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Titolo:
Development of glass frit free metallization systems for AIN
Autore:
Adlassnig, A; Schuster, JC; Reicher, R; Smetana, W;
Indirizzi:
Univ Vienna, Inst Phys Chem, Vienna, Austria Univ Vienna Vienna AustriaUniv Vienna, Inst Phys Chem, Vienna, Austria
Titolo Testata:
JOURNAL OF MATERIALS SCIENCE
fascicolo: 20, volume: 33, anno: 1998,
pagine: 4887 - 4892
SICI:
0022-2461(19981015)33:20<4887:DOGFFM>2.0.ZU;2-Q
Fonte:
ISI
Lingua:
ENG
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Physical, Chemical & Earth Sciences
Engineering, Computing & Technology
--discip_EC--
Citazioni:
10
Recensione:
Indirizzi per estratti:
Indirizzo: Adlassnig, A Univ Vienna, Inst Phys Chem, Wahringerstr 42, Vienna, AustriaUniv Vienna Wahringerstr 42 Vienna Austria Vienna, Austria
Citazione:
A. Adlassnig et al., "Development of glass frit free metallization systems for AIN", J MATER SCI, 33(20), 1998, pp. 4887-4892

Abstract

Currently only glass bonding thick film conductor systems are commerciallyavailable for metallizing AIN-ceramic. The glass phase formed between metallization and ceramic impairs the high thermal conductivity of AIN. A new glass frit free metallization system has been developed utilizing the bonding mechanism of active brazing to provide the adhesion of metallization ontothe ceramic. Aspects of paste preparation range from the derivation of themetallic powder to the selection of an appropriate printing vehicle which must decompose completely during the firing process under an inert atmosphere. The adhesion strength of the new paste system with the alternative bonding mechanism has been evaluated and contrasted with that of standard thickfilm pastes. (C) 1998 Kluwer Academic Publishers.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 03/12/20 alle ore 06:00:04