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Titolo:
ELECTRODEPOSITION OF SN-AG-CU ALLOYS
Autore:
ARAI S; KANEKO N;
Indirizzi:
PRECIS TECHNOL RES INST NAGANO PREFECTURE OKAYA NAGANO 394 JAPAN SHINSHU UNIV,FAC ENGN NAGANO 380 JAPAN
Titolo Testata:
Denki Kagaku Oyobi Kogyo Butsuri Kagaku
fascicolo: 12, volume: 65, anno: 1997,
pagine: 1102 - 1106
SICI:
0366-9297(1997)65:12<1102:EOSA>2.0.ZU;2-P
Fonte:
ISI
Lingua:
ENG
Keywords:
PB-FREE SOLDER; SN-AG-CU ALLOY; ELECTRODEPOSITION; NON-CYANIDE BATH;
Tipo documento:
Article
Natura:
Periodico
Citazioni:
3
Recensione:
Indirizzi per estratti:
Citazione:
S. Arai e N. Kaneko, "ELECTRODEPOSITION OF SN-AG-CU ALLOYS", Denki Kagaku Oyobi Kogyo Butsuri Kagaku, 65(12), 1997, pp. 1102-1106

Abstract

Sn-Ag-Cu alloys could be electrodeposited from a non-cyanide bath containing potassium pyrophosphate and potassium iodide as the complexingagents for Sn, Ag and Cu. Alloys containing Ag in the range of 1.7 to8.7 atomic percent and Cu in the range of 2.0 to 11.1 atomic percent were formed at room temperature (25 +/- 2 degrees C) without agitationunder the galvanostatic conditions (current densities:2 to 20mAcm(-2)). The Ag and Cu contents in the electrodeposits decreased with increasing current density. The morphology was influenced by the deposits composition. The solidus temperature of the electrodeposits obtained in this study was about 217 degrees C.

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Documento generato il 13/07/20 alle ore 07:35:49