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Titolo:
Bonding mechanism and stress distribution of a glass frit free thick film metallization for AlN-ceramic
Autore:
Reicher, R; Smetana, W; Gruber, EU; Schuster, JC;
Indirizzi:
Tech Univ Vienna, Inst Werkstoffe Elektrotech, Vienna, Austria Tech Univ Vienna Vienna Austria Werkstoffe Elektrotech, Vienna, Austria Univ Vienna, Inst Phys Chem, A-1010 Vienna, Austria Univ Vienna Vienna Austria A-1010 Inst Phys Chem, A-1010 Vienna, Austria
Titolo Testata:
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
fascicolo: 6, volume: 9, anno: 1998,
pagine: 429 - 434
SICI:
0957-4522(199812)9:6<429:BMASDO>2.0.ZU;2-0
Fonte:
ISI
Lingua:
ENG
Soggetto:
TI;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Physical, Chemical & Earth Sciences
Engineering, Computing & Technology
--discip_EC--
Citazioni:
18
Recensione:
Indirizzi per estratti:
Indirizzo: Reicher, R TechustriaVienna, Inst Werkstoffe Elektrotech, Gusshausstr 27-29, Vienna, A Tech Univ Vienna Gusshausstr 27-29 Vienna Austria , Vienna, A
Citazione:
R. Reicher et al., "Bonding mechanism and stress distribution of a glass frit free thick film metallization for AlN-ceramic", J MAT S-M E, 9(6), 1998, pp. 429-434

Abstract

Typical thick film pastes applied for the metallization of AIN-ceramics are glass bonding systems. The glass phase responsible for adhesion onto the ceramic unfortunately also acts as a heat barrier and impairs the excellentthermal conductivity of AIN. A new glass frit free conductor paste has been especially developed for the metallization of AIN. A numerical analysis of the stress distribution within the metallized ceramic induced by a continuous as well as a pulsed mode operating heat source has been conducted for this new metallization paste and, for comparison purpose, also for a standard thick film paste by means of a finite element program. In order to determine the physical property data of the phases occurring at the interface between metallization and substrate required for numerical simulation the relevant intermetallic samples have been synthesized.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 27/11/20 alle ore 01:05:43