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Titolo:
Indentation response and cracking of sub-micron silica films on a polymeric substrate
Autore:
Andersson, R; Toth, G; Gan, L; Swain, MV;
Indirizzi:
CSIRO, Telecommun & Ind Phys, Lindfield, NSW 2070, Australia CSIRO Lindfield NSW Australia 2070 d Phys, Lindfield, NSW 2070, Australia Univ Sydney, Dept Mech & Mechatron Engn, Sydney, NSW 2006, Australia Univ Sydney Sydney NSW Australia 2006 n Engn, Sydney, NSW 2006, Australia
Titolo Testata:
ENGINEERING FRACTURE MECHANICS
fascicolo: 1, volume: 61, anno: 1998,
pagine: 93 - 105
SICI:
0013-7944(199808)61:1<93:IRACOS>2.0.ZU;2-R
Fonte:
ISI
Lingua:
ENG
Soggetto:
SPHERICAL INDENTATION; INDENTERS; STRESSES; FRACTURE; CONTACT;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Engineering, Computing & Technology
Citazioni:
15
Recensione:
Indirizzi per estratti:
Indirizzo: Swain, MV CSIRO, Telecommun & Ind Phys, Lindfield, NSW 2070, Australia CSIRO Lindfield NSW Australia 2070 ndfield, NSW 2070, Australia
Citazione:
R. Andersson et al., "Indentation response and cracking of sub-micron silica films on a polymeric substrate", ENG FRACT M, 61(1), 1998, pp. 93-105

Abstract

Indentations at low forces with small spherical tipped indenters have beenmade on physical vapour deposited (PVD) films of silica on an allyl diglycol carbonate (CR-39) polymer. Film thicknesses investigated were 320 and 80nm with indenters ranging from 0.25 to 10 mu m nominal radius. Contact pressure and effective elastic modulus of the films as a function of penetration depth of the contact diameter of the various indenters were calculated. In all instances the substrate appeared to yield prior to cracking of the film. Cracking of the films, in the form of circular cracks just outside thecontact area, was evident as a discontinuity in the force-displacement response, particularly for the smaller indenter radii. Estimates of the maximum contact stress for the onset of cracking indicated that it decreased withincreasing indenter radius. Finite element analysis was used to calculate the stress fields in the films and substrate during loading and to estimatethe extent of the plastic zone within the substrate and the fracture strength of the films. (C) 1998 Elsevier Science Ltd. All rights reserved.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 04/04/20 alle ore 08:38:53