURES OF THIN COPPER-FILMS", Journal of materials research, 13(10), 1998, pp. 2962-2968

Abstract

The textures of thin copper films were determined quantitatively by measuring (111) pole figures with x-ray diffraction. Measurements were performed on a variety of samples, differing in copper film thickness and deposition technique, diffusion barrier material, and the presenceor absence of a cap layer. Texture changes due to an annealing treatment were also recorded and correlated with stress measurements by the wafer-curvature technique. It is found that the deposition method (PVDvs CVD) has a strong effect on texture, barrier layer effects range from negligible to significant depending on the barrier material, and the effect of a cap layer is insignificant.

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Documento generato il 11/07/20 alle ore 20:44:39