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Titolo:
THE EFFECTS OF FLUORINE PASSIVATION USING SF6 PLASMA ON THE CORROSIONOF AL(CU 1-PERCENT) AT GRAIN-BOUNDARIES
Autore:
KWON KH; YUN SJ; KIM CI; PARK JM; BAEK KH; YOON YS; KIM SG; NAM KS;
Indirizzi:
HANSEO UNIV,DEPT ELECT ENGN,360 DAEGOK RI CHUNGNAM 356820 SOUTH KOREA CHUNG ANG UNIV,SCH ELECT & ELECT ENGN,DONGJAK GU SEOUL 156756 SOUTH KOREA ELECT & TELECOMMUN RES INST,SEMICOND DIV TAEJON 305600 SOUTH KOREA
Titolo Testata:
Journal of the Electrochemical Society
fascicolo: 3, volume: 145, anno: 1998,
pagine: 1044 - 1048
SICI:
0013-4651(1998)145:3<1044:TEOFPU>2.0.ZU;2-L
Fonte:
ISI
Lingua:
ENG
Soggetto:
MECHANISM; FILMS; AL; CU;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Science Citation Index Expanded
Citazioni:
7
Recensione:
Indirizzi per estratti:
Citazione:
K.H. Kwon et al., "THE EFFECTS OF FLUORINE PASSIVATION USING SF6 PLASMA ON THE CORROSIONOF AL(CU 1-PERCENT) AT GRAIN-BOUNDARIES", Journal of the Electrochemical Society, 145(3), 1998, pp. 1044-1048

Abstract

Corrosion effects following the etching of Al(Cu 1 %) using a SiCl4/Cl-2/He/CHF3 gas plasma have been evaluated. The phenomenon has been studied using X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM), and Auger electron spectroscopy (AES). It was found with SEM that the surface of Al(Cu 1 %) was mainly corroded at the grain boundary. Using AES point analysis, the cause of selective corrosion at the grain boundary of Al(Cu 1 %) has been investigated. The fluorine (F) and chlorine (Cl) on the etched Al(Cu 1 %) have been analyzed with AES. The results showed that the contents of F and Cl on the post-SF6 treated Al(Cu 1 %) were different at each of the analyzed positions such as the grain boundaries and crystalline regions. This seems toresult from the imperfect crystalline structure of Al(Cu 1 %) grain boundaries. The effects of subsequent in situ SF6 plasma treatment on the etched Al(Cu 1 %) has been also examined using XPS. It was also confirmed that F has passivated the Cl compounds. The AES and XPS resultsimply that Cl incorporated at the grain boundaries of the polycrystalline Al(Cu 1 %) film accelerated the corrosion and could not be easilyremoved by subsequent SF6 plasma treatment.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 28/11/20 alle ore 04:45:13