Catalogo Articoli (Spogli Riviste)

OPAC HELP

Titolo:
PASSIVATION ROLE OF FLUORINE ON THE ANTICORROSION OF ALCU FILMS AFTERPLASMA-ETCHING
Autore:
BAEK KH; KIM CI; KWON KH; KIM TH; CHANG EG; YUN SJ; YOON YS; KIM SG; NAM KS;
Indirizzi:
CHUNG ANG UNIV,SCH ELECT & ELECT ENGN,221 HUKSUK DONG SEOUL 156756 SOUTH KOREA CHUNG ANG UNIV,SCH ELECT & ELECT ENGN SEOUL 156756 SOUTH KOREA ELECT & TELECOMMUN RES INST,SEMICOND DIV,YUSONG POB 106 TAEJON 305600SOUTH KOREA HANSEO UNIV,DEPT ELECT ENGN SEOSAN SI 356820 CHUNG NAM SOUTH KOREA YEOJOO TECH COLL,DEPT ELECT ENGN YEOJOO GUN 469800 KYUNGGI DO SOUTH KOREA
Titolo Testata:
Journal of vacuum science & technology. A. Vacuum, surfaces, and films
fascicolo: 3, volume: 16, anno: 1998,
parte:, 2
pagine: 1469 - 1472
SICI:
0734-2101(1998)16:3<1469:PROFOT>2.0.ZU;2-A
Fonte:
ISI
Lingua:
ENG
Soggetto:
SI-CU; CORROSION;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Science Citation Index Expanded
Citazioni:
9
Recensione:
Indirizzi per estratti:
Citazione:
K.H. Baek et al., "PASSIVATION ROLE OF FLUORINE ON THE ANTICORROSION OF ALCU FILMS AFTERPLASMA-ETCHING", Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 16(3), 1998, pp. 1469-1472

Abstract

To eliminate corrosion, a subsequent treatment of SF6 plasma after anAl-Cu etching has been carried out. X-ray photoelectron spectroscopy (XPS) studies showed that the F content on the Al-Cu alloy surface caused by the SF6 treatment increased as the chamber pressure increased, and Cl incorporated during the Al-Cu alloy etching was not totally removed by the post treatment using SF6 gas plasma. However, it was confirmed by scanning electron microscopy (SEM) that corrosion could be eliminated by the SF6 treatment at 300 mTorr. At the same time, the results of angle-resolved XPS showed that elemental Al was distributed under the layer of F-related compounds. These results indicate that SF6 treatment can reduce the corrosion of Al-Cu alloy films by producing a F-containing layer on the etched surface. From the SEM image, the existence of a passivation layer on the Al-Cu alloy film surface by fluorine-related compounds was confirmed. The passivation layer prevents moisture penetration on the SF6-treated surface and suppresses corrosion successfully. The composition of the passivation layer measured by angle-resolved XPS was mostly uniform within a few hundred nm thickness. The passivation film was composed of 32% Al, 43% F, 2% Cl, and 10% O ata SF6 pressure of 300 mTorr, Approximately 2% of Cl was uniformly distributed in the film. (C) 1998 American Vacuum Society.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 05/12/20 alle ore 00:48:23