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Titolo:
INTERDIFFUSION OF CU SUBSTRATE ELECTRODEPOSITS FOR CU/CO, CU/CO-W, CU/CO/NI AND CU/CO-W/NI SYSTEMS/
Autore:
CHOW KM; NG WY; YEUNG LK;
Indirizzi:
HONG KONG POLYTECH UNIV,DEPT APPL BIOL & CHEM TECHNOL,HUNG HOM HONG KONG PEOPLES R CHINA HONG KONG PROD COUNCIL HONG KONG PEOPLES R CHINA
Titolo Testata:
Surface & coatings technology
fascicolo: 1-2, volume: 99, anno: 1998,
pagine: 161 - 170
SICI:
0257-8972(1998)99:1-2<161:IOCSEF>2.0.ZU;2-M
Fonte:
ISI
Lingua:
ENG
Soggetto:
THIN-FILMS;
Keywords:
COBALT; DIFFUSION BARRIER; NICKEL; TUNGSTEN;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Citazioni:
14
Recensione:
Indirizzi per estratti:
Citazione:
K.M. Chow et al., "INTERDIFFUSION OF CU SUBSTRATE ELECTRODEPOSITS FOR CU/CO, CU/CO-W, CU/CO/NI AND CU/CO-W/NI SYSTEMS/", Surface & coatings technology, 99(1-2), 1998, pp. 161-170

Abstract

The interdiffusion of electrodeposited Ni, Co and Co-W with Cu substrate were studied, at temperature ranging from 400 to 800 degrees C, using energy dispersive X-ray spectroscopy (EDS). Chemical interdiffusion coefficients were calculated using the Boltzmann-Matano analysis. Intermetallic phase formation was studied by X-ray diffraction (XRD) andmicrostructures were observed with a scanning electron microscopy (SEM). No remarkable interdiffusion was observed in the Cu/Co and Cu/Co-Wsystems up to 800 degrees C. However, after annealing at 400-800 degrees C for the Cu/Co/Ni system, accumulation of Cu atoms was found at the Co/Ni interface in which Cu had further diffused into the Ni electrodeposit. It is suggested that Cu diffuses through the Co layer by thegrain-boundary diffusion mechanism. Interdiffusion of Cu through electroplated Co coating to Ni was compared with electroplated alloy coating of 65 wt.% co-35 wt.% W. The structure of the Co-W coating has changed from a mixture of Go-like hcp and fee structures to a solely fee structure upon annealing at 1100 degrees C for 90 min. The diffusion barrier properties of Co and Co-W were compared with those of Ni. The results show that Co is a more effective barrier than Ni for Cu diffusion up to 219 h at 400 degrees C. A Co-W alloy coating, of 36 wt.% W, isa more effective barrier for Cu diffusion than Ni heated up to 72 h at 500 degrees C. However, interpenetration of Cu through Co is more pronounced than diffusion of Cu through Ni for temperatures ranging from500 to 800 degrees C. Interdiffusion of Cu through the Co-36 wt.% W coating is more pronounced than diffusion of Cu through Ni for temperatures ranging from 600 to 800 degrees C whereas Co-W is a more effective barrier than Co for Cu diffusion. (C) 1998 Elsevier Science S.A.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 05/12/20 alle ore 01:59:32