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Titolo:
DYNAMICS OF SOLDERING REACTIONS - MICROSCOPIC OBSERVATIONS
Autore:
SINGLER TJ; CLUM JA; PRACK ER;
Indirizzi:
MOTOROLA INC,ADV PACKAGE DEV & PROTOTYPE LAB,3501 ED BLUESTEIN BLVD,POB 6000,MAIL DROP L1 AUSTIN TX 78762 MOTOROLA INC,ADV PACKAGE DEV & PROTOTYPE LAB,3501 ED BLUESTEIN BLVD,POB 6000,MAIL DROP L1 AUSTIN TX 78762 SUNY,TJ WATSON SCH ENGN,DEPT MECH & IND ENGN BINGHAMTON NY 13902
Titolo Testata:
Microscopy research and technique
fascicolo: 5-6, volume: 25, anno: 1993,
pagine: 509 - 517
SICI:
1059-910X(1993)25:5-6<509:DOSR-M>2.0.ZU;2-3
Fonte:
ISI
Lingua:
ENG
Keywords:
METALLURGICAL REACTIVITY; INTERMETALLICS; PRECURSOR FILMS; SURFACE ENERGY;
Tipo documento:
Article
Natura:
Periodico
Settore Disciplinare:
Science Citation Index Expanded
Science Citation Index Expanded
Citazioni:
22
Recensione:
Indirizzi per estratti:
Citazione:
T.J. Singler et al., "DYNAMICS OF SOLDERING REACTIONS - MICROSCOPIC OBSERVATIONS", Microscopy research and technique, 25(5-6), 1993, pp. 509-517

Abstract

This paper provides a summary of some in situ, high-resolution studies of solder spreading reactions on microelectronic circuit metallizations. Experiments are described that focus on the use of the environmental scanning electron microscope, or ESEM. Those experiments have beencomplemented by studies using optical hot-stage microscopy and have been supplemented by additional analytical tools such as energy dispersive X-ray microanalysis, Auger and ESCA to evaluate chemical processes. Two general results from dynamic scanning electron microscope observations are that 1) molten solder alloys undergo a segregation process during spreading in which a ''precursor'' film spreads in advance of the bulk solder and 2) the spreading front, which may be enriched in Snfrom Pb-Sn or Bi-Sn solders, or In from Pb-In solders, spreads along high-reactivity features of the metallization surface as a reacting ''precursor'' film. A third observation from these tests is that, in unconfined geometries, the reactive metallization, if not sufficiently thick, can be dissolved by the solder before wetting is complete, leading to dewetting of the solder. Both the kinetics and extent of spreading of these films and the relationship of these phenomena to the commonly measured contact angle and wetting forces are currently being examined by a range of complementary techniques. Information gathered in these studies shows that process temperature as well as composition, reactivity, and relative amounts of the solder and metallization species should all be factors of interest to the those responsible for controlof soldering processes. (C) 1993 Wiley-Liss, Inc.

ASDD Area Sistemi Dipartimentali e Documentali, Università di Bologna, Catalogo delle riviste ed altri periodici
Documento generato il 02/07/20 alle ore 17:31:55