Catalogo Articoli (Spogli Riviste)

OPAC HELP

Titolo:
ELECTRICAL CHARACTERISTICS OF INTERCONNECTIONS FOR HIGH-PERFORMANCE SYSTEMS
Autore:
DEUTSCH A;
Indirizzi:
IBM CORP,THOMAS J WATSON RES CTR YORKTOWN HTS NY 10598
Titolo Testata:
Proceedings of the IEEE
fascicolo: 2, volume: 86, anno: 1998,
pagine: 315 - 355
SICI:
0018-9219(1998)86:2<315:ECOIFH>2.0.ZU;2-Y
Fonte:
ISI
Lingua:
ENG
Soggetto:
THERMAL CONDUCTION MODULE; MCM; PACKAGE; POLYIMIDE; MICROPROCESSORS; SUPERCOMPUTER; PROPAGATION; TECHNOLOGY; SIMULATION; SINGLE;
Keywords:
ATTENUATION MEASUREMENT; CABLES; CONNECTORS; COUPLED TRANSMISSION LINES; CROSS TALK; DELAY ESTIMATION; DIELECTRIC LOSSES; DIELECTRIC MEASUREMENTS; DISCONTINUITIES; ELECTROMAGNETIC COUPLING; IMPEDANCE MEASUREMENT; INTEGRATED CIRCUIT PACKAGING; INTERCONNECTIONS; MEASUREMENT; MULTICHIP MODULES; ON-CHIP WIRING; PRINTED CIRCUITS; RC CIRCUITS; RLC CIRCUITS; SIGNAL ANALYSIS;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Citazioni:
72
Recensione:
Indirizzi per estratti:
Citazione:
A. Deutsch, "ELECTRICAL CHARACTERISTICS OF INTERCONNECTIONS FOR HIGH-PERFORMANCE SYSTEMS", Proceedings of the IEEE, 86(2), 1998, pp. 315-355

Abstract

A review is presented of the electrical characteristics of high-density, high-performance interconnections used in digital and communication applications. These interconnections behave as lossy transmission lines for the frequency range of intel est. A brief theoretical explanation of the key properties of lossy coupled transmission lines is given. A new short-pulse propagation technique used for characterizing a large category of wiring is described. A detailed description is made ofeach of the major interconnect types encountered, namely, shielded cables, printed circuit boards, ceramic carriers, thin-film wiring, and on-chip wiring. Representative examples are given in each case to highlight the key performance-limiting parameters. The modeling and measurement techniques used are explained and examples are given. Future technological directions and their effect on performance are discussed.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 03/07/20 alle ore 01:07:48