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Titolo:
AN AUTOMATED LOADING AND UNLOADING SYSTEM FOR A MAGLEV WAFER TRANSPORT PATH
Autore:
WANG WJ; LAMB M; BUSCHVISHNIAC IJ;
Indirizzi:
UNIV TEXAS,DEPT MECH ENGN AUSTIN TX 78712
Titolo Testata:
IEEE transactions on semiconductor manufacturing
fascicolo: 3, volume: 6, anno: 1993,
pagine: 276 - 279
SICI:
0894-6507(1993)6:3<276:AALAUS>2.0.ZU;2-Y
Fonte:
ISI
Lingua:
ENG
Tipo documento:
Note
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Science Citation Index Expanded
Citazioni:
1
Recensione:
Indirizzi per estratti:
Citazione:
W.J. Wang et al., "AN AUTOMATED LOADING AND UNLOADING SYSTEM FOR A MAGLEV WAFER TRANSPORT PATH", IEEE transactions on semiconductor manufacturing, 6(3), 1993, pp. 276-279

Abstract

This article discusses an automated loading and unloading system for placing silicon wafers on a carrier. While the system has broad application, we are particularly interested in the automated loading of wafers onto a carrier which is moved along a transport path using a magnetic levitation (maglev) drive mechanism. The automated loading and unloading system consists of two parts: a wafer carrier which can move along the path and which is purely passive, and a loading and unloading device which uses vacuum and electrical power. The wafer carrier uses amagnetic clamping mechanism to prevent the wafer from sliding when the carrier moves along the path. The electromagnetic loading and unloading device is designed to firmly hold the wafer using vacuum suction and may be carried by a robot. Only the bottom surface and edge of the wafer are touched by the carrier and the loader-unloader. The loader-unloader described here, when combined with a maglev transport path, ispotentially very useful as a means of connecting the processing toolsin a cluster or connecting the workstations along a semiconductor fabrication line.

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Documento generato il 02/12/20 alle ore 05:21:10